PTPS22950LYBHR

TPS22950_V02 TI | Alldatasheet

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Technical content

TPS22950x 5.5-V, 2.7-A, 34-mΩ Adjustable Current Limited Load Switch

1 Features

• Input operating voltage range (VIN): 1.8 V–5.5 V
• Output current limit (ILIMIT): 0.05 A–3.5 A (typ.)
• TPS22950: Auto-retry current limit response
• TPS22950L: Latch off current limit response
• Thermal Shutdown (TSD)
• ON-Resistance (RON): – RON at VIN = 5 V: 34 mΩ (typ.) – RON at VIN = 3.3 V: 41 mΩ (typ.)
• Slow turn-ON timing limits inrush current (typ.): – tON at VIN = 5 V: 800 us – tON at VIN = 3.3 V: 550 us
• Always-ON reverse current blocking (TPS22950)
• Fault indication (FLT)
• Quick Output Discharge (QOD): 150 Ω
• Smart ON pin pulldown (RPD,ON): – ON ≥ VIH (ION): 50 nA (max.) – ON ≤ VIL (RPD,ON): 500 kΩ (typ.)
• Low power consumption: – ON state (IQ): 40 uA (typ.) – OFF state (ISD): 0.2 uA (typ.)
• UL 2367 Recognition – File No. E169910 – Certified from ILIM = 66 mA to 2.46 A

2 Application

• Personal electronics
• Tablets
• Notebooks
• Game consoles
• Accessories

3 Description

The TPS22950x is a small, single channel load switch with robust protection against fault cases with adjustable output current limiting, reverse current blocking, and thermal shutdown. The switch ON state is controlled by a digital input that is capable of interfacing directly with low-voltage control signals. When power is first applied, a Smart Pulldown is used to keep the ON pin from floating until system sequencing is complete. After the pin is deliberately driven high (>V IH), the Smart Pulldown is disconnected to prevent unnecessary power loss. The TPS22950 responds to overcurrent events with auto-retry behavior, while the TPS22950L uses a debounce time and latch off behavior. TPS22950x is available in a standard WCSP package characterized for operation over an ambient temperature range of –40°C to 125°C. Device Information PART NUMBER PACKAGE BODY SIZE (NOM) TPS22950, TPS22950L WCSP (6) 1.106 mm × 0.706 mm L H VIN Fault RL ON CIN VIN RFLT CL VOUT GND FLT ILIM RILIM Typical Application TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

13.1 Receiving Notification of Documentation Updates..20

14 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (December 2020) to Revision A (June 2022) Page TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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5 Device Comparison Table

DEVICE NAME ILIM Range ILIM Response Debounce Time RCB TPS22950 0.05 A to 3.5 A Auto-Retry No Yes TPS22950L 0.5 A to 3.5 A Latch Off Yes No www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPS22950

6 Pin Configuration and Functions

Figure 6-1. TPS22950x WCSP - 6 Top View Table 6-1. Pin Functions PIN I/O DESCRIPTION NAME NO. ON A1 I Active high switch control input. Do not leave floating. FLT A2 O Open-drain output, pulled low during thermal shutdown or reverse current-conditions. VIN B1 I Switch input VOUT B2 O Switch output GND C1 — Device ground ILIM C2 O Adjusts device current limit through a resistor to ground. TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VIN Maximum Input Voltage Range –0.3 6 V VOUT Maximum Output Voltage Range –0.3 6 V VON Maximum ON Pin Voltage Range –0.3 6 V VFLT Maximum FLT Pin Voltage –0.3 6 V IMAX Maximum Continuous Output Current 2.7 A IMAX,PLS Maximum Pulsed Output Current (TJ = 85°C, duty cycle = 2%) 4.1 A TSTG Storage temperature –65 150 °C TLEAD Maximum Lead Temperature (10 s soldering time) 300 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1) ±2000 V Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Input Voltage Range 1.8 5.5 V VOUT Output Voltage Range 0 5.5 V VIH ON Pin High Voltage Range 1 5.5 V VIL ON Pin Low Voltage Range 0 0.35 V ILIM Output Current Limit (TPS22950) 0.05 3.5 A ILIM Output Current Limit (TPS22950L) 0.5 3.5 A TA Ambient temperature –40 125 °C TJ Junction temperature –40 150 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS22950 UNITYBH (WCSP)

