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NPN Complement is PZT2222AT1 The SOT-223 package can be soldered using wave or reflow SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering eliminating the possibility of damage to the die. AEC−Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb−Free Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO −60 Vdc Collector−Base Voltage VCBO −60 Vdc Emitter−Base Voltage VEBO −5.0 Vdc Collector Current − Continuous IC −600 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation (Note 1) TA = 25C PD 1.5 W mW/C Thermal Resistance Junction−to−Ambient (Note 1) R/C0113JA 83.3 C/W Lead Temperature for Soldering, 0.0625 from case Time in Solder Bath TL 260 Sec Operating and Storage Temperature Range TJ, Tstg −65 to +150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR −4 with 1 oz and 713 mm 2 of copper area. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Preferred devices are recommended choices for future use and best overall value. SOT−223 CASE 318E STYLE 1 MARKING DIAGRAM COLLECTOR 2, 4 BASE EMITTER †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Device Package Shipping †
ORDERING INFORMATION
PZT2907AT1 SOT −223 1,000 / Tape & Reel PZT2907AT1G SOT −223 (Pb−Free) 1,000 / Tape & Reel PZT2907AT3 SOT −223 4,000 / Tape & Reel AYW P2F /C0071 /C0071 P2F = Specific Device Code A = Assembly Location Y = Year W = Work Week /C0071 = Pb−Free Package http://onsemi.com (Note: Microdot may be in either location) PZT2907AT3G SOT −223 (Pb−Free) 4,000 / Tape & Reel SPZT2907AT1G SOT −223 (Pb−Free) 1,000 / Tape & Reel
PZT2907AT1, SPZT2907AT1G http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector−Base Breakdown Voltage (IC = −10 /C0109Adc, IE = 0) V(BR)CBO −60 − − Vdc Collector−Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) V(BR)CEO −60 − − Vdc Emitter−Base Breakdown Voltage (IE = −10 /C0109Adc, IC = 0) V(BR)EBO −5.0 − − Vdc Collector−Base Cutoff Current (VCB = −50 Vdc, IE = 0) ICBO − − −10 nAdc Collector−Emitter Cutoff Current (VCE = −30 Vdc, VBE = 0.5 Vdc) ICEX − − −50 nAdc Base−Emitter Cutoff Current (VCE = −30 Vdc, VBE = −0.5 Vdc) IBEX − − −50 nAdc ON CHARACTERISTICS (Note 2) DC Current Gain (IC = −0.1 mAdc, VCE = −10 Vdc) (IC = −1.0 mAdc, VCE = −10 Vdc) (IC = −10 mAdc, VCE = −10 Vdc) (IC = −150 mAdc, VCE = −10 Vdc) (IC = −500 mAdc, VCE = −10 Vdc) hFE 100 100 100 300 Collector-Emitter Saturation Voltages (IC = −150 mAdc, IB = −15 mAdc) (IC = −500 mAdc, IB = −50 mAdc) VCE(sat) −0.4 −1.6 Vdc Base-Emitter Saturation Voltages (IC = −150 mAdc, IB = −15 mAdc) (IC = −500 mAdc, IB = −50 mAdc) VBE(sat) −1.3 −2.6 Vdc DYNAMIC CHARACTERISTICS Current-Gain − Bandwidth Product (IC = −50 mAdc, VCE = −20 Vdc, f = 100 MHz) fT 200 − − MHz Output Capacitance (VCB = −10 Vdc, IE = 0, f = 1.0 MHz) Cc − − 8.0 pF Input Capacitance (VEB = −2.0 Vdc, IC = 0, f = 1.0 MHz) Ce − − 30 pF SWITCHING TIMES Turn-On Time (VCC = −30 Vdc, IC = −150 mAdc, IB1 = −15 mAdc) ton − − 45 ns Delay Time td − − 10 Rise Time tr − − 40 Turn-Off Time (VCC = −6.0 Vdc, IC = −150 mAdc, IB1 = IB2 = −15 mAdc) toff − − 100 ns Storage Time ts − − 80 Fall Time tf − − 30 2. Pulse Test: Pulse Width 300 /C0109s, Duty Cycle 2.0%.
PZT2907AT1, SPZT2907AT1G http://onsemi.com PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE N D E b e 12 3 0.08 (0003) A C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 1.5 0.059 /C0466mm inches/C0467SCALE 6:1 3.8 0.15 2.0 0.079 6.3 0.2482.3 0.091 2.3 0.091 2.0 0.079 SOLDERING FOOTPRINT* HE DIM A MIN NOM MAX MIN MILLIMETERS 1.50 1.63 1.75 0.060 INCHES A1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 D 6.30 6.50 6.70 0.249 E 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 NOM MAX L1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 HE − − 0 10 0 10 /C0113 /C0113 L STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 PZT2907AT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative