PTC36SAAN

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SLVA339A TI | Alldatasheet

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SLVA339A –June 2009–RevisedMay 2010 High-Vin,High-EfficiencyPower SolutionUsing DC/DC ConverterWith DVFS ABSTRACT This referencedesign is intended for users designingwith the TMS320C6742, TMS320C6746, TMS320C6748, or OMAP-L138 processor.Using sequenced power supplies,thisreferencedesign describesa systemhavinga 12-V inputvoltageand a high-efficiencydc/dcconverterwithintegratedFETs and dynamicvoltageand frequencyscaling(DVFS) fora small,simpledesign. Sequenced power supplyarchitecturesare becoming commonplace inhigh-performancemicroprocessor and digitalsignalprocessor(DSP) systems.To save power and increaseprocessingspeeds,processor coreshave smallergeometrycellsand requirelowersupplyvoltagesthanthesystem bus voltages.Power management inthesesystems requiresspecialattention.Thisapplicationreportaddressesthesetopics and suggestssolutionsforoutputvoltagesequencing.

1 Introduction

Indualvoltagearchitectures,coordinatedmanagement ofpower suppliesisnecessarytoavoidpotential problemsand ensurereliableperformance.Power supplydesignersmust considerthetimingand voltage differencesbetween coreand input/output(I/O)voltagesuppliesduringpower-upand power-down operations. Sequencingreferstotheorder,timing,and differentialinwhichthetwo voltagerailsarepowered up and down. A systemdesignedwithoutpropersequencingmay be atriskfortwo typesoffailures.The firstof theserepresentsa threattothelong-termreliabilityofthedualvoltagedevice,whereas thesecond is more immediate,withthepossibilityofdamaging interfacecircuitsintheprocessororsystemdevices such as memory, logic,ordataconverterintegratedcircuits(IC). Anotherpotentialproblemwithimpropersupplysequencingisbus contention.Bus contentionisa conditioninwhichtheprocessorand anotherdevicebothattempttocontrola bidirectionalbus during power up.Bus contentionmay alsoaffectI/Oreliability.Power supplydesignersmust checkthe requirementsregardingbus contentionforindividualdevices. The power-onsequencingfortheOMAP-L138, TMS320C6742, TMS320C6746, and TMS320C6748 are shown inTable1.None ofthesuppliesforthesedevicesrequirea specificvoltageramp rateas longas the3.3-Vraildoes notexceedsthe1.8-Vrailby more than2 V. Inordertoreducethepower consumptionoftheprocessorcore,dynamicvoltageand frequencyscaling (DVFS) isused inthereferencedesign.DVFS isa power management techniqueused whileactive processingisgoingon inthesystem-on-chip(SoC),whichmatches theoperatingfrequencyofthe hardwaretotheperformancerequirementoftheactiveapplicationscenario.Whenever clockfrequencies arelowered,operatingvoltagesarealsoloweredtoachievepower savings.Inthereferencedesign,the TPS62353 isused,whichcan scaleitsoutputvoltage.

2 Power Requirements

The power requirementsareas specifiedinthefollowingtable. Table1.GeneralRequirements VOLTAGE (1)(2) Imax SEQUENCING TIMINGPIN NAME TOLERANCE(V) (mA) ORDER DELAY I/O RTC_CVDD 1.2 1 –25%, +10% 1(3) I/O RVDD, PLL0_VDDA, 1.2 200 –5%, +10% 3 PLL1_VDDA, SATA_VDD, USB_CVDD, USB0_VDDA12 I/O USB0_VDDA18, USB1_VDDA18, 1.8 180 ±5% 4 DDR_DVDD18, SATA_VDDR, DVDD18 I/O USB0_VDDA33, USB1_VDDA33 3.3 24 ±5% 5 DVDD3318_C (1) If1.8-VLVCMOS isused,power railsup withthe1.8-Vrails.If3.3-VLVCMOS isused,power itup withtheANALOG33 rails (VDDA33_USB0/1). (2) No specificvoltageramp rateisrequiredforany ofthesuppliesLVCMOS33 (USB0_VDDA33, USB1_VDDA33) as longas STATIC18 (USB0_VDDA18, USB1_VDDA18, DDR_DVDD18, SATA_VDDR, DVDD18) neverexceedsmore than2 V. (3) IfRTC isnotused/maintainedon a separatesupply,itcan be includedintheSTATIC12 (fixed1.2V) group. (4) IfusingCVDD atfixed1.2V,all1.2-Vrailsmay be combined. (5) IfDVDD3318_A, B,and C arepowered independently,maximum power foreach railis1/3above maximum power. NanoFree isa trademarkofTexas Instruments. 2 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS SLVA339A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated

www.ti.com Features

3 Features

The designuses thefollowinghigh-efficiencydc/dcconverterswithintegratedFETs. HIGH EFFICIENCY (WithDVFS) INPUT VOLTAGE ~12 V/3.3V OUTPUT VOLTAGES Core 1.2V at600 mA TPS62353 Fixed1.2V + VRTC at251 mA TPS62232 1.8V at230 mA TPS62231 3.3V at115 mA TPS62111 Intheprecedingtable,VRTC isincludedintheSTATIC12 (fixed1.2-V)group. TPS62353

