PT6621L

PT6620_14 TI1 | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

Features

• Single Device: 6-A Output
• Input Voltage Range: 9 V to 16 V
• Adjustable Output Voltage
• 83 % Efficiency
• Remote Sense Capability
• Standby Function
• Over-Temperature Protection
• 16-pin Mount Option (Suffixes L, M, Q, & F) Pin Configuration Pin Function 1V o Sense

2 Do Not Connect

3 STBY*

7 GND

8 GND

9 GND

10 GND

11 Vout

12 Vout

13 Vout

14 Vo Adjust

SLTS036C - FEBRUARY 1999 - REVISED JUNE 2003 PT Series Suffix (PT1234x) Case/Pin Order Package Configuration Suffix Code * Vertical P (EED) Horiz D (EEA) SMD E (EEC) Horiz, 2-Pin Tab M (EEM) SMD, 2-Pin Tab L (EEL) Horiz, 2-Pin Ext Tab Q (EEQ) SMD, 2-Pin Ext Tab F (EEF) Vertical, Side Tab R (EEE) Horiz, Side Tab G (EEG) SMD, Side Tab B (EEK) * Previously known as package styles 400/410. (Reference the applicable package code draw- ing for the dimensions and PC board layout)

Description

The PT6620 series is a line of 12-V input Integrated Switching Regulators (ISRs). These regulators are designed for stand-alone operation in applications requiring as much as 6 A of output current. The PT6620 series is pack- aged in a 14-Pin SIP (Single In-line Package), which is available in either a vertical or horizontal configura- tions, including surface mount. Specifications Unless otherwise stated, Ta =25 °C, C2 =330 µF, Vin =12 V, Io =Iomax PT6620 SERIES Characteristics Symbols Conditions Min Typ Max Units Output Current I o Ta = 60 °C, 200 LFM, pkg P 0.1 (2) —6 ATa = 25 °C, natural convection 0.1 (2) —6 Input Voltage Range V in 0.1 A ≤ Io ≤ 6 A V o ≤ 5 V 9 — 16 V6 V ≤Vo ≤9 V V o + 3 — 16 Output Voltage Tolerance ∆Vo Ta = 0 to 60 °C Vo – 0.1 — V o + 0.1 V Output Voltage Adjust Range V oadj Pin 14 to V o or ground V o = 3.3 V 2.3 — 4.5 Vo = 1.5 V 1.4 — 2.6 Vo = 2.5 V 1.9 — 3.7 V Vo = 3.6 V 2.5 — 4.8 Vo = 5 V 2.9 — 6.5 Vo = 9 V 5.2 — 10 Line Regulation Reg line Vin(min) ≤Vin ≤Vin(max) — ±0.5 ±1 %V o Load Regulation Reg load 0.1 ≤ Io ≤6 A — ±0.5 ±1 %V o Vo Ripple (pk-pk) V r 20 MHz bandwidth, V o < 6 V — 50 — mVpp Vo > 6 V — 1 — %V o Transient Response 1 A/µs load step, 50 to 100% I o max ttr Recovery time — 100 — µSec ∆Vtr Vo over/undershoot — 150 — mV Efficiency η Io =3 A V o=3.3/3.6 V — 84 — Vo = .5 V — 68 — Vo =2.5 V — 76 — % Vo =5.0 V — 86 — Vo =9.0 V — 93 — Io =6 A V o=3.3/3.6 V — 83 — Vo =1.5 V — 66 — Vo =2.5 V — 75 — % Vo =5.0 V — 85 — Vo =9.0 V — 92 — Switching Frequency ƒ s Vin(min) ≤Vin≤Vin(max) PT6622 500 550 600 kHz

