PZU9.1DB2

PZUXDB2_SER NEXPERIA | Alldatasheet

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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

1. Product profile

1.1 General description

Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages.

1.2 Features

1.3 Applications

n General regulation functions

1.4 Quick reference data

[1] Pulse test: tp ≤ 300 µs;δ≤ 0.02. [2] tp = 100µs; square wave; Tj=2 5°C prior to surge PZUxDB2 series Dual Zener diodes Rev. 01 — 31 March 2008 Product data sheet n Non-repetitive peak reverse power dissipation: PZSM =4 0W n Dual isolated diodes configuration n Total power dissipation: Ptot≤ 250 mW n Small standard plastic package suitable for surface-mounted design n Tolerance series: B2: approximately±2% n Small dark-green, halogen-free plastic package suitable for surface-mounted design n Wide working voltage range: nominal 2.7 V to 24 V n AEC-Q101 qualifiedTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode V F forward voltage I F = 100 mA [1] - - 1.1 V PZSM non-repetitive peak reverse power dissipation [2] --4 0 W

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. [1] The series consists of 25 types with nominal working voltages from 2.7 V to 24 V. Table 2. Pinning Table 3. Ordering information Table 4. Marking codes

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering points at pin 4 and pin 5. Table 6. Thermal characteristics Table 7. Characteristics Tj=2 5°C unless otherwise specified. Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG Tj=2 5°C unless otherwise specified.

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Tj=2 5°C unless otherwise specified.

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 31 March 2008 6 of 12 NXP Semiconductors PZUxDB2 series Dual Zener diodes Tj=2 5°C (prior to surge) T j=2 5°C Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values Fig 2. Forward current as a function of forward voltage; typical values Tj=2 5°C to 150°C PZU2.7DB2 to PZU4.3DB2 PZU2.7DB2/DG to PZU4.3DB2/DG T j=2 5°C to 150°C PZU4.7DB2 to PZU12DB2 PZU4.7DB2/DG to PZU12DB2/DG Fig 3. Temperature coefficient as a function of working current; typical values Fig 4. Temperature coefficient as a function of working current; typical values 006aab215 102 103 PZSM (W) tp (s) 10−4 10−210−3 VF (V) 0.6 1 0.8 mbg781 100 200 300 I F (mA) 06 0 20 40 IZ (mA) SZ (mV/K) 4.3 3.9 3.6 3.3 3.0 2.7 006aab216 02 0 16 mgl274 48 1 2 IZ (mA) SZ (mV/K) 4.7 9.1 8.2 7.5 6.8 6.2 5.6 5.1

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 31 March 2008 7 of 12 NXP Semiconductors PZUxDB2 series Dual Zener diodes 8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standardQ101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. Tj=2 5°C PZU2.7DB2 to PZU6.2DB2 PZU2.7DB2/DG to PZU6.2DB2/DG T j=2 5°C PZU6.8DB2 to PZU24DB2 PZU6.8DB2/DG to PZU24DB2/DG Fig 5. Working current as a function of working voltage; typical values Fig 6. Working current as a function of working voltage; typical values 006aab217 10−1 10−2 102 IZ (mA) 10−3 VZ (V) 07 564312 VZ(nom) (V) = 2.7 5.1 5.6 6.2 3.0 3.3 3.6 3.94.3 4.7 006aab218 10−1 10−2 102 IZ (mA) 10−3 VZ (V) 02 5 2010 155 7.5 248.29.110 131415 VZ(nom) (V) = 6.8

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. [1] For further information and the availability of packing methods, seeSection13. Table 9. Packing methods

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 31 March 2008 9 of 12 NXP Semiconductors PZUxDB2 series Dual Zener diodes 11. Soldering Fig 8. Reflow soldering footprint SOT353 (SC-88A) Dimensions in mm Fig 9. Wave soldering footprint SOT353 (SC-88A) sot353_fr solder resist occupied area solder lands solder paste Dimensions in mm 0.60 (1·) 0.50 (4·) 0.50 (4·) 2.65 0.40 0.90 1.20 2.40 2.102.35 solder lands solder resist occupied area 1.15 3.75 transport direction during soldering 2.652.25 2.70

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Table 10. Revision history

PZUXDB2_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 31 March 2008 11 of 12 NXP Semiconductors PZUxDB2 series Dual Zener diodes 13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data —The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors PZUxDB2 series Dual Zener diodes © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 March 2008 Document identifier: PZUXDB2_SER_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents