PTPS22998RYZR

TPS22998_V01 TI | Alldatasheet

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Technical content

TPS22998 5.5-V, 10-A, 4-mΩ On-Resistance Load Switch

1 Features

• Input operating voltage range (VIN): 0.2 V–5.5 V
• Bias voltage range: 2.2 V–5.5 V
• Maximum continuous current: 10 A
• ON-Resistance (RON): 4 mΩ (typ.)
• Adjustable slew rate with tri-state pin
• Quick Output Discharge (QOD): 50 Ω
• Thermal shutdown
• Low power consumption: – ON state (IQ): 15 μA (typ.) – OFF state (ISD): 3 μA (typ.)

2 Applications

• Solid state drive
• PC and notebooks
• Industrial PC
• Optical module

3 Description

The TPS22998 is a single-channel load switch that provides a configurable rise time to minimize inrush current. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.2 V to 5.5 V and can support a maximum continuous current of 10 A. The switch is controlled by an on and off input (ON), which is capable of interfacing directly with low voltage control signals (V IH = 0.9 V). The TPS22998 has a fixed quick output discharge when switch is turned off, pulling the output down to ground. The TPS22998 is available in a 1.5 × 2.0 mm, 0.5 mm pitch, 10-pin WQFN package (RYZ) and is characterized for operation over the free-air temperature range of –40°C to +105°C. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) TPS22998 WQFN (10) 1.5 × 2.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. TPS22998 Block Diagram TPS22998 Typical Application TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

11.1 Receiving Notification of Documentation Updates.. 16

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (October 2021) to Revision A (December 2021) Page TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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5 Pin Configuration and Functions

Figure 5-1. TPS22998 RYZ Package, 10-Pin WQFN (Top View) Table 5-1. Pin Functions PIN I/O(1) DESCRIPTION NAME NO. VBIAS 1 I Device bias supply VIN 2, 3, 4 I Switch input GND 5 G Device ground VOUT 6, 7, 8 O Switch output CT 9 I Slew rate control – can be pulled up, left floating, or tie to ground ON 10 I Enable pin (1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power. www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPS22998

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VIN Input Voltage –0.3 6 V VBIAS Bias Voltage –0.3 6 V VON, VCT Control Pin Voltage –0.3 6 V IMAX Maximum Current 10 A TJ Junction temperature Internally Limited °C Tstg Storage temperature –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1) ±2000 V Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input Voltage 0.2 5.5 V VBIAS Bias Voltage 2.2 5.5 V VCT Control Pin Voltage 0 5.5 V TA Ambient Temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC (1) TPS22998 UNITRYZ (WQFN)

10 PINS

RθJA Junction-to-ambient thermal resistance 84.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 77.5 °C/W RθJB Junction-to-board thermal resistance 16.6 °C/W ΨJT Junction-to-top characterization parameter 4.0 °C/W YJB Junction-to-board characterization parameter 16.0 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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6.5 Electrical Characteristics (VBIAS = 5 V)

Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT Power Consumption ISD,VBIA S VBIAS Shutdown Current ON = 0 V 25°C 3 uA –40°C to 85°C 5 uA –40°C to 105°C 6 uA IQ,VBIAS VBIAS Quiescent Current ON > VIH 25°C 15 uA –40°C to 85°C 20 uA –40°C to 105°C 20 uA ISD,VIN VIN Shutdown Current ON = 0 V 25°C 0.1 uA –40°C to 85°C 1 uA –40°C to 105°C 2 uA ION ON pin leakage ON = VBIAS –40°C to 105°C 0.1 uA Performance RON On-Resistance VIN = 0.2 V to 5 V 25°C 4 mΩ –40°C to 85°C 6 mΩ –40°C to 105°C 7 mΩ VIH Turn on threshold, rising –40°C to 105°C 0.765 0.9 1.035 V VIL Turn off threshold, falling –40°C to 105°C 0.595 0.7 0.805 V VON, HYST ON pin hysteresis –40°C to 105°C 0.2 V tON,DEG LITCH On pin deglitch time –40°C to 105°C 2 5 7 us RQOD QOD Resistance VOUT = VIN 25°C 50 Ω –40°C to 105°C 40 60 Ω Protection TSD Thermal Shutdown - 130 150 180 °C TSDHYS Thermal Shutdown Hysteresis - 20 °C 6.6 Electrical Characteristics (VBIAS = 3.3 V) Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT Power Consumption ISD,VBIA S VBIAS Shutdown Current ON = 0 V 25°C 3 uA –40°C to 85°C 5 uA –40°C to 105°C 5 uA IQ,VBIAS VBIAS Quiescent Current ON > VIH 25°C 15 uA –40°C to 85°C 20 uA –40°C to 105°C 20 uA ISD,VIN VIN Shutdown Current ON = 0 V 25°C 0.1 uA –40°C to 85°C 1 uA –40°C to 105°C 3 uA ION ON pin leakage ON = VBIAS –40°C to 105°C 0.1 1 uA Performance www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPS22998