88% efficiencyat3-MHz operation
Outputpeak currentup to800 mA
3-MHz fixedfrequencyoperation
Bestinclassloadand linetransient
±2% PWM dc voltageaccuracy
EfficiencyoptimizedPower-Save mode
TransientoptimizedPower-Save mode
Fixed1.2-Voutputeliminatesneed forexternalvoltage-settingresistors
Availableina 10-pinQFN (3× 3 mm) 12-pinNanoFree™ (CSP) packaging TPS62231 and TPS62232
3-MHz switchfrequency
Up to94% efficiency
Outputpeak currentup to500 mA
Smallexternaloutputfiltercomponents (1mH/4.7mF)
Small1 × 1,5× 0,6mm 3 SON package
Fixed1.8-Vand 1.2-Voutput,respectively,eliminatesneed forexternalvoltage-settingresistors TPS62111
High-efficiencysynchronousstep-downconverterwithup to95% efficiency
Up to1.5-Aoutputcurrent
Highefficiencyovera wideload-currentrangedue toPFM/PWM operationmode
Fixed3.3-Voutputeliminatesneed forexternalvoltage-settingresistors More informationon thedevicescan be foundinthedatasheets.
TPS62111, SLVS585
TPS62231 and TPS62232, SLVS941
TPS62353, SLVS540 3SLVA339A –June 2009–RevisedMay 2010 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS Copyright© 2009–2010,Texas InstrumentsIncorporated

Features www.ti.com Figure1.PMP4976 ReferenceDesign Schematic 4 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS SLVA339A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated

www.ti.com Features Propersequencingisensuredinthedesignwiththeuse ofa NPN transistorand a P-channelMOSFET. As required,Core 1.2V at600 mA comes first,and isfollowedby Static1.2V + VRTC at251 mA. Then comes Static1.8V at230 mA, whichinturnpullsdown thegateofa P-channelMOSFET withtheuse of a NPN transistor.Last,Static3.3V at115 mA comes up. (1) Use threesuch LDOs topower up DVDDA, DVDDB, and DVDDC. (Itcan be either1.8V or3.3V.) (2) Rx = 0.499M Ω,Ry = 1 M Ω forVout= 1.8V (3) Rx = 1.8M Ω,Ry = 1 M Ω forVout= 3.3V (4) Forpropersequencingofoutput,theenableoftheLDOs arefedeitherfroma 1.2-VoutputfromTPS62232 if DVDDX is1.8V orfroma 1.8-VoutputfromTPS62231 ifDVDDX is3.3V. Figure2.OptionalCircuitforDVDD_A, DVDD_B, and DVDD_C 5SLVA339A –June 2009–RevisedMay 2010 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS Copyright© 2009–2010,Texas InstrumentsIncorporated

BillofMaterials www.ti.com

4 BillofMaterials

Table2.PMP4976 BillofMaterials Count RefDes Value Description Size PartNumber MFR AREA

2 C1 10 mF Capacitor,Ceramic,25V,X5R, 20% 1206 C3216X5R1E106 TDK 15390

C2 10 mF Capacitor,Ceramic,25V,X5R, 20% 1206 C3216X5R1E106 TDK 15390

2 C3 22 mF Capacitor,Ceramic,10V,X5R, 20% 1206 C3216X5R1A226 TDK 15390

C4 22 mF Capacitor,Ceramic,10V,X5R, 20% 1206 C3216X5R1A226 TDK 15390

1 C5 1 mF Capacitor,Ceramic,25V,X7R, 10% 603 C1608X7R1E105K TDK 5650

2 C6 10 mF Capacitor,Ceramic,6.3V,X5R, 10% 603 C1608X5R0J106KT TDK 5650 C7 10 mF Capacitor,Ceramic,6.3V,X5R, 10% 603 C1608X5R0J106KT TDK 5650