0.1 A ≤ Io ≤ 6 A Except PT6622 550 650 750 kHz

For technical support and more information, see inside back cover or visit www.ti.com PT6621/6622/6623P , Vo ≤3.3 V Note A: All characteristic data in the above graphs has been develped from actual products tested at 25 °C. This data is considered ty pical for the ISR. Note B: SOA curves represent operating conditions at which internal components are at or below manufacturer’s maximum rated operating temperatures. Efficiency vs Output Current Efficiency (%) Output Current (A) PT6620 Series @Vin=12 V (See Note A) PT6625P , Vo =5 VOutput Ripple vs Output Current Power Dissipation vs Output Current Output Current (A) Output Current (A) Ripple (mVpp)Pd (Watts) Safe Operating Area, Vin =12 V (See Note B) PT6626P , Vo =9 V 100 0123456 PT6621 PT6622 PT6623 PT6625 PT6626 0123456 PT6621 PT6622 PT6623 PT6625 PT6626

0123456 PT6621

Specifications (continued) PT6620 SERIES Characteristics Symbols Conditions Min Typ Max Units Operating Temperature Range T a Over Vin range –40 — +85 (3) °C Storage Temperature T s — –40 — +125 °C Mechanical Shock — Per Mil-STD-883D, Method 2002.3 — 500 — G’s Mechanical Vibration — Per Mil-STD-883D, Method 2007.2, — 7.5 — G’s20–2000 Hz, soldered in a PC board Weight — — — 14 — grams Notes: (1) The PT6620 Series requires a 330 µF(output) and 100 µF(input) electrolytic capacitors for proper operation in all applications. (2) ISR will operate down to no load with reduced specifications (3) See safe Operating Area curves or contact the factory for the appropriate derating.

6 A 12-V Input

Integrated Switching Regulator PT6620 Series 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 Iout (A) Ambient Temperature (°C) 200LFM 120LFM 60LFM Nat conv Airflow 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 Iout (A) Ambient Temperature (°C) Nat conv 60LFM 120LFM 200LFM Airflow 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 Iout (A) Ambient Temperature (°C) Nat conv 60LFM 120LFM 200LFM Airflow SLTS036C - FEBRUARY 1999 - REVISED JUNE 2003

For technical support and more information, see inside back cover or visit www.ti.com PT6620 Series Adjusting the Output Voltage of the PT6620 6 A, 12-V Bus Converter Series The output voltage of the Power Trends PT6620 Series ISRs may be adjusted higher or lower than the factory trimmed pre-set voltage with the addition of a single external resistor. Table 1 accordingly gives the allowable adjustment range for each model in the series as V a (min) and Va (max). Adjust Up: An increase in the output voltage is obtained by adding a resistor R2, between Vo Adjust (pin 14) and GND (pins 7-10). Adjust Down: Add a resistor (R1), between Vo Adjust (pin 14 ) and Vout (pins 11-13). Refer to Figure 1 and Table 2 for both the placement and value of the required resistor, either (R1) or R2 as appropriate. Notes: 1. Use only a single 1% resistor in either the (R1) or R2 location. Place the resistor as close to the ISR as possible. 2. Never connect capacitors from Vo Adjust to either GND, Vout, or the Remote Sense pin. Any capacitance added to the Vo adjust pin will affect the stability of the ISR. 3. If the Remote Sense feature is being used, connecting the resistor (R1) between Vo Adjust (pin 14) and Remote Sense (pin 1) can benefit load regulation. 4. The minimum input voltage required by the part is Vout + 3, or 9 V, whichever is higher. Figure 1 C in C out (R1) Adj Down Adjust Up Vo COMCOM Vin PT6620 11,12,13 147,8,9,10 4,5,6 Vin Vo GND Vo (ad j)STBY Vsense L O A D The values of (R1) [adjust down], and R2 [adjust up], can also be calculated using the following formulae. Ro (Va – 1.25)(R1) = (Vo – Va) – Rs kΩ

1.25 Ro – Rs kΩR2 = Va - Vo

Where: Vo = Original output voltage Va = Adjusted output voltage Ro = The resistance value in Table 1 Rs = The series resistance from Table 1 Table 1 PT6620 ADJUSTMENT AND FORMULA PARAMETERS Series Pt # PT6622 PT6623 PT6621 PT6624 PT6625 PT6626