6.6 Electrical Characteristics (VBIAS = 3.3 V) (continued) Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT RON On-Resistance VIN = 0.2 V to 3.3 V 25°C 4 mΩ –40°C to 85°C 7 mΩ –40°C to 105°C 7 mΩ VIH ON pin turn on threshold, rising –40°C to 105°C 0.765 0.9 1.035 V VIL ON pin turn off threshold, falling –40°C to 105°C 0.595 0.7 0.805 V VON, HYST ON pin hysteresis –40°C to 105°C 0.2 V tON,DEG LITCH On pin deglitch time –40°C to 105°C 2 5 6.5 us RQOD QOD Resistance VOUT = VIN 25°C 50 Ω –40°C to 105°C 40 60 Ω Protection TSD Thermal Shutdown - 130 150 180 °C TSDHYS Thermal Shutdown Hysteresis - 20 °C 6.7 Electrical Characteristics (VBIAS = 2.2 V) Over operating free-air temperature range (unless otherwise noted). Typical values are at TA = 25°C. PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT Power Consumption ISD,VBIA S VBIAS Shutdown Current ON = 0 V 25°C 3 uA –40°C to 85°C 5 uA –40°C to 105°C 5 uA IQ,VBIAS VBIAS Quiescent Current ON > VIH 25°C 15 uA –40°C to 85°C 20 uA –40°C to 105°C 20 uA ISD,VIN VIN Shutdown Current ON = 0 V 25°C 0.1 uA –40°C to 85°C 1 uA –40°C to 105°C 3 uA ION ON pin leakage ON = VBIAS –40°C to 105°C 0.1 1 uA Performance RON On-Resistance VIN = 0.2 V to 2.2 V 25°C 4.3 mΩ –40°C to 85°C 7 mΩ –40°C to 105°C 7 mΩ VIH ON pin turn on threshold, rising –40°C to 105°C 0.765 0.9 1.035 V VIL ON pin turn off threshold, falling –40°C to 105°C 0.595 0.7 0.805 V VON, HYST ON pin hysteresis –40°C to 105°C 0.2 V tON,DEG LITCH On pin deglitch time –40°C to 105°C 2 4.5 6.5 us RQOD QOD Resistance VOUT = VIN 25°C 50 Ω –40°C to 105°C 40 60 Ω Protection TSD Thermal Shutdown - 130 150 180 °C TSDHYS Thermal Shutdown Hysteresis - 20 °C TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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6.8 Switching Characteristics (VBIAS = 2.2 V to 5 V) Over operating free-air temperature range (unless otherwise noted), CIN=47uF. Typical values are at TA = 25°C, CL = 0.1μF, and a current load of 1mA. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN = 5 V tON Turn ON time CT = Open 250 us tON Turn ON time CT = VBIAS 1870 us tON Turn ON time CT = GND 3728 us tRISE Rise time CT = Open 225 us tRISE Rise time CT = VBIAS 1838 us tRISE Rise time CT = GND 3697 us tD Delay time CT = Open 26 us tD Delay time CT = VBIAS 31 us tD Delay time CT = GND 31 us tFALL Fall time CT = Open 11 us tOFF Turn OFF time CT = Open 3 us VIN = 3.3 V tON Turn ON time CT = Open 175 us tON Turn ON time CT = VBIAS 1261 us tON Turn ON time CT = GND 3586 us tRISE Rise time CT = Open 150 us tRISE Rise time CT = VBIAS 1232 us tRISE Rise time CT = GND 2478 us tD Delay time CT = Open 26 us tD Delay time CT = VBIAS 29 us tD Delay time CT = GND 29 us tFALL Fall time CT = Open 11 us tOFF Turn OFF time CT = Open 3 us VIN = 1.8 V tON Turn ON time CT = Open 102 us tON Turn ON time CT = VBIAS 664 us tON Turn ON time CT = GND 1302 us tRISE Rise time CT = Open 75 us tRISE Rise time CT = VBIAS 634 us tRISE Rise time CT = GND 1272 us tD Delay time CT = Open 27 us tD Delay time CT = VBIAS 29 us tD Delay time CT = GND 30 us tFALL Fall time CT = Open 11 us tOFF Turn OFF time CT = Open 3 us VIN = 0.6 V tON Turn ON time CT = Open 51 us tON Turn ON time CT = VBIAS 213 us tON Turn ON time CT = GND 393 us tRISE Rise time CT = Open 23 us tRISE Rise time CT = VBIAS 183 us tRISE Rise time CT = GND 365 us www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPS22998

