Q1TCAN4550-Q1

TCAN4550-Q1 TI1 | Alldatasheet

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ADVANCE□INFORMATION SCLK GPIO1 Reset MCU VCC GPIO Optional: Terminating Node Optional: Filtering, Transient and ESD Voltage Regulator (e.g. TPSxxxx) VIN VOUT VBAT MOSI MISO nCS VCCINT1 VLVRX for LP RX 2-wire CAN busSCLK TX/RX CAN-FD Controller with Filters TX/RX Data Buffer CANHTXD_INT RXD_INT LDO(s) Under VoltagePOR OSC1 OSC2 RST VIO WAKE GND Filter VSUP VINT CNTL VLVRX VCCINT2 CANL VIO VIO nCS nINT CAN-FD Transceiver VLVRX for LP RX GPIO1 INH EN SPI slave, System Controller GPIO2 GPO2 SDO SDI nWKRQGPIO3 VINT VCCOUTFLTR 300 nF 10 µF TCAN4550 OSC1 OSC2

20 MHz

Copyright © 2017, Texas Instruments Incorporated SCLK GPIO1 Reset MCU VCC GPIO Optional: Terminating Node Optional: Filtering, Transient and ESD Voltage Regulator (e.g. TPSxxxx) VIN VOUT VBAT MOSI MISO nCS VCCINT1 VLVRX for LP RX 2-wire CAN busSCLK TX/RX CAN-FD Controller with Filters TX/RX Data Buffer CANHTXD_INT RXD_INT LDO(s) Under VoltagePOR RST VIO WAKE GND Filter VSUP VINT CNTL VLVRX VCCINT2 CANL VIO VIO nCS nINT CAN-FD Transceiver VLVRX for LP RX GPIO1 INH EN SPI slave, System Controller GPIO2 GPO2 SDO SDI nWKRQGPIO3 VINT VCCOUTFLTR 300 nF 10 µF TCAN4550 OSC1 OSC2

40 MHz

Copyright © 2017, Texas Instruments Incorporated Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. TCAN4550-Q1 SLLSF56 – OCTOBER 2017 TCAN4550-Q1CANFDControllerwithIntegratedTransceiver

1 Features

1• AEC Q100: Qualified for Automotive Applications – Device Temperature: –40°C to 125°C Ambient – Device HBM Classification Level H2: ±8000 V – Device CDM Classification Level C5: ±750 V

• Standalone CAN FD Controller with Integrated CAN Transceiver and Serial Peripheral Interface (SPI)
• CAN FD Controller Supports both ISO 11898- 1_2015 and Bosch M-CAN Revision 3.2.1.1
• Meets the Requirements of ISO 11898-2_2016
• CAN FD Data Rates up to 5 Mbps with up to 20 MHz SPI Clock Speed
• Classic CAN Backwards Compatible
• Operating Modes: – Normal Mode: – CAN FD Communication up to 5 Mbps – Low Power Standby Mode and Sleep Mode
• 3.3 V to 5 V MCU Support
• Wide Operating Ranges – ±42 V Bus Fault Protection – ±12 V Common Mode
• Optimized Behavior when Unpowered – Bus and Logic Terminals are High Impedance (No Load to Operating Bus or Application) – Power Up and Down Glitch Free Operation
• Expanded Bus Fault Detection and Reporting

2 Applications

• Body Electronics and Lighting
• Infotainment and Cluster
• Passive Safety
• Industrial Transportation

3 Description

The TCAN4550-Q1 is a CAN FD Controller with integrated CAN transceiver supporting data rates up to 5 Mbps. The device interfaces with a microprocessor using the SPI interface. The CAN FD processor meets the specifications of the ISO11898- 1_2015 standard and the CAN transceiver meets the specification for High Speed CAN (Controller Area Network) Physical Layer standards: 11898-2_2016. The device can also wake up via remote wake-up using CAN bus implementing the ISO Wake Up Pattern (WUP). The device includes many protection features providing device and CAN network robustness. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TCAN4550- Q1TCAN4550-Q1 VQFN (20) 4.50 mm x 3.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematics, CLKIN from MCU Simplified Schematics, Crystal

ADVANCE□INFORMATION TCAN4550-Q1 SLLSF56 – OCTOBER 2017 www.ti.com Product Folder Links: TCAN4550-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

4 Device and Documentation Support

This device will conform to the following CAN standards. The core of what is needed is covered within this system spec, however reference should be made to these standards and any discrepancies pointed out and discussed. This document should provide all the basics of what is needed. However for a full understanding of CAN including the protocol these additional sources will be very helpful as the scope of CAN protocol in detail is outside the scope of this physical layer (transceiver) spec.