Application Notes continued For technical support and more information, see inside back cover or visit www.ti.com Table 2 PT6620 ADJUSTMENT RESISTOR VALUES Series Pt # PT6622 PT6623 PT6621 PT6624 PT6625 Series Pt # PT6625 PT6626 Vo (nom) 1.5 V 2.5 V 3.3 V 3.6 V 5 V V o (nom) 5 V 9 V Va (req’d) Va (req’d) 1.5 5.3 55.4 k Ω (1.1) kΩ 4.9 (579.0) kΩ 9.8 6.8 k Ω 5.0 10.0 3.0 k Ω 5.1 190.0 kΩ R1 = (Blue) R2 = Black PT6620 Series

For technical support and more information, see inside back cover or visit www.ti.com PT6620 Series Using the Standby Function on the PT6620 Series of 12-V Bus Converters For applications requiring output voltage On/Off control, the 14-pin PT6620 ISR series incorporates a standby function. This feature may be used for power-up/shut- down sequencing, and wherever there is a requirement for the output status of the module to be controlled by external circuitry. The standby function is provided by the STBY* control, pin 3. If pin 3 is left open-circuit the regulator operates normally, providing a regulated output whenever a valid supply voltage is applied to V in (pins 4, 5, & 6) with respect to GND (pins 7-10). Connecting pin 3 to ground 1 will disable the regulator output and reduce the input current to less than 30 mA 3. Grounding the standby control will also hold-off the regulator output during the period that input power is applied. The standby input is ideally controlled with an open- collector (or open-drain) discrete transistor (See Figure 1). It can also be driven directly from a dedicated TTL 2 compatible gate. Table 1 provides details of the threshold requirements. Table 1 Inhibit Control Thresholds (1,2) Parameter Min Max Enable(VIH) 1 V 5 V Disable(VIL) –0.1V 0.3V Notes: 1. The Standby input on the PT6620 regulator series may be controlled using either an open-collector (or open-drain) discrete transistor, or a device with a totem-pole output. A pull-up resistor is not necessary. The control input has an open-circuit voltage of about 1.5 Vdc. To disable the regulator output, the control pin must be “pulled” to less than 0.3 Vdc with a low-level 0.25 mA max. sink to ground. 2. The Standby input on the PT6620 series is also compatible with TTL logic. A standard TTL logic gate will meet the

0.3 V V

IL(max) requirement (Table 1 ) at 0.25 mA sink current. Do not drive the Standby control input above 5 Vdc. 3. When the regulator output is disabled the current drawn from the input source is reduced to approximately 15 mA (30 mA maximum). 4. The turn-off time of Q1, or rise time of the standby input is not critical on the PT6620 series. Turning Q1 off slowly, over periods up to 100 ms, will not damage the regulator. However, a slow turn-off time will increase both the initial delay and rate-of-rise of the output voltage. Figure 1 Turn-On Time: Turning Q1 in Figure 1 off, removes the low-voltage signal at pin 3 and enables the output. The PT6620 series of regulators will provide a fully regulated output voltage within 20ms. The actual turn-on time may vary with load and the total amount of output capacitance. Figure 2 shows the typical output voltage waveform of a PT6625 (5 V) following the prompt turn off of Q 1 at time t =0 secs. The waveform was measured with a 12-V input voltage, and 5-A resistive load. Figure 2 C in C out Inhibit V in V o COMCOM BSS138 +5V V in PT6620 11,12,13 147,8,9,10 4,5,6 Vin Vo GND Vo(adj)STBY Vsense 02468 1 0 1 2 1 4 1 6 1 8 t (milli - secs) Vo (2V/Div)