6 PINS

RθJA Junction-to-ambient thermal resistance 135.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.4 °C/W RθJB Junction-to-board thermal resistance 39.5 °C/W ΨJT Junction-to-top characterization parameter 0.9 °C/W www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPS22950

7.4 Thermal Information (continued)

THERMAL METRIC(1) TPS22950 UNITYBH (WCSP) ΨJB Junction-to-board characterization parameter 39.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

Unless otherwise noted, the characteristics in the following table apply across the recommended operating input voltage range with a load of CL = 0.1 µF, RL = 100 Ω. Typical Values are at 5 V and TA = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input Supply (VIN) IQ, VIN VIN Quiescent Current VON ≥ VIH, VOUT = Open –40°C to 85°C 44 60 µA –40°C to 125°C 60 µA ISD, VIN VIN Shutdown Current VON ≤ VIL, VOUT = GND 25°C 0.2 0.4 µA –40°C to 85°C 9 µA –40°C to 125°C 46 µA ON-Resistance (RON) RON ON-State Resistance VIN = 5 V, IOUT = –200 mA 25°C 34 41 mΩ –40°C to 85°C 49 mΩ –40°C to 125°C 54 mΩ VIN = 3.3 V, IOUT = –200 mA 25°C 41 51 mΩ –40°C to 85°C 62 mΩ –40°C to 125°C 68 mΩ VIN = 1.8 V, IOUT = –200 mA 25°C 67 90 mΩ –40°C to 85°C 105 mΩ –40°C to 125°C 116 mΩ Output Current Limit (ILIM) ILIM Output Current Limit RILIM = 610 Ω VIN- VOUT = 0.5 V –40°C to 125°C 1.54 2 2.46 A RILIM = 1.15 kΩ VIN- VOUT = 0.5 V –40°C to 125°C 0.75 1 1.25 A RILIM = 2.21 kΩ VIN- VOUT = 0.5 V –40°C to 125°C 0.38 0.5 0.62 A RILIM = 19.2 kΩ VIN- VOUT = 0.5 V –40°C to 125°C 0.034 0.05 0.066 A ILIM,PEAK Output Current Limit Peak (TPS22950L) RILIM = 624 Ω VIN- VOUT = 1 V –40°C to 125°C 2.1 A RILIM = 1.24 kΩ VIN- VOUT = 1 V –40°C to 125°C 1 A RILIM = 2.49 kΩ VIN- VOUT = 1 V –40°C to 125°C 0.52 A tLIM Current Limit Response Time Output hard short (IOUT > ILIM) –40°C to 125°C 5 µs tDEBOUNCE Latch Off Debounce Time (TPS22950L) VIN- VOUT = 0.5 V –40°C to 125°C 120 188 µs IHCD High current detection threshold (TPS22950L) RILIM = 624 Ω –40°C to 125°C 1.2 1.6 1.9 A RILIM = 1.25 kΩ –40°C to 125°C 0.6 0.85 1.1 A RILIM = 2.5 kΩ –40°C to 125°C 0.3 0.47 0.65 A TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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7.5 Electrical Characteristics (continued)

