PTS0603 EATON | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 6
Technical content
- Positive temperature coefficient (PTC)
- Surface mount resettable fuse
- Low resistance
- Compact 0603 (1608 metric) footprint
- Voltage rating 6 V to 15 V
- Current rating from 0.04 A to 0.35 A
- Fast time-to-trip
Applications
- Data ports
- Micromotors and fans
- Low voltage test and measurement
- Low voltage hand held equipment
- PC-based medical equipment
- USB protection
- Secondary Li-ion battery protection
- Game consoles, set top boxes
- Battery charging & charging connections PTS0603 SMD PTC fuses Agency information
- cURus Recognized file no. E343021
- TUV: File R 50506608 Part number system/ordering: PTS060315V004
- PT= PTC resettable fuse
- S= Surface mount
- 0603= Dimension code
- 15V= Maximum voltage
- 004= Ihold current rating (004= 0.04 A) Environmental compliance Pb HALOGEN HFFREE
www.eaton.com/electronics Product specifications Vmax1 lmax2 lhold3 ltrip4 Pd5 Time-to-trip (maximum) Resistance6 Safety approvals Part number (Vdc) (A) (A) (A) typical (W) (A) (seconds) Initial (Ri) minimum (Ω) Post trip (R1) maximum (Ω) cU us TUV Dimensions–mm 1. Vmax: Maximum continuous voltage the device can withstand without damage at rated current 2. Imax: Maximum fault current the device can withstand without damage at rated voltage 3. Ihold: Maximum current the device will pass without interruption at +23 °C still air 4. Itrip: Minimum current that will transition the device from low resistance to high resistance at +23 °C still air 5. Pd: Power dissipated from the device when in tripped state at +23 °C still air 6. R i: Minimum resistance of the device at +23 °C R1: Maximum resistance of the device one hour after tripping at +23 °C Part number A typ A max B typ B max C typ C max D min F G H R Recommended pad layout No marking
www.eaton.com/electronics General specifications Operating temperature: -40 °C to + 85 °C (with derating) Storage temperature: -10 °C to + 40 °C Storage relative humidity: ≤70% Storage conditon: Keep away form corrosive atmosphere and sunlight Passive aging: IEC60738-1, +85 °C, 1000 hours, ≤20% Humidity aging: +85 °C, 85% RH, 100 hours, ≤20% Thermal shock: IEC60738-1, +85 °C/ -40 °C, 20 cycles, ≤50% Trip cycle life: UL1434, Vmax, Imax, 100 cycles, no arcing or burning Trip endurance: UL1434, Vmax, Itrip ≤ I ≤ Imax, 2 hours, no arcing or burning MSL test: J-STD-020, MSL=1, pass and no visible damage Thermal derating curve PTS0603 T emperature (°C) Percentage of rated current
www.eaton.com/electronics W F D1 P1 D0 P0 P2 A A B B SECTION B-B SECTION A-A T W F E1 E2 P0 P1 P2 D0 D1 A0 B0 K0 T Packaging information PTS0603xxV004-xxV020 Supplied in tape and reel packaging, 5000 parts per 7 .0” (178 mm) diameter reel (EIA-481 compliant) PTS06036V035 Supplied in tape and reel packaging, 5000 parts per 7 .0” (178 mm) diameter reel (EIA-481 compliant) PTS0603xxV004-xxV020 W F E1 E2 P0 P1 P2 D0 D1 A0 B0 K0 T PTS06036V035
www.eaton.com/electronics Wave solder profile Reference EN 61760-1:2006 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat • Temperature min. (T smin) 100 °C 100 °C
- Temperature typ. (Tstyp) 120 °C 120 °C
- Temperature max. (Tsmax) 130 °C 130 °C
- Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds ∆ preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25°C to 25°C 4 minutes 4 minutes Manual solder +350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended Temperature Time Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area
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Cleveland, OH 44122 United States Eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. ELX1046 BU-ELX21046 June 2021 PTS0603 SMD PTC fuses Technical Data ELX1046 Effective June 2021 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm) 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) Free Solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C
- Temperature max. (Tsmax) 150 °C 200 °C
- Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.