www.ti.com 2-Feb-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PT6621B LIFEBUY SIP MODULE EEK 14 TBD Call TI Call TI -40 to 85 PT6621E OBSOLETE SIP MODULE EEC 14 TBD Call TI Call TI -40 to 85 PT6621F LIFEBUY SIP MODULE EEF 14 TBD Call TI Call TI -40 to 85 PT6621L LIFEBUY SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6621M LIFEBUY SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6621Q LIFEBUY SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85 PT6622B LIFEBUY SIP MODULE EEK 14 TBD Call TI Call TI -40 to 85 PT6622E LIFEBUY SIP MODULE EEC 14 TBD Call TI Call TI -40 to 85 PT6622F LIFEBUY SIP MODULE EEF 14 TBD Call TI Call TI -40 to 85 PT6622G LIFEBUY SIP MODULE EEG 14 TBD Call TI Call TI -40 to 85 PT6622L LIFEBUY SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6622M LIFEBUY SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6622Q LIFEBUY SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85 PT6622R LIFEBUY SIP MODULE EEE 14 TBD Call TI Call TI -40 to 85 PT6623B NRND SIP MODULE EEK 14 TBD Call TI Call TI -40 to 85 PT6623D NRND SIP MODULE EEA 14 TBD Call TI Call TI -40 to 85 PT6623E NRND SIP MODULE EEC 14 TBD Call TI Call TI -40 to 85 PT6623G NRND SIP MODULE EEG 14 TBD Call TI Call TI -40 to 85 PT6623L NRND SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6623M NRND SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6623Q NRND SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85 PT6623R NRND SIP MODULE EEE 14 TBD Call TI Call TI -40 to 85 PT6624B NRND SIP MODULE EEK 14 TBD Call TI Call TI -40 to 85 PT6624E NRND SIP MODULE EEC 14 TBD Call TI Call TI -40 to 85 PT6624F NRND SIP MODULE EEF 14 TBD Call TI Call TI -40 to 85 PT6624G NRND SIP MODULE EEG 14 TBD Call TI Call TI -40 to 85 PT6624L NRND SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6624M NRND SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6624P NRND SIP MODULE EED 14 TBD Call TI Call TI -40 to 85 PT6624Q NRND SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85

www.ti.com 2-Feb-2014 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PT6624R NRND SIP MODULE EEE 14 TBD Call TI Call TI -40 to 85 PT6625F LIFEBUY SIP MODULE EEF 14 TBD Call TI Call TI -40 to 85 PT6625L LIFEBUY SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6625M LIFEBUY SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6625Q LIFEBUY SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85 PT6626B LIFEBUY SIP MODULE EEK 14 TBD Call TI Call TI -40 to 85 PT6626E LIFEBUY SIP MODULE EEC 14 TBD Call TI Call TI -40 to 85 PT6626F LIFEBUY SIP MODULE EEF 14 TBD Call TI Call TI -40 to 85 PT6626G OBSOLETE SIP MODULE EEG 14 TBD Call TI Call TI -40 to 85 PT6626L LIFEBUY SIP MODULE EEL 14 TBD Call TI Call TI -40 to 85 PT6626M LIFEBUY SIP MODULE EEM 14 TBD Call TI Call TI -40 to 85 PT6626Q LIFEBUY SIP MODULE EEQ 14 TBD Call TI Call TI -40 to 85 PT6627D NRND SIP MODULE EEA 14 TBD Call TI Call TI PT6627E NRND SIP MODULE EEC 14 TBD Call TI Call TI PT6627F NRND SIP MODULE EEF 14 TBD Call TI Call TI PT6627G NRND SIP MODULE EEG 14 TBD Call TI Call TI PT6627L NRND SIP MODULE EEL 14 TBD Call TI Call TI PT6627M NRND SIP MODULE EEM 14 TBD Call TI Call TI PT6627P NRND SIP MODULE EED 14 TBD Call TI Call TI PT6627Q NRND SIP MODULE EEQ 14 TBD Call TI Call TI PT6627R NRND SIP MODULE EEE 14 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

www.ti.com 2-Feb-2014 Addendum-Page 3 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MPSI013 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEA (R–PSIP–T14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3-place decimals are E. Recommended mechanical keep-out area. F. No copper, power or signal traces in this area. G. D-suffix parts include a metal heat spreader. No signal traces are allowed under the heat spreader area. A solid copper island is recommended, which may be grounded. A-suffix does not include a metal heat spreader. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). 1.71 (43,43) MAX. (9,65) 0.38 0.59 (14,98) MAX. 1.22 (30,98) 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E Note G (10,66) 0.42 MAX. 0.017 (0,43) TYP. PC Layout Plated through 0.100 (2,54) 13 Places ø0.035 (0,88) MIN. 14 Places 0.040 (1,01) MIN. 0.140 (3,55) 1.42 (36,06) 1.77 (44,95) Note F 0.040 1.31 (33,27) 0.235 (5,96) (1,77)0.07 (1,01) 0.20 (5,08) (4,44) 0.175 4202005/A 02/01 (13,20) 0.52 0.012 (0,30) 0.018 (0,45)