Unless otherwise noted, the characteristics in the following table apply across the recommended operating input voltage range with a load of CL = 0.1 µF, RL = 100 Ω. Typical Values are at 5 V and TA = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Reverse Current Blocking (TPS22950) VRCB Activation Threshold VOUT Rising; VOUT > VIN –40°C to 125°C 44 mV Release Threshold VOUT Falling; VOUT > VIN –40°C to 125°C 16 mV tRCB Response Time VOUT = VIN + 1 V –40°C to 125°C 3 µs IOUT,RCB Reverse Leakage Current into VOUT VON ≤ VIL VIN = 0 V, VOUT = 5 V –40°C to 125°C 38 µA Fault Indication (FLT) VOL, FLT Output Low Voltage IFLT = 1 mA –40°C to 125°C 0.1 V tD,FLT Fault Delay Time VON ≥ VIH –40°C to 125°C 10 µs IFLT Off State Leakage VON ≤ VIL –40°C to 125°C 50 nA Enable Pin (ON) RPD, ON Smart Pull Down Resistance VON ≤ VIL –40°C to 125°C 500 650 kΩ ION ON Pin Leakage VON ≥ VIH –40°C to 125°C 50 nA RQOD Quick Output Discharge Resistance VIN = 5 V VON ≤ VIL –40°C to 125°C 100 160 Ω VIN = 3.3 V VON ≤ VIL –40°C to 125°C 150 185 Ω VIN = 1.8 V VON ≤ VIL –40°C to 125°C 200 355 Ω Thermal Shutdown (TSD) TSD Thermal Shutdown Rising N/A 170 °C Falling (Hysteresis) N/A 150 °C

7.6 Switching Characteristics

Unless otherwise noted, the typical characteristics in the following table applies at 25°C with a load of CL = 1 µF, RL = 100 Ω PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn ON Time VIN = 5 V 800 µs VIN = 3.3 V 550 µs VIN = 1.8 V 400 µs tR Output Rise Time VIN = 5 V 600 µs VIN = 3.3 V 320 µs VIN = 1.8 V 200 µs tD Output Delay Time VIN = 5 V 260 µs VIN = 3.3 V 250 µs VIN = 1.8 V 260 µs tOFF Turn OFF Time VIN = 5 V 20 µs VIN = 3.3 V 15 µs VIN = 1.8 V 17 µs tFALL Output Fall Time VIN = 5 V 118 µs VIN = 3.3 V 120 µs VIN = 1.8 V 130 µs www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPS22950

7.7 Typical Characteristics

Input Voltage (V) Quiescent Current (PA) D001 -40qC 25qC 85qC 125qC VON ≥ VIH Figure 7-1. Quiescent Current vs Input Voltage Input Voltage (V) Shutdown Current (PA) 0.5 1.5 2.5 3.5 4.5 5.5 D002 -40qC 25qC 85qC 125qC VON ≤ VIL Figure 7-2. Shutdown Current vs Input Voltage Input Voltage (V) On-Resistance (m:) D003 -40qC 25qC 85qC 125qC VON ≥ VIH IOUT = –200 mA Figure 7-3. On-Resistance vs Input Voltage Input Voltage (V) QOD Resistance (:) 100 120 140 160 180 200 220 D004 -40qC 25qC 85qC 125qC VON ≤ VIL Figure 7-4. QOD Resistance vs Input Voltage Ambient Temperature (qC) Power Dissipation (W) -40 -20 0 20 40 60 80 100 120 140 0.25 0.5 0.75 1.25 1.5 1.75 2.25 2.5 2.75 D005 4-layer JEDEC PCB 4-layer PCB with 0.5in2 Cu pad Figure 7-5. Maximum Power Dissipation vs Ambient Temperature Junction Temperature (qC) Maximum Continuous Current (A) 85 95 105 115 125 135 145 0.4 0.6 0.8 1.2 1.4 1.6 1.8 2.2 2.4 D006 Figure 7-6. Maximum Continuous Current vs Junction Temperature TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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7.7 Typical Characteristics (continued)

VIN = 5 V VON = 5 V Figure 7-7. Short-Circuit Response VIN = 5 V VON = 5 V Figure 7-8. Reverse Current Blocking www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TPS22950

8 Parameter Measurement Information

10% 90% 90% 10% tFALL tDELAY tRISE tOFF VIL Figure 8-1. Timing Waveform TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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9 Detailed Description

9.1 Overview

The TPS22950x is a single channel load switch with a 34-m Ω power MOSFET capable of driving loads up to 2.7 A. While on, the device provides protection against fault cases though its adjustable output current limiting and thermal shutdown. The TPS22950 responds to overcurrent events with auto-retry behavior, while the TPS22950L uses a debounce time and latch off behavior. The TPS22950 also provides reverse current blocking for when VOUT exceeds VIN. The switch ON state is controlled by a digital input that is capable of interfacing directly with low-voltage control signals, and a Smart Pulldown is used to keep the ON pin from floating until system sequencing is complete. When the device is turned off, quick output discharge is enabled, pulling the output voltage down to 0 V through a resistive path to GND.

