SZMM5Z8V2-Q1 TI | Alldatasheet
Document overview
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Technical content
SZMM5Zx-Q1 Zener Voltage Regulator Diode in SOD-523
1 Features
- Low I/O capacitance – 75pF (max)
- Low leakage current – <500nA (max)
- AEC-Q101 qualified
- Temperature range: –55°C to +150°C
- Leaded package used for automatic optical inspection (AOI)
2 Applications
- Voltage regulation
- Over-voltage protection
3 Description
The SZMM5Zx-Q1 is a single channel Zener diode in a SOD-523 package.
Package Information
PART NUMBER PACKAGE (1) PACKAGE SIZE (2) SZMM5Zx-Q1 DYA (SOD-523, 2) 1.60mm × 0.80mm (1) For more information, see Section 9. (2) The package size (length × width) is a nominal value and includes pins, where applicable. Anode Cathode Figure 3-1. Functional Block Diagram ADVANCE INFORMATION SZMM5Z8V2 SLVSI64 – NOVEMBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
9 Mechanical, Packaging, and Orderable Information....4 SZMM5Z8V2 SLVSI64 – NOVEMBER 2024 www.ti.com
2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: SZMM5Z8V2 ADVANCE INFORMATION
4 Pin Configuration and Functions
Figure 4-1. DYA Package, 2-Pin SOD-523 (Top View) Table 4-1. Pin Functions PIN
DESCRIPTION
NAME NO. C 1 Cathode A 2 Anode
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT TA Ambient Operating Temperature -55 150 °C Tstg Storage Temperature -65 155 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
5.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Vf Forward Voltage IF = 10mA 0.9 V TA Operating free-air temperature -55 150 °C 5.3 Electrical Characteristics_8.2v At TA=25℃ (unless otherwise noted) (1) PARAMETER TEST CONDITION MIN TYP MAX UNIT VZ Zener Voltage @IZT 5mA 7.79 8.2 8.61 V ZZT Zener Impedance @IZT 5mA 2 10 Ω IR Leakage Current IR @ VR 5.75v 500 nA ΘVZ Temp Coeff. @IZT 5mA 3.2 6.2 mV/C CD Diode capacitance VR=0, f=1MHz 75 pF (1) Typical parameters are measured at 25℃ www.ti.com SZMM5Z8V2 SLVSI64 – NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: SZMM5Z8V2 ADVANCE INFORMATION
6 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
6.1 Application Information
The SZMM5Zx-Q1 is a single channel Zener diode that can be used for applications such as voltage regulation and over-voltage protection.
7 Device and Documentation Support
7.1 Documentation Support
7.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
7.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
7.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
7.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES November 2024 * Initial Release
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. SZMM5Z8V2 SLVSI64 – NOVEMBER 2024 www.ti.com
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Product Folder Links: SZMM5Z8V2 ADVANCE INFORMATION
www.ti.com 21-Nov-2024 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PZMM5Z8V2DYARQ1 ACTIVE SOT-5X3 DYA 2 3000 TBD Call TI Call TI -55 to 150 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
www.ti.com PACKAGE OUTLINE C 1.7 1.5 2X 0.35 0.25 2X 0.4 0.2
0.77 MAX
2X 0.15 0.08 2X 0.3 0.1 0.7
0.5 TYP
B 1.3 1.1 A 0.85 0.75 NOTE 3 SOT (SOD-523) - 0.77 mm max heightDYA0002A PLASTIC SMALL OUTLINE 4224978/B 09/2021 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEITA SC-79 registration except for package height 1 2 PIN 1 ID AREA SEATING PLANE 0.05 C
0.1 C A B
0.05 SYMM SYMM
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
0.05 MIN
2X (0.4) (R0.05) TYP2X (0.67) (1.48) 4224978/B 09/2021 SOT (SOD-523) - 0.77 mm max heightDYA0002A PLASTIC SMALL OUTLINE NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:40X SYMM 1 2 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDERMASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN 2X (0.67) 2X (0.4) (R0.05) TYP (1.48) SOT (SOD-523) - 0.77 mm max heightDYA0002A PLASTIC SMALL OUTLINE 4224978/B 09/2021 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X SYMM SYMM 1 2
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