PUSB3FA0 NEXPERIA | Alldatasheet
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Technical content
ESD protection for ultra high-speed interfaces Rev. 1 — 1 February 2018 Product data sheet
1 Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed USB, High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD). The device includes four high-level ESD protection diode structures for ultra high-speed signal lines and is encapsulated in a leadless small DFN2510A-10 (SOT1176-1) plastic package. All signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.5 pF. These diodes utilize a unique snap-back structure in order to provide protection to downstream components from ESD voltages up to ±10 kV contact exceeding IEC 61000-4-2, level 4.
1.2 Features and benefits
- System ESD protection for USB 2.0 and SuperSpeed USB 3.1, HDMI 2.0, DisplayPort, eSATA and LVDS
- All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±10 kV exceeding IEC 61000-4-2, level 4
- Matched 0.5 mm trace spacing
- Signal lines with ≤ 0.05 pF matching capacitance between signal pairs
- Line capacitance of only 0.5 pF for each channel
- Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
- TVs and monitors
- DVD recorders and players
- Notebooks, main board graphic cards and ports
- Set-top boxes and game consoles
2 Pinning information
Table 1. Pinning
1 CH1 channel 1 ESD protection
2 CH2 channel 2 ESD protection
3 GND ground
4 CH3 channel 3 ESD protection
5 CH4 channel 4 ESD protection
8 GND ground
3 Ordering information
Table 2. Ordering information
4 Marking
Table 3. Marking codes
5 Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
- contact discharge -10 +10 kV VESD electrostatic discharge voltage
- air discharge -15 +15 kV Tamb ambient temperature -40 +85 °C Tstg storage temperature -55 +125 °C [1] All pins to ground.
6 Characteristics
Table 5. Characteristics Tamb = 25 °C unless otherwise specified.
- positive transient - 0.41 - Ω
- negative transient - 0.26 - Ω TLP [3]
- positive transient - 0.43 - Ω rdyn dynamic resistance
- negative transient - 0.28 - Ω IPP = 5.2 A [2]
- positive transient - 4.6 - V IPP = -4.4 A [2] VCL clamping voltage
- negative transient - -2.2 - V [1] This parameter is guaranteed by design. [2] According to IEC 61000-4-5 (8/20 μs current waveform). [3] 100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 80 ns.
7 Application information
buses such as HDMI, DisplayPort, eSATA and LVDS data lines. current sources like, for example, a battery.
8 Package outline
Table 6. Package outline Figure 15. Package outline DFN2510A-10 (SOT1176-1)
9 Soldering
Table 7. Soldering Stencil of 75 m is recommended. Figure 16. Reflow soldering footprint DFN2510A-10 (SOT1176-1)
Table 8. Revision history
ESD protection for ultra high-speed interfaces Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © Nexperia B.V. 2018. All rights reserved. For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com Date of release: 1 February 2018 Document identifier: PUSB3FA0