9.2 Functional Block Diagram

9.3 Feature Description

9.3.1 Current Limiting (TPS22950)

The TPS22950 responds to overcurrent conditions by limiting its output current to the I LIM level shown in the figure below. www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TPS22950

Figure 9-1. Output Current Limit for Short-Circuit Protection (tLIM) When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled high, turning the device on. The output voltage is held near zero potential with respect to ground and the TPS22950 ramps the output current to I LIM. The TPS22950 device limits the current to I LIM until the overload condition is removed or the internal junction temperature of the device reaches thermal shutdown and the device turns itself off. The device remains off until the junction temperature has lowered to TSD HYS, and the device turns itself back on. This action cycles until the overload condition is removed. The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device has been fully powered on. The device responds to the overcurrent condition within time t LIM (see figure below), and before this time the current is able to exceed I LIM. In the case of a fast transient, the current-sense amplifier is over-driven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits the output current to I LIM. Similar to the previous case, the TPS22950 limits the current to I LIM until the overload condition is removed or the internal junction temperature of the device reaches thermal shutdown and begins thermally cycling on and off. TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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Figure 9-2. Transient Current Limit Waveform

9.3.2 Current Limiting (TPS22950L)

The TPS22950L responds to overcurrent conditions by limiting its output current to the current limit (I LIM) level after initially peaking its current at ILIM,PEAK. The behavior of the device is shown in the figure below. Figure 9-3. Output Current Limit Behavior When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled high, turning the device on. The output voltage is held near zero potential with respect to ground and the TPS22950L ramps the output current to I LIM. The TPS22950L device limits the current to I LIM until the overload condition is removed. If the internal junction temperature of the device reaches thermal shutdown ,the device turns itself off. The device remains off until the junction temperature has lowered to TSD HYS, and the device turns itself back on. If thermal shutdown is not reached, the device waits for the load current to exceed the high www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TPS22950

current detection level (IHCD) for the tDEBOUNCE time and latch itself off. The FLT pin is pulled low, and the device is only able to turn on again by toggling the VIN or ON pins. The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device has been fully powered on. The device responds to the overcurrent condition within time t LIM (see figure below), and before this time the current is able to exceed I LIM. In the case of a fast transient, the current-sense amplifier is over-driven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits the output current to ILIM. Similar to the previous case, the TPS22950L limits the current to I LIM until the overload condition is removed, the debounce time of 120 µs is reached, or the internal junction temperature of the device reaches thermal shutdown and begins thermally cycling on and off. IOUT tLIM ILIM Figure 9-4. Transient Current Limit Waveform

9.3.3 Adjusting the Current Limit

The current limit is adjusted by connecting an external resistor from the ILIM pin to GND. The current limit resistor can be chosen using the equation: ILIM = 1.18 × (RILIM)–1.072 (1) The units for the equation are amps for I LIM and kilohms for RILIM. For the TPS22950L, the device is only limiting current during a short period of time. Therefore, the peak value of the current (I LIM,PEAK) may be more applicable for system considerations. The equation for this parameter is below: ILIM,PEAK = 1.31 × (RILIM)–1.042 (2) The RILIM resistor is also used to set the high current detection threshold for the TPS22950L, and that equation is shown below. IHCD = (0.988 / RILIM) + 0.06 (3) The units for the equation are amps for IHCD and kilohms for RILIM.

9.3.4 Reverse Current Blocking (TPS22950)

In a scenario where the device is enabled and V OUT is greater than V IN, there is potential for reverse current to flow through the pass FET or the body diode. When the reverse current threshold is exceeded (about 900 mA), there is a delay time (t RCB) before the switch turns off to stop the current flow. The switch remains off and block reverse current as long as the reverse voltage condition exists. After V OUT has dropped below the release voltage threshold (VRCB) the device turns back on. When the ON pin is pulled low, the device constantly blocks reverse current.