1 C8 47 mF Capacitor,Ceramic,10V,X5R, 20% 1812 C4532X5R1A476M TDK 43,360

2 C9 22 mF Capacitor,Ceramic,10V,X5R, 20% 1210 Std Std 83,600

2 C10 2.2mF Capacitor,Ceramic,6.3V,X5R, 20% 402 JDK105BJ225MV TaiyoYuden 2800 2 C11 4.7mF Capacitor,Ceramic,6.3V,X5R, 20% 402 JDK105BJ475MV TaiyoYuden 2800 C12 22 mF Capacitor,Ceramic,10V,X5R, 20% 1210 Std Std 83,600 C13 2.2mF Capacitor,Ceramic,6.3V,X5R, 20% 402 JDK105BJ225MV TaiyoYuden 2800 C14 4.7mF Capacitor,Ceramic,6.3V,X5R, 20% 402 JDK105BJ475MV TaiyoYuden 2800 1 J1 PTC36SAAN Header,Male 6-pin,100milspacing,(36-pinstrip)0.100inch× 6 PTC36SAAN Sullins 70000 1 J2 2510-6002UB Connector,Male Straight2×10 pin,100mil 0.338× 0.788 2510-6002UB 3M 301.02 spacing,4 Wall 4 1 J3 PEC36SAAN Header,Male 5-pin,100milspacing,(36-pinstrip)0.100inch× 5 PEC36SAAN Sullins 60000 1 JP1 PTC36SAAN Header,3-pin,100milspacing,(36-pinstrip) 0.100× 3 PTC36SAAN Sullins 34100 1 L1 6.8mH Inductor,SMT, 3.0A,97 m Ω 0.276× 0.276inch HA3808-AL Coiltronics 90000 1 L2 1 mH Inductor,SMT, 1.6A,±30% 0.118× 0.118 LPS3010-102NLC Coilcraft 26,560 2 L3 2.2mH Inductor,SMT, 0.7A,230-mΩ 805 MIPSZ20120D2R2 FDK 10160 L4 2.2mH Inductor,SMT, 0.7A,230-mΩ 805 MIPSZ20120D2R2 FDK 10160

1 Q1 Si2335DS MOSFET, P-ch,-12V,4 A,51 m Ω SOT23 Si2335DS Vishay 14105

1 Q2 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild 37800

1 R1 1M Resistor,Chip,1/16-W,1% 603 Std Std 9100

2 R2 10K Resistor,Chip,1/16W,x% 603 Std Std 5,650

R3 10K Resistor,Chip,1/16W,x% 603 Std Std 5,650

1 R4 1M Resistor,Chip,1/16W,x% 603 Std Std 5,650

1 R5 1M Resistor,Chip,1/16W,1% 603 Std Std 5650

2 R6 10k Resistor,Chip,1/16W,1% 603 Std Std 5650

R7 10k Resistor,Chip,1/16W,1% 603 Std Std 5650

2 R8 1K Resistor,Chip,1/16W,x% 603 Std Std 5,650

R9 1K Resistor,Chip,1/16W,x% 603 Std Std 5,650

1 U1 TPS62111RSA IC,SynchronousStep-Down Converter,17V, QFN-16 TPS62111RSA TI 54289

1.2A

1 U2 TPS62353YZG IC,3MHz SynchronousStepDown Converter CSP-12 TPS62353YZG TI 12,000

withI2C, 800mA 1 U3 TPS62232DRY IC,3MHz UltraSmallStepDown Converter,x.xV QFN TPS62232DRY TI 6020 1 U4 TPS62231DRY IC,3MHz UltraSmallStepDown Converter,x.xV QFN TPS62232DRY TI 6020 Notes:1. These assembliesareESD sensitive,ESD precautionsshallbe observed. 2. These assembliesmust be cleanand freefromfluxand allcontaminants.Failuretouse cleanfluxisunacceptable. 3. These assembliesmust complywithworkmanshipstandardsIPC-A-610Class2. 4. Referencedesignatorsmarked withan asterisk('**')cannotbe substituted.Allothercomponents can be substitutedwithequivalentMFG 's components. 6 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS SLVA339A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated

Efficiency□-% 0.1 1 10 100 1000 I -□Output□Current□-□mAO V =□5□VIN V =□2.7□VIN V =□3.6□VIN V =□4.2□VIN MODE□=□GND, V =□1.8□V, L =□2.2 H□(MIPSA25202R2), C =□4.7 F OUT OUT /c109 /c109 V =□3.3□VIN V =□2.3□VIN 100 0.0001 0.001 0.01 0.1 10 1 I -□Output□Current- AO Efficiency□-□% 5□V 4.2□V 12□V 8.4□V V =□3.3□V T PFM□Mode O A =□25 C o www.ti.com BillofMaterials

4.1 TestResult

The start-upwaveform Figure3 specifiesthesequencingorderthatisrequired. Figure3.Sequencing inStart-upWaveform Figure4.Efficiencyvs Output Current Figure5.Efficiencyvs Output Current 7SLVA339A –June 2009–RevisedMay 2010 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS Copyright© 2009–2010,Texas InstrumentsIncorporated

Efficiency□-% 0.1 1 10 100 1000 I -□Output□Current□-□mAO MODE□=□GND, V =□1.2□V, L =□2.2 H□MIPSZ2012□2R2□(2012□size), C =□4.7 F OUT OUT /c109 /c109 V =□5□VIN V =□2.3□VIN V =□3.6□VIN V =□4.2□VIN V =□2.7□VIN 100 0.1 1 10 100 1000 Efficiency − % I − Output□CurrentO − mA V =□3.6□VI V =□1.35□V L =□1 H C =□10 F O O /c109 /c109 FPFM/PWM LPFM/PWM 3-MHz□PWM BillofMaterials www.ti.com Figure6.Efficiencyvs Output Current Figure7.Efficiencyvs Output Current 8 High-Vin,High-EfficiencyPower SolutionUsingDC/DC ConvertersWithDVFS SLVA339A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated

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Product Information

PTC36SAAN specifications and overview.

Summary

High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS

Description