DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 1 QFS Series – Socket, Vertical Orientation QMS Series – Terminal, Vertical Orientation Other configurations available for: Co-planar and perpendicular board-to board applications Rugged features / end options Packaging options See www.samtec.com for more information.
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 2
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec QFS/QMS Series 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strip connector system. All information contained in this specification is for a 10 mm mated height vertical configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
3.0 TESTING
3.1 Current Rating: 1.5 A (6 Adjacent Pins Powered)
3.1.1 Current Carrying Capacity: tested per EIA-364-70
3.1.2 Current Cycling: tested per EIA-364-55
3.2 Voltage Rating: 300 VAC
3.3 Operating Temperature Range: -55°C to +125°C
3.4 Electrical:
ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 900 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 1,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass
3.5 Mechanical:
ITEM TEST CONDITION REQUIREMENT STATUS Durability EIA-364-09C 500 cycles (30µ" Au) Pass Random Vibration EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1 microsecond Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1 microsecond Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 3
3.6 Environmental:
ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 900 VAC IR: >50,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 4
4.0 MATED SYSTEM
4.1 Mated Views
Mated view information can be found at link below: http://cloud.samtec.com/Prints/QMS-QFS%20MATED%20DOCUMENT-MKT.pdf
5.0 POLARIZING FEATURES
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair. Stack Height Single-Ended Signaling Differential Pair Signaling 10 mm 8.0 GHz/16 Gbps 8.5 GHz/17 Gbps
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 5
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Alignment Requirements:
7.1.1 Maximum guidance/capture in applications where at least one half of the interface is free to float. 7.1.2 The parts can be rigidly misaligned by no more than .005” (0,13mm) in the X- and .004” (0,10mm) in the Y-direction to ensure a good mate.
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 6 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only. 7.2.1 7.2.2
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 7 7.3 Due to variances in equipment, solder pastes and applications (board design, component densit y, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp Pb-Free Assembly Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. 7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C.
Series: QFS / QMS 0,635 mm (.025”) Q2™ High Speed Rugged Ground Plane Socket / Terminal Strips Revision: D Date: February 29, 2016 © Samtec, Inc. Page 8 7.5 Stencil Thickness: The stencil thickness is .006” (0,15mm). 7.6 Placement: Machine placement of the parts is recommended. 7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability.
7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: QXX/BXX Connector
7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.9.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff
7.9.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested
construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs 7.10 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard.
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at CES@samtec.com
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
SIG@samtec.com 8.3 For additional processing information, contact our Interconnect Processing Group at IPG@samtec.com
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at PEC@samtec.com USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MER CHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.