PZT2222AT1 MOTOROLA | Alldatasheet

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1Motorola Small–Signal Transistors, FETs and Diodes Device Data /C0078/C0080/C0078 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0108/C0097/C0110/C0097/C0114 /C0069/C0112/C0105/C0116/C0097/C0120/C0105/C0097/C0108 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114 This NPN Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

  • PNP Complement is PZT2907AT1
  • The SOT-223 package can be soldered using wave or reflow.
  • SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.
  • Available in 12 mm tape and reel Use PZT2222AT1 to order the 7 inch/1000 unit reel. Use PZT2222AT3 to order the 13 inch/4000 unit reel. MAXIMUM RATINGS Rating Symbol Value Unit Collector-Emitter Voltage VCEO 40 Vdc Collector-Base Voltage VCBO 75 Vdc Emitter-Base Voltage (Open Collector) VEBO 6.0 Vdc Collector Current IC 600 mAdc Total Power Dissipation up to TA = 25°C (1) PD 1.5 Watts Storage Temperature Range° Tstg – 65 to +150 °C Junction Temperature° TJ 150 °C THERMAL CHARACTERISTICS Thermal Resistance from Junction to Ambient R θJA 83.3 °C/W Lead Temperature for Soldering, 0.0625″ from case Time in Solder Bath TL 260 Sec DEVICE MARKING P1F ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) V(BR)CEO 40 — Vdc Collector-Base Breakdown Voltage (IC = 10 µAdc, IE = 0) V(BR)CBO °75° °— ° Vdc Emitter-Base Breakdown Voltage (IE = 10 µAdc, IC = 0) V(BR)EBO 6.0 — Vdc Base-Emitter Cutoff Current (VCE = 60 Vdc, VBE = – 3.0 Vdc) IBEX — 20 nAdc Collector-Emitter Cutoff Current (VCE = 60 Vdc, VBE = – 3.0 Vdc) ICEX — 10 nAdc Emitter-Base Cutoff Current (VEB = 3.0 Vdc, IC = 0) IEBO — 100 nAdc Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Order this document by PZT2222AT1/D /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA  Motorola, Inc. 1996 BASE COLLECTOR 2, 4 EMITTER /C0080/C0090/C0084/C0050/C0050/C0050/C0050/C0065/C0084/C0049 SOT-223 PACKAGE NPN SILICON TRANSISTOR SURFACE MOUNT Motorola Preferred Device CASE 318E-04, STYLE 1 TO-261AA REV 2

/C0080/C0090/C0084/C0050/C0050/C0050/C0050/C0065/C0084/C0049

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS — continued (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS (continued) Collector-Base Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 60 Vdc, IE = 0, TA = 125°C) ICBO nAdc µAdc ON CHARACTERISTICS DC Current Gain (IC = 0.1 mAdc, VCE = 10 Vdc) (IC = 1.0 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc, TA = – 55°C) (IC = 150 mAdc, VCE = 10 Vdc) (IC = 150 mAdc, VCE = 1.0 Vdc) (IC = 500 mAdc, VCE = 10 Vdc) hFE 100 300 Collector-Emitter Saturation Voltages (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VCE(sat) 0.3 1.0 Vdc Base-Emitter Saturation Voltages (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VBE(sat) 0.6 1.2 2.0 Vdc Input Impedance° (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) °hie° 2.0 0.25 8.0 1.25 kΩ Voltage Feedback Ratio (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) hre 8.0x10-4 4.0x10-4 Small-Signal Current Gain (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) /C0357hfe/C0357 300 375 Output Admittance° (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) °hoe° 5.0 200 µmhos Noise Figure (VCE = 10 Vdc, IC = 100 µAdc, f = 1.0 kHz) F — 4.0 dB DYNAMIC CHARACTERISTICS Current-Gain — Bandwidth Product (IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz) fT 300 — MHz Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) C c — 8.0 pF Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) C e — 25 pF SWITCHING TIMES (TA = 25°C) Delay Time (VCC = 30 Vdc, IC = 150 mAdc, IB(on) = 15 mAdc, VEB(off) = 0.5 Vdc) Figure 1 td — 10 ns Rise Time IB(on) = 15 mAdc, VEB(off) = 0.5 Vdc) Figure 1 tr — 25 Storage Time (VCC = 30 Vdc, IC = 150 mAdc, IB(on) = IB(off) = 15 mAdc) Figure 2 ts — 225 ns Fall Time IB(on) = IB(off) = 15 mAdc) Figure 2 tf — 60

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

subjected to a solder reflow process. soldering to a pad size given for maximum power dissipation. versus collector pad area is shown in Figure 3.

0.8 Watts

Figure 3. Thermal Resistance versus Collector

or stainless steel with a typical thickness of 0.008 inches.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
  • The soldering temperature and time should not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On m achines controlled by a compute r, the computer remembers these profiles from one operating session to the next. Figure 4 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the therma l energy m ore efficiently, then distributes this energy to the components. Because of this effect, the m ain body of a componen t may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 VENT “SOAK” STEP 3 HEATING ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 200°C 150°C 100°C 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX SOLDER IS LIQUID FOR

40 TO 80 SECONDS

Figure 4. Typical Solder Heating Profile

/C0080/C0090/C0084/C0050/C0050/C0050/C0050/C0065/C0084/C0049

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR H S F A B D G L 1 2 3 0.08 (0003) C M K J DIM A MIN MAX MIN MAX MILLIMETERS 0.249 0.263 6.30 6.70 INCHES B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1.05 M 0 10 0 10 S 0.264 0.287 6.70 7.30 /C0095 /C0095 /C0095 /C0095 CASE 318E–04 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 T atsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 PZT2222AT1/D /C0042/C0080/C0090/C0084/C0050/C0050/C0050/C0050/C0065/C0084/C0049/C0047/C0068/C0042