6.8 Switching Characteristics (VBIAS = 2.2 V to 5 V) (continued) Over operating free-air temperature range (unless otherwise noted), CIN=47uF. Typical values are at TA = 25°C, CL = 0.1μF, and a current load of 1mA. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tD Delay time CT = Open 27 us tD Delay time CT = VBIAS 29 us tD Delay time CT = GND 29 us tFALL Fall time CT = Open 10 us tOFF Turn OFF time CT = Open 4 us VIN = 0.285 V tON Turn ON time CT = Open 37 us tON Turn ON time CT = VBIAS 96 us tON Turn ON time CT = GND 158 us tRISE Rise time CT = Open 11 us tRISE Rise time CT = VBIAS 66 us tRISE Rise time CT = GND 128 us tD Delay time CT = Open 27 us tD Delay time CT = VBIAS 29 us tD Delay time CT = GND 30 us tFALL Fall time CT = Open 9 us tOFF Turn OFF time CT = Open 4 us

6.9 Timing Diagram

Figure 6-1. TPS22998 Timing Diagram TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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6.10 Typical Characteristics

Input Voltage (V) Quiescent Current(uA) –40  C 25  C 85  C 105  C VBIAS = 5 V VOUT = Open Figure 6-2. Quiescent Current vs Input Voltage Bias Voltage (V) Quiescent Current (uA) 2 2.5 3 3.5 4 4.5 5 5.5 –40  C 25  C 85  C 105  C VIN = VBIAS VOUT = Open Figure 6-3. Quiescent Current vs Bias Voltage Input Voltage (V) Shutdown Current (uA) 0.5 1.5 2.5 3.5 4.5 –40  C 25  C 85  C 105  C VBIAS = 5 V VOUT = 0 V Figure 6-4. VBIAS Shutdown Current vs Input Voltage Bias Voltage (V) Shutdown Current (uA) 2 2.5 3 3.5 4 4.5 5 5.5 0.4 0.8 1.2 1.6 2.4 2.8 3.2 3.6 –40  C 25  C 85  C 105  C VIN = VBIAS VOUT = 0 V Figure 6-5. VBIAS Shutdown Current vs Bias Voltage Input Voltage (V) On-Resistance (m  ) 0.6 1.2 1.8 2.4 3.6 4.2 4.8 5.4 –40  C 25  C 85  C 105  C VBIAS = 5 V ILOAD = 200 mA Figure 6-6. On-Resistance vs Input Voltage Bias Voltage (V) QOD Resistance (  ) 2 2.5 3 3.5 4 4.5 5 5.5 –40  C 25  C 85  C 105  C VIN = VBIAS Figure 6-7. QOD Resistance vs Bias Voltage www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TPS22998

6.10 Typical Characteristics (continued)

Input Voltage (V) Rise Time (us) 100 125 150 175 200 225 250 –40  C 25  C 85  C 105  C VBIAS = 5 V CL = 0.1 µF CT = Floating Figure 6-8. Rise Time vs Input Voltage Input Voltage (V) Delay Time (us) –40  C 25  C 85  C 105  C VBIAS = 5 V CL = 0.1 µF CT = Floating Figure 6-9. Delay Time vs Input Voltage Input Volage (V) Turn On Time (us) 100 125 150 175 200 225 250 275 –40  C 25  C 85  C 105  C VBIAS = 5 V CL = 0.1 µF CT = Floating Figure 6-10. Turn-On Time vs Input Voltage Input Voltage (V) Fall Time (us) –40  C 25  C 85  C 105  C VBIAS = 5 V CL = 0.1 µF CT = Floating Figure 6-11. Fall Time vs Input Voltage Input Voltage (V) Off Time (us) 0.6 1.2 1.8 2.4 3.6 4.2 4.8 5.4 –40  C 25  C 85  C 105  C VBIAS = 5 V CL = 0.1 µF CT = Floating Figure 6-12. Off Time vs Input Voltage TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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7 Detailed Description

