PUMX2 PHILIPS | Alldatasheet

Document overview

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Technical content

  1. Product profile

1.1 General description

NPN/NPN general-purpose double transistors in a small SOT363 (SC-88) Surface Mounted Device (SMD) plastic package.

1.2 Features

■ Simplifies circuit design ■ Reduces component count ■ Reduces pick and place costs

1.3 Applications

■ General-purpose switching and amplification

1.4 Quick reference data

  1. Pinning information PUMX2 NPN/NPN general-purpose double transistors Rev. 01 — 10 November 2005 Product data sheet Table 1: Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per transistor V CEO collector-emitter voltage open base - - 50 V IC collector current - - 150 mA hFE DC current gain V CE =6V ; IC = 1 mA 120 250 560 Table 2: Pinning Pin Description Simplified outline Symbol 1 emitter TR1 2 emitter TR2 3 base TR2 4 collector TR2 5 base TR1 6 collector TR1 13 2 456 006aaa653 TR1 TR2 123 456

PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 2 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 3. Ordering information 4. Marking [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Table 3: Ordering information Type number Package Name Description Version PUMX2 SC-88 plastic surface mounted package; 6 leads SOT363 Table 4: Marking codes Type number Marking code[1] PUMX2 Z1* Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor V CBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector - 7 V IC collector current - 150 mA ICM peak collector current single pulse; tp ≤ 1m s - 200 mA IBM peak base current single pulse; tp ≤ 1m s - 100 mA Ptot total power dissipation Tamb ≤ 25 °C [1] - 180 mW Per device P tot total power dissipation Tamb ≤ 25 °C [1] - 300 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C

PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 3 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor R th(j-a) thermal resistance from junction to ambient in free air [1] - - 694 K/W Per device R th(j-a) thermal resistance from junction to ambient in free air [1] - - 417 K/W Table 7: Characteristics Tamb =2 5°C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor I CBO collector-base cut-off current VCB =6 0V ; IE = 0 A - - 100 nA VCB =6 0V ; IE =0A ; Tj= 150°C --5 0 µA IEBO emitter-base cut-off current VEB =7V ; IC = 0 A - - 100 nA hFE DC current gain VCE =6V ; IC = 1 mA 120 250 560 VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA - - 250 mV fT transition frequency VCE =1 2V ; IE = 2 mA; f = 100 MHz 100 - - MHz C c collector capacitance VCB =1 2V ; IE =ie =0A ; f = 1 MHz --3 p F

PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 4 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, seeSection16. [2] T1: normal taping [3] T2: reverse taping Fig 1. Package outline SOT363 (SC-88) 04-11-08Dimensions in mm 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 465 Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PUMX2 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2[3] -125 -165

PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 5 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 10. Soldering Dimensions in mm Fig 2. Reflow soldering footprint SOT363 (SC-88) Dimensions in mm Fig 3. Wave soldering footprint SOT363 (SC-88) MSA432 solder lands solder resist occupied area solder paste 1.20 2.40 0.50 (4·) 0.40 (2·) 0.90 2.10 0.50 (4·) 0.60 (2·) 2.35 2.65 solder lands solder resist occupied area MSA426 1.15 3.75 transport direction during soldering 1.000.30 4.004.50 5.25

PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 6 of 8 Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 11. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes PUMX2_1 20051110 Product data sheet - - -

Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors PUMX2_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 10 November 2005 7 of 8 12. Data sheet status [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. Definitions Short-form specification —The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 14. Disclaimers Life support —These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes —Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 15. Trademarks Notice —All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).

© Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 10 November 2005 Document number: PUMX2_1 Published in The Netherlands Philips Semiconductors PUMX2 NPN/NPN general-purpose double transistors 17. Contents