PUMH10 PHILIPS | Alldatasheet

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Product specification Supersedes data of 2001 Oct 22

2003 Oct 20

PEMH10; PUMH10 NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ ,R 2=4 7kΩ

2003 Oct 20 2

Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10

FEATURES

  • Built-in bias resistors
  • Simplified circuit design
  • Reduction of component count
  • Reduced pick and place costs.

APPLICATIONS

  • Low current peripheral driver
  • Replacement of general purpose transistors in digital
  • Control of IC inputs. QUICK REFERENCE DATA

DESCRIPTION

NPN/NPN resistor-equipped transistors (see “Simplified outline, symbol and pinning” for package details). SYMBOL PARAMETER TYP. MAX. UNIT VCEO collector-emitter voltage − 50 V IO output current (DC)− 100 mA TR1 NPN −−− TR2 NPN −−− R1 bias resistor 2.2 − kΩ R2 bias resistor 47 − kΩ PRODUCT OVERVIEW Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. TYPE NUMBER PACKAGE MARKING CODE PNP/PNP COMPLEMENT NPN/PNP COMPLEMENTPHILIPS EIAJ PEMH10 SOT666 10 PEMB10 PEMD10 PUMH10 SOT363 SC-88 H*0 (1) PUMB10 PUMD10 SIMPLIFIED OUTLINE, SYMBOL AND PINNING TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL PINNING PIN DESCRIPTION PEMH10 1 emitter TR1 PUMH10 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 handbook, halfpage MHC650 123 46 5 Top view 654 123 TR1 TR2 R1 R2

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Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10

ORDERING INFORMATION

In accordance with the Absolute Maximum Rating System (IEC 60134). Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION PEMH10 − plastic surface mounted package; 6 leads SOT666 PUMH10 − plastic surface mounted package; 6 leads SOT363 SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor V CBO collector-base voltage open emitter − 50 V VCEO collector-emitter voltage open base − 50 V VEBO emitter-base voltage open collector − 10 V VI input voltage positive − +12 V negative −− 5V IO output current (DC) − 100 mA ICM peak collector current − 100 mA Ptot total power dissipation T amb ≤ 25 °C SOT363 note 1 − 200 mW SOT666 notes 1 and 2 − 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Per device Ptot total power dissipation T amb ≤ 25 °C SOT363 note 1 − 300 mW SOT666 notes 1 and 2 − 300 mW

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Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10 THERMAL CHARACTERISTICS Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS T amb =2 5°C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Per transistor R th j-a thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 note 1 625 K/W SOT666 notes 1 and 2 625 K/W Per device R th j-a thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 note 1 416 K/W SOT666 notes 1 and 2 416 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor I CBO collector-base cut-off current VCB =5 0V ; IE =0 −− 100 nA ICEO collector-emitter cut-off current VCE =3 0V ; IB =0 −− 1 µA VCE =3 0V ; IB = 0; Tj= 150°C −− 50 µA IEBO emitter-base cut-off current V EB =5V ; IC =0 −− 180 µA hFE DC current gain V CE =5V ; IC = 10 mA 100 −− VCEsat collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA −− 100 mV Vi(off) input-off voltage I C = 100µA; VCE =5V − 0.6 0.5 V Vi(on) input-on voltage I C = 5 mA; VCE = 0.3 V 1.1 0.75 − V R1 input resistor 1.54 2.2 2.86 k Ω resistor ratio 17 21 26 C c collector capacitance I E =ie = 0; VCB = 10 V; f = 1 MHz−− 2.5 pF

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Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10 PACKAGE OUTLINES UNIT b p cD E e1 H E Lp w REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 01-01-04 01-08-27 IEC JEDEC EIAJ mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 DIMENSIONS (mm are the original dimensions) 0.3 0.1 SOT666 bp pin 1 index D e A Lp detail X H E EA S 0 1 2 mm scale A 0.6 0.5 c X 123 456 Plastic surface mounted package; 6 leads SOT666 YS w M A

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Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10 REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT363 SC-88 wB Mbp D e pin 1 index A Lp Q detail X H E E v M A AB y 0 1 2 mm scale c X 13 2 456 Plastic surface mounted package; 6 leads SOT363 UNIT A 1 max bp cD E e1 H E Lp Qy wv mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 97-02-28

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Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 2.2 kΩ , R2 = 47 kΩ PEMH10; PUMH10 DATA SHEET STATUS Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. LEVEL DATA SHEET STATUS (1) PRODUCT STATUS (2)(3) DEFINITION I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

© Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 Printed in The Netherlands R75/02/pp8 Date of release:2003 Oct 20 Document order number: 9397 750 11874