TPLD1201 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 11
Technical content
TPLD1201 Programmable Logic Device
1 Features
- Eight general purpose input or outputs: – Digital input can be configured with hysteresis, low-voltage thresholds, and internal pull-up or down resistor – Push-pull, open-drain (PMOS/NMOS), and Hi-Z outputs
- Supports 1.8 V, 2.5 V, 3.3 V, and 5 V applications
- Configurable macro-cells: – 2-, 3-, and 4-bit lookup tables (LUT) – D-type flip-flops or latches with and without reset or set option – Pipe delay – 8-stages, 2 outputs – Selectable counters or delay generators – Programmable deglitch filter or edge detector – Analog comparators – selectable VREF and input gain – Internal voltage reference fixed or ratiometric – 25 kHz and 2 MHz RC oscillator – internal divider stages
- Extended temperature range: -40°C to 125°C
- Development tools: – InterConnect Studio – TPLD1201 evaluation module – TPLD programming board
2 Applications
- Factory automation and control
- Communications equipment
- Retail automation and payment
- Test and measurement
- Pro audio, video and signage
- Personal electronics
3 Description
The TPLD1201 is part of the TI programmable logic device (TPLD) family of devices that feature versatile programmable logic ICs with combinational logic, sequential logic and mixed-signal functions. TPLD provides a fully integrated, low power solution to implement common system functions, such as timing delays, voltage monitors, system resets, power sequencers, I/O expanders, and more. This device features configurable I/O structures that extends compatibility within mixed-signal environments, reducing the number of discrete components required. System designers can create circuits and configure the macro-cells, I/O pins, and interconnections by temporarily emulating the non-volatile memory or by permanently programming the one-time programmable (OTP) through InterConnect Studio . The TPLD1201 is supported by hardware and software ecosystem with application notes, reference designs and design examples. Visit ti.com for more information and access to design tools.
Package information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) TPLD1201 RWB (X2QFN, 12) 1.6 mm × 1.6 mm (1) For more information, see Section 6. (2) The package size (length × width) is a nominal value and includes pins, where applicable. ADVANCE INFORMATION TPLD1201 SCPS293 – NOVEMBER 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
Lookup Tables (LUTs) 2x LUT2 2x LUT3 Configurable Use Logic Blocks 2x LUT2 or DFF/L 2x LUT3 or DFF/L LUT3 or Pipe Delay LUT4 or CNT/DLY Analog Comparators Counter/Delay Generators 3x CNT/DLY ACMP GPIO9 NC VCC GPI GPIO1 GPIO2 NC GPIO4 GND GPIO5 GPIO6 GPIO7 Internal RC Oscillator Voltage Reference VREF Bandgap BG Programmable Delay Generator Power-On reset PDLY/FILTER RC OSC POR Functional Diagram TPLD1201 SCPS293 – NOVEMBER 2023 www.ti.com ADVANCE INFORMATION
2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TPLD1201
6 Mechanical, Packaging, and Orderable Information....4 www.ti.com TPLD1201 SCPS293 – NOVEMBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPLD1201
4 Device and Documentation Support
4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
4.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 Revision History
November 2023 * Initial Release
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TPLD1201 SCPS293 – NOVEMBER 2023 www.ti.com ADVANCE INFORMATION
4 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TPLD1201
6.1 Tape and Reel Information
Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PTPLD1201RWBR X2QFN RWB 12 3000 180 8.4 1.8 1.8 0.48 4 8 2 www.ti.com TPLD1201 SCPS293 – NOVEMBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPLD1201
TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PTPLD1201RWBR X2QFN RWB 12 3000 210 185 35 TPLD1201 SCPS293 – NOVEMBER 2023 www.ti.com ADVANCE INFORMATION
6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TPLD1201
6.2 Mechanical Data
www.ti.com PACKAGE OUTLINE C0.4 MAX 2X 1.2 0.4 6X 0.4 8X 0.4 0.212X 0.25 0.15 4X 0.6 0.4 0.05 0.00 B 1.65 1.55 A 1.65 1.55 (0.13) TYP X2QFN - 0.4 mm max heightRWB0012A PLASTIC QUAD FLATPACK - NO LEAD 4221631/B 07/2017 PIN 1 INDEX AREA SEATING PLANE 0.05 C
0.07 C B A
0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SYMM SYMM SCALE 6.500 www.ti.com TPLD1201 SCPS293 – NOVEMBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPLD1201
www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP
0.05 MIN
0.05 MAX
12X (0.2) 8X (0.5) (1.3) (1.5)2X (0.4) 4X (0.7) 6X (0.4) X2QFN - 0.4 mm max heightRWB0012A PLASTIC QUAD FLATPACK - NO LEAD 4221631/B 07/2017 SYMM 2 7 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:30X 3 6 NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL TPLD1201 SCPS293 – NOVEMBER 2023 www.ti.com ADVANCE INFORMATION
8 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TPLD1201
www.ti.com EXAMPLE STENCIL DESIGN 12X (0.2) 8X (0.5) 4X (0.67) 2X (0.4) (1.5) (1.3) 6X (0.4) (R0.05) TYP X2QFN - 0.4 mm max heightRWB0012A PLASTIC QUAD FLATPACK - NO LEAD 4221631/B 07/2017 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL PADS 1,2,7 & 8 96% PRINTED SOLDER COVERAGE BY AREA SCALE:50X 3 6 912 SYMM METAL www.ti.com TPLD1201 SCPS293 – NOVEMBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TPLD1201
www.ti.com 30-Nov-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTPLD1201RWBR ACTIVE X2QFN RWB 12 3000 TBD Call TI Call TI -40 to 150 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2023, Texas Instruments Incorporated