9.4 Device Functional Modes

The tables below summarize the Device Functional Modes. Table 9-1. Output Connection Table ON Fault Condition VOUT State FLT State L N/A Hi-Z Hi-Z H None VIN (via RON) Hi-Z TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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Table 9-1. Output Connection Table (continued) ON Fault Condition VOUT State FLT State H Output short Current Limited Hi-Z H Thermal shutdown Hi-Z L H Reverse current Hi-Z L Table 9-2. Smart-ON Functional Modes (RPD,ON) ON ON Pin ≤ VIL Pulldown active ≥ VIH No pulldown www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TPS22950

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

10.1 Application Information

This section highlights some of the design considerations when implementing this device in various applications.

10.2 Typical Application

This typical application demonstrates how the TPS22950x device can be used to set an adjustable current limit. L H VIN Fault RL ON CIN VIN RFLT CL VOUT GND FLT ILIM RILIM Figure 10-1. Typical Application

10.2.1 Design Requirements

For this example, the values below are used as the design parameters. Table 10-1. Design Parameters PARAMETER VALUE Input Voltage (VIN) 5 V Load Current (mA) 100 mA Typical Current Limit (mA) 500 mA

10.2.2 Detailed Design Procedure

In this example the nominal load current is 100 mA, so the current limit can be set to 500 mA without disrupting normal operation. Use Equation 4 to calculate the resistor needed on the ILIM pin. ILIM = 1.18 × (RILIM)–1.072 (4) where

• ILIM = Typical current limit setting
• RILIM = Resistor on the ILIM pin Based on Equation 4, a 2.21-kΩ resistor must be used on the ILIM pin to set a typical current limit of 500 mA. TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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10.2.3 Application Curves

The below scope shot shows the device turning on into a fault condition and limiting the current to the specified amount of 500 mA. RILIM = 2.5 kΩ VOUT = GND Figure 10-2. TPS22950 Turning On into an Output Short www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TPS22950

11 Power Supply Recommendations

The device is designed to operate with a VIN range of 1.8 V to 5.5 V. The VIN power supply must be well regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all transient load current steps. In most situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance may be required on the input. TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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12 Layout

12.1 Layout Guidelines

For best performance, all traces must be as short as possible. To be most effective, the input and output capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.

12.2 Layout Example

Figure 12-1. TPS22950x Layout Example www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: TPS22950

13 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

13.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

13.3 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: TPS22950

www.ti.com PACKAGE OUTLINE C0.4 MAX 0.19 0.13 0.8 TYP 0.4 TYP 6X 0.225 0.185 0.4 TYP B E A D 4226594/A 03/2021 D: Max = 1.126 mm, Min = 1.086 mm DSBGA - 0.4 mm max heightYBH0006-C02 DIE SIZE BALL GRID ARRAY E: Max = 0.726 mm, Min = 0.686 mm NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE 0.05 C A 1 2

0.015 C A B

B C SCALE 12.000 TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 6X ( 0.2) (0.4) TYP (0.4) TYP ( 0.2) SOLDER MASK OPENING ( 0.2) METAL 4226594/A 03/2021 DSBGA - 0.4 mm max heightYBH0006-C02 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM 1 2 A B EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 50X C NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL www.ti.com TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TPS22950

www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP 4226594/A 03/2021 DSBGA - 0.4 mm max heightYBH0006-C02 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM 1 2 A B BASED ON 0.075 mm THICK STENCIL SOLDER PASTE EXAMPLE SCALE: 50X METAL TYP C TPS22950 SLVSFJ2A – DECEMBER 2020 – REVISED JUNE 2022 www.ti.com

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www.ti.com 11-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTPS22950LYBHR ACTIVE DSBGA YBH 6 3000 TBD Call TI Call TI -40 to 125 Samples TPS22950LYBHR ACTIVE DSBGA YBH 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 4 Samples TPS22950YBHR ACTIVE DSBGA YBH 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 11-Jun-2022 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jun-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jun-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22950LYBHR DSBGA YBH 6 3000 182.0 182.0 20.0 TPS22950YBHR DSBGA YBH 6 3000 182.0 182.0 20.0 Pack Materials-Page 2

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