TX73H32 TI | Alldatasheet
Document overview
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Technical content
TX73H32 3-Level, 32-Channel Transmitter with On-Chip Beamformer, T/R Switch
1 Features
- Transmitter supports: – 32-channel 3-level pulser and active transmit/ receive (T/R) switch
- 3-level pulser: – Maximum output voltage: ±100V – Minimum output voltage: ±1V – Maximum output current: 2A – True return to zero to discharge output to ground – Second harmonic of –40dBc at 5MHz – –3-dB Bandwidth with 220Ω || 220pF load
- 22MHz for a ±100V supply – Very low receive power: 0.2mW/ch
- Active transmit/receive (T/R) switch with: – Turn on resistance of 13Ω – Turn on and Turn off time: 100ns – Transient glitch: 10mVPP
- On-chip beam former with: – Channel based T/R switch on and off controls – Delay resolution: half beamformer clock period, minimum 2.5ns – Maximum delay: 214 beamformer clock period – Maximum beamformer clockspeed: 200MHz – On-Chip RAM for pattern and delay profile – One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels – Global repeat feature present, enabling long- duration patterns
- High-speed (400MHz maximum), 2-lane LVDS serial programming interface. – Low programming time: ≈1.5µs for delay profile update – 32-bit Checksum to detect wrong SPI writes
- Supports CMOS serial programming interface (50MHz maximum)
- High-reliability features: – Internal temperature sensor and automatic thermal shutdown – No specific power sequencing requirement – Error flag register to detect faulty conditions – Integrated passives for the floating supplies and bias voltages – Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
2 Applications
- Ultrasound imaging system
- Piezoelectric driver
- In-probe ultrasound imaging
3 Description
TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies. TX73H32 has a pulser circuit that generates three- level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A. Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) TX73H32 FC-BGA-196 12.0mm × 12.0mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable Thermal Shutdown High Speed SPI Interface with Error Detection Pattern Profile Delay Profile Floating Supply Pulser 3-level Pulser Temperature Sensor On-chip Transmit Beamforming T/R SwitchIntegrated Passives Error Flag Register T/R Switch Pulser Pulser Pulser OUT_1 RX_1 OUT_2 RX_2 OUT_31 RX_31 OUT_32 RX_32 T/R Switch T/R Switch Simplified Block Diagram ADVANCE INFORMATION TX73H32 SBASB48 – JUNE 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
6 Mechanical, Packaging, and Orderable Information....3 TX73H32 SBASB48 – JUNE 2024 www.ti.com
2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TX73H32 ADVANCE INFORMATION
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
4.1 Documentation Support
PRT Pulse Repetition Time. Represent TR_BF_SYNC period PRF Pulse Repetition Frequency. Represent TR_BF_SYNC frequency Receive Mode Duration in which T/R switch of all the channels are in ON state High Voltage Supplies AVDDP_HV and AVDDM_HV are collectively referred as high voltage supplies Low Voltage Supplies AVDDP_5, AVDDM_5, and AVDDP_1P8 supplies are collectively referred as low voltage supplies SPI Serial program interface
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
4.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
4.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES June 2024 * Initial Release
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TX73H32 SBASB48 – JUNE 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TX73H32 ADVANCE INFORMATION
www.ti.com PACKAGE OUTLINE12.111.9 12.111.9 1.321 MAX0.3930.293 196X 0.50.410.4 TYP
10.4 TYP
0.8 TYP0.8 TYP (0.8)(0.8) (0.448) FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY BALL A1CORNER0.1 C 0.2 CSEATING PLANE0.2 C 0.15C A B0.08C SYMM SYMM 1A23456 7891011 12 13BCDEFGHJKLMN P SCALE 1.200 AB C TX73H32 SBASB48 – JUNE 2024 www.ti.com
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www.ti.com EXAMPLE BOARD LAYOUT 0.07 MAXALL AROUND0.07 MINALL AROUND (0.8) TYP(0.8) TYP196X (0.4) (0.4)METAL EDGE(0.4)SOLDER MASKOPENING FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE: 8XSYMM SYMM A1234567 8910 111213 14BCDEFGHJKLMNP EXPOSED METALSOLDER MASKOPENINGMETAL UNDERSOLDER MASKEXPOSED METALNOT TO SCALESOLDER MASK DETAILSNON-SOLDER MASKDEFINED(PREFERRED)SOLDER MASKDEFINED www.ti.com TX73H32 SBASB48 – JUNE 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TX73H32 ADVANCE INFORMATION
www.ti.com EXAMPLE STENCIL DESIGN (0.8) TYP(0.8) TYP196X (0.4) FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY 4226793/B 07/2021NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCILSCALE: 8XSYMM SYMM A1234567 8910 111213 14BCDEFGHJKLMNP TX73H32 SBASB48 – JUNE 2024 www.ti.com
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Product Folder Links: TX73H32 ADVANCE INFORMATION
6.1 Package Option Addendum
Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4) (5) TX73H32A CP ACTIVE FCCSP ACP 196 189 RoHS & Green SNAGCU Level-3-26 0C-168 HR 0°C to 70°C TX73H32 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. www.ti.com TX73H32 SBASB48 – JUNE 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TX73H32 ADVANCE INFORMATION
www.ti.com 1-Jul-2024 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTX73H32ACP ACTIVE FCCSP ACP 196 160 TBD Call TI Call TI 0 to 70 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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