PU2BM TSC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 5

Technical content

PU2BM – PU2DM Taiwan Semiconductor

1 Version: B2103

2A, 100V - 200V Ultra Fast Surface Mount Rectifier

FEATURES

  • Planar technology
  • Ideal for automated placement
  • Low reverse leakage
  • Moisture sensitivity level: level 1, per J-STD-020
  • RoHS Compliant
  • Halogen-free according to IEC 61249-2-21

APPLICATIONS

  • DC to DC converter
  • Switching mode converters and inverters
  • Freewheeling application MECHANICAL DATA
  • Case: Micro SMA
  • Molding compound meets UL 94V-0 flammability rating
  • Terminal: Matte tin plated leads, solderable per J-STD-002
  • Meet JESD 201 class 2 whisker test
  • Polarity: Indicated by cathode band
  • Weight: 0.006g (approximately) KEY PARAMETERS PARAMETER VALUE UNIT IF 2 A VRRM 100 - 200 V IFSM 28 A TJ MAX 175 °C Package Micro SMA Micro SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL PU2BM PU2DM UNIT Marking code on the device P7 P8 Repetitive peak reverse voltage VRRM 100 200 V Reverse voltage, total rms value VR(RMS) 70 140 V Forward current IF 2 A Surge peak forward current, single half sine-wave superimposed on rated load t = 8.3ms IFSM 28 A t = 1.0ms 52 A Junction temperature TJ -55 to +175 °C Storage temperature TSTG -55 to +175 °C

PU2BM – PU2DM Taiwan Semiconductor

2 Version: B2103

Junction-to-lead thermal resistance RӨJL 28 °C/W Junction-to-ambient thermal resistance RӨJA 60 °C/W Junction-to-case thermal resistance RӨJC 34 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT Forward voltage (1) IF = 1A, TJ = 25°C VF 0.90 - V IF = 2A, TJ = 25°C 0.99 1.05 V IF = 1A, TJ = 125°C 0.76 - V IF = 2A, TJ = 125°C 0.84 0.90 V Reverse current @ rated VR (2) TJ = 25°C IR - 1 µA TJ = 125°C - 15 µA Reverse recovery time IF = 0.5A, IR = 1.0A, Irr = 0.25A trr - 25 ns IF = 1.0A, di/dt = 50 A/µs, VR = 30V 36 - ns Reverse recovery current IF = 2.0A, di/dt = 200 A/µs, VR = 100V IRM 3.8 - A Reverse recovery charge Qrr 57 - nC Reverse recovery time trr 28 - ns Junction capacitance 1MHz, VR = 4.0V CJ 18 - pF Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE(1) PACKAGE PACKING PU2xM Micro SMA 12,000 / Tape & reel Notes: 1. “x” defines voltage from 100V(PU2BM) to 200V(PU2DM)

PU2BM – PU2DM Taiwan Semiconductor

3 Version: B2103

(TA = 25°C unless otherwise noted) Fig.5 Typical Transient Thermal Impedance 0.01 0.1 100 Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics 0.5 1.5 2.5 25 50 75 100 125 150 175 100 1 10 100 f=1.0MHz Vsig=50mVp-p 0.0001 0.001 0.01 0.1 10 20 30 40 50 60 70 80 90 100 TJ=25°C TJ=125°C TJ=175°C 0.1 Pulse width 300μs 1% duty cycle TJ=25°C TJ=125°C TJ=-55°C TJ=175°C CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) INSTANTANEOUS FORWARD CURRENT (A) (A) 0.001 0.01 0.1 Pulse width TJ=25°C TJ=125°C UF1DLW FORWARD VOLTAGE (V) AVERAGE FORWARD CURRENT (A) REVERSE VOLTAGE (V) LEAD TEMPERATURE (°C) PULSE DURATION (s) TRANSIENT THERMAL IMPEDANCE (°C/W)

PU2BM – PU2DM Taiwan Semiconductor

4 Version: B2103

PACKAGE OUTLINE DIMENSIONS Micro SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N = Marking Code YW = Data Code

PU2BM – PU2DM Taiwan Semiconductor

5 Version: B2103

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use o f TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property righ ts is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life -saving, or life -sustaining app lications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.