TCAN1057-Q1 TI1 | Alldatasheet
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ADVANCE□INFORMATION TCAN1057VMCU GPIO CAN FD Controller VDD 5V Voltage Regulator (e.g. TPSxxxx) VIN VOUT GNDVIO VIN 1.8 V / 2.5 V / 3.3 V Regulator (e.g. TPSxxxx) VIN VOUT Optional: Terminating Node Optional: Filtering, Transient and ESD TXD RXD S VCC CANH CANL Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. TCAN1057-Q1, TCAN1057V-Q1 SLLSFI1 –APRIL 2020 TCAN1057V-Q1AutomotiveFault-ProtectedCANFDTransceiverwith1.8-VI/OSupport
1 Features
1• AEC-Q100: Qualified for automotive applications – Temperature grade 1: –40°C to 125°C TA
- Meets the requirements of ISO 11898-2:2016 and ISO 11898-5:2007 physical layer standards
- Support of classical CAN and optimized CAN FD performance at 2, 5, and 8 Mbps – Short and symmetrical propagation delays for enhanced timing margin – Higher data rates in loaded CAN networks
- TCAN1057V I/O voltage range supports 1.7 V to 5.5 V – Support for 1.8-V, 2.5-V, 3.3-V, and 5-V
applications
- Protection features: – Bus fault protection: ±58 V – Undervoltage protection – TXD-dominant time-out (DTO) – Data rates down to 9.2 kbps – Thermal-shutdown protection (TSD)
- Operating modes: – Normal mode – Silent mode
- Optimized behavior when unpowered – Bus and logic pins are high impedance (no load to operating bus or application) – Hot-plug capable: power up/down glitch free operation on bus and RXD output
- Receiver common mode input voltage: ±12 V
2 Applications
- Automotive and Transportation – Body control modules – Automotive gateway – Advanced driver assistance system (ADAS) – Infotainment
3 Description
The TCAN1057-Q1 and TCAN1057V-Q1 are high speed controller area network (CAN) transceivers that meet the physical layer requirements of the ISO 11898-2:2016 high-speed CAN specification. The TCAN1057-Q1 transceivers have great electromagnetic compatibility (EMC) operation making it a superb choice for classical CAN and CAN FD networks up to 8 megabits per second (Mbps). The TCAN1057-Q1 transceivers support two modes of operation; normal mode and silent mode. The transceivers also support many protection and diagnostic features including thermal shutdown (TSD), TXD-dominant timeout (DTO), and bus fault protection up to ±58 V. The TCAN1057V-Q1 transceiver features an integrated level shifter on the VIO pin which supplies internal logic-level translation for interfacing the transceiver I/O's directly to 1.8-V, 2.5-V, 3.3-V, or 5-V logic I/O's. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TCAN1057-Q1 TCAN1057V-Q1 SOT (DDF) (8) 2.90 mm x 1.60 mm VSON (DRB) (8) 3.00 mm x 3.00 mm SOIC (D) (8) 4.90 mm x 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Links
resources, tools and software, and quick access to order now. Table 1. Related Links
4.2 Receiving Notification of Documentation Updates
changed. For change details, review the revision history included in any revised document.
4.3 Support Resources
from the experts. Search existing answers or ask your own question to get the quick design help you need. not necessarily reflect TI's views; see TI's Terms of Use.
4.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 25-Apr-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTCAN1057DDFRQ1 ACTIVE SOT-23-THIN DDF 8 3000 TBD Call TI Call TI -40 to 125 PTCAN1057VDDFRQ1 ACTIVE SOT-23-THIN DDF 8 3000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
www.ti.com PACKAGE OUTLINE C TYP2.95 2.65
1.1 MAX
6X 0.65 8X 0.4 0.2 1.95 TYP0.20 0.08 0 - 8 0.1 0.0 0.25 GAGE PLANE 0.6 0.3 A NOTE 3 2.95 2.85 B 1.65 1.55 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 1 8
0.1 C A B
0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT (2.6) 8X (1.05) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE SYMM SYMM LAND PATTERN EXAMPLE SCALE:15X 4 5 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (2.6) 6X (0.65) 8X (0.45) 8X (1.05) (R ) TYP0.05 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X
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