4.1 Documentation Support

4.1.1 Related Documentation

4.1.1.1 CAN Transceiver Physical Layer Standards:

• ISO 11898-2_2016: High speed medium access unit with low power mode (super sets -2 standard electrically in several specs and adds the original wake up capability via the bus in low power mode)
• ISO 8802-3: CSMA/CD – referenced for collision detection from ISO11898-2
• CAN FD 1.0 Spec and Papers
• Bosch “Configuration of CAN Bit Timing”, Paper from 6th International CAN Conference (ICC), 1999. This is repeated a lot in the DCAN IP CAN Controller spec copied into this system spec.
• GMW3122: GM requirements for HS CAN
• SAE J2284-2: High Speed CAN (HSC) for Vehicle Applications at 250 kbps
• SAE J2284-3: High Speed CAN (HSC) for Vehicle Applications at 500 kbps
• Bosch M_CAN Controller Area Network Revision 3.2.1.1 (3/24/2016)

4.1.1.2 EMC requirements:

• SAEJ2962-2: US3 requirements for CAN Transceivers (-2, -5, GM will propose updates to address -6 + FD, but this is the best place for a working start)
• HW Requirements for CAN, LIN,FR V1.3: German OEM requirements for HS CAN

4.1.1.3 Conformance Test requirements:

• HS_TRX_Test_Spec_V_1_0: GIFT / ICT CAN test requirements for High Speed Physical Layer

4.1.1.4 Community Resource

• “A Comprehensible Guide to Controller Area Network”, Wilfried Voss, Copperhill Media Corporation
• “CAN System Engineering: From Theory to Practical Applications”, 2nd Edition, 2013; Dr. Wolfhard Lawrenz, Springer.

4.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

4.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

4.4 Trademarks

E2E is a trademark of Texas Instruments.

ADVANCE□INFORMATION TCAN4550-Q1 www.ti.com SLLSF56 – OCTOBER 2017 Product Folder Links: TCAN4550-Q1 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

4.4 Trademarks (continued)

All other trademarks are the property of their respective owners.

4.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

4.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

20X (0.6) 20X (0.25) 14X (0.5) (2.2) (3.2) (4.3) 4X (0.75) (1.35) (3.3) (0.85) (R0.05) TYP 2X (0.75) 4X (0.25) (4.2) ( 0.2) TYP VIA VQFN - 1 mm max heightRGY0020C PLASTIC QUAD FLATPACK - NO LEAD 4223814/A 06/2017 SYMM 10 11 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) EXPOSED METAL ADVANCE□INFORMATION TCAN4550-Q1 SLLSF56 – OCTOBER 2017 www.ti.com Product Folder Links: TCAN4550-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

www.ti.com EXAMPLE BOARD LAYOUT 20X (0.6) 20X (0.25) 14X (0.5) (2.2) (3.2) (4.3) 4X (0.75) (1.35) (3.3) (0.85) (R0.05) TYP 2X (0.75) 4X (0.25) (4.2) ( 0.2) TYP VIA VQFN - 1 mm max heightRGY0020C PLASTIC QUAD FLATPACK - NO LEAD 4223814/A 06/2017 SYMM 10 11 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) EXPOSED METAL ADVANCE□INFORMATION TCAN4550-Q1 www.ti.com SLLSF56 – OCTOBER 2017 Product Folder Links: TCAN4550-Q1 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

www.ti.com 2-Nov-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTCAN4550RGYQ1 ACTIVE VQFN RGY 20 75 TBD Call TI Call TI -40 to 125 TCAN4550RGYQ1 PREVIEW VQFN RGY 20 75 TBD Call TI Call TI -40 to 125 TCAN4550RGYRQ1 PREVIEW VQFN RGY 20 3000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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