7.1 Overview

The TPS22998 device is a single-channel load switch with a 4-m Ω power MOSFET designed to operate up to 10 A. The voltage range is 0.2 V to 5.5 V. A configurable rise time provides flexibility for power sequencing and minimizes inrush current for high capacitance loads. An enable pin (ON) controls the switch, which is capable of interfacing directly with low voltage GPIO signals. The TPS22998 device uses quick output discharge when switch turns off, pulling the output down to 0 V through an internal 50-Ω resistor.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 ON and OFF Control

The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold so it can be used in a wide variety of applications. When the pin pull high, the device enables, and when it is low, the device disables.

7.3.2 Adjustable Slew Rate

The CT pin is a tri-state pin, meaning that it has three different slew rates depending on the connection to the pin. The CT pin can be grounded, pulled high, or left floating. Floating defines as an effective resistance to GND or other pins greater than 10 MΩ. www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TPS22998

7.3.3 Thermal Shutdown

When the device temperature reaches 150°C (typical), the device shuts itself off to prevent thermal damage. After it cools off by about 20°C, the device turns back on. If the device is kept in a thermally stressful environment, then the device oscillates between these two states until it can keep its temperature below the thermal shutdown point.

7.4 Device Functional Modes

The below table summarizes the device functional modes: ON Fault Condition VOUT State L None QOD to GND H None Connected to VIN H Thermal shutdown QOD to GND TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

This section highlights some of the design considerations when implementing this device in various applications.

8.2 Typical Application

This typical application demonstrates how to use the TPS22998 device to limit startup inrush current. Figure 8-1. TPS22998 Basic Application

8.2.1 Design Requirements

For this example, the values below are used as the design parameters. Table 8-1. Design Parameters PARAMETER VALUE VBIAS 3.3 V VIN 1.8 V Load capacitance 470 μF Maximum inrush current 1 A www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TPS22998

8.2.2 Detailed Design Procedure

When the switch enables, the charge up the output capacitance from 0 V to the set value (1.8 V in this example). This charge arrives in the form of inrush current. Calculate inrush current using Equation 1. Inrush Current = CL × dVOUT/dt (1) Where:

• CL is the output capacitance.
• dVOUT is the change in VOUT during the ramp up of the output voltage when device is enabled. Because rise time is 10% of VOUT to 90% of VOUT, this is 80% of the VIN value.
• dt is the rise time in VOUT during the ramp up of the output voltage when the device is enabled. The TPS22998 offers an adjustable rise time for VOUT, allowing the user to control the inrush current during turn on. Calculate the appropriate rise time using the design requirements and the inrush current equation as shown below. dt = 677µs (3) To ensure an inrush current of less than 1 A, a C T setting that yields a rise time of more than 677 µs must be chosen. By pulling the CT pin high, a rise time of 900 μs is selected, limiting the inrush current to below 1 A.

8.2.3 Application Performance Plots

The below scope shot shows the TPS22998 turning on into a 470-μF load with the CT pin tied to VBIAS. Figure 8-2. TPS22998 Turn-On into 470 μF (CT = VBIAS) TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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9 Power Supply Recommendations

The TPS22998 device is designed to operate with a VIN range of 0.2 V to 5.5 V. Regulate the VIN power supply well and place as close to the device terminal as possible. The power supply must be able to withstand all transient load current steps. In most situations, using an input capacitance (C IN) of 1 μF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance can be required on the input.

10 Layout

10.1 Layout Guidelines

For best performance, all traces must be as short as possible. To be most effective, place the input and output capacitors close to the device to minimize the effects that parasitic trace inductances can have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.

10.2 Layout Example

Figure 10-1. TPS22998 Layout Example www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TPS22998

11 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 www.ti.com

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12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TPS22998 SLVSG05A – OCTOBER 2021 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TPS22998

www.ti.com 23-Dec-2021 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTPS22998RYZR ACTIVE WQFN-HR RYZ 10 3000 TBD Call TI Call TI -40 to 105 TPS22998RYZR ACTIVE WQFN-HR RYZ 10 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 1LF (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com 23-Dec-2021 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TPS22998RYZR WQFN- HR PACKAGE MATERIALS INFORMATION www.ti.com 24-Dec-2021 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22998RYZR WQFN-HR RYZ 10 3000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Dec-2021 Pack Materials-Page 2

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