MPSI014A – MARCH 2001 – REVISED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEK (R–PSIP–G14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. E. Recommended mechanical keep-out area. F. The metal tab is isolated but electrically conductive. No signal traces are allowed under the metal tab area. A solid copper island is recommended, which may be grounded. G. Power pin connections should utilize two or more vias per input, ground and output pin. H. No copper, power or signal traces in this area.2–place decimals are/C00340.030 (/C00340, 76 mm). 3–place decimals are/C00340.010 (/C00340, 25 mm). (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E, F Note F 0.080 (2,02) MIN PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. 2.36 (62,48) MAX. (8,25) 0.325 2.000 (50,80) 0.61 (15,49) 0.41(10,41) (21,08) 0.83 0.19 (4,82) 0.350 (8,89) ø0.187 (4,74) (30,06)1.42 (44,95)1.77 2.000(50,80) (61,46)2.42 (4,44) 0.175 0.325 (8,25) Hole for #6–32 screws Note H 0.64 (16,25) (21,84) 0.86 (34,29) 1.35 0.235 (5,97) 0.350 (8,89) 0.100 (2,54) 13 Places 0.040 (1,01) 14 Places Note G 0.150 (3,81) (4,32) 0.17 (2,54) 0.10 0.040 (1,01) (0,43)Gage Plane 0.017 TYP. Seating Plane MAX. (10,66) 0.42

2 Places

0°–7° 0.006 (0,15) MAX. Suffix B

MPSI015A – MARCH 2001 – REVISED JANUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEC (R–PSIP–G14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. E. Recommended mechanical keep-out area. F. E-suffix parts include a metal heat spreader. No signal traces are allowed under the heat spreader area. A solid copper island is recommended, which may be grounded. C-suffix does not include a metal heat spreader. G. Power pin connections should utilize two or more vias per input, ground and output pin. H. No copper, power or signal traces in this area.2–place decimals are/C00340.030 (/C00340, 76 mm). 3–place decimals are/C00340.010 (/C00340, 25 mm). 1.71 (43,43) MAX. (9,65) 0.38 0.59 (14,98) MAX. 1.22 (30,98) 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E, F Note F PC LAYOUT 0.100 (2,54) 13 Places 0.080 (2,02) MIN. 1.42 (36,06) 1.77 (44,95) Note H 1.35 (34,29) 0.235 (5,96) (4,44) 0.175 0.040 (1,01) 14 Places See Note G 0.150 (3,81) 0.10 (2,54) 0.17 (4,31) (0,43)0.017Gage Plane TYP 0.040 (1,01) Seating Plane MAX. (10,66) 0.42 0.006 (0,15) MAX. 4202007/B 12/01 (13,20) 0.52 0°–7° 0.012 (0,30) 0.018 (0,45) Suffix E, C (Note F)

MPSI016A – MARCH 2001 – REVISED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEG (R–PSIP–T14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3-place decimals are E. Recommended mechanical keep-out area. F. The metal tab is isolated but electrically conductive. No signal traces are allowed under the metal tab area. A solid copper island is recommended, which may be grounded. G. No copper, power or signal traces in this area. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E, F Note F 0.42 (10,66) MAX. 0.040 (1,01) 0.017 (0,43) TYP. PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. 2.36 (62,48) MAX. (8,25) 0.325 2.000 (50,80) 0.61 (15,49) 0.41 (10,41) (21,08) 0.83 (4,82) 0.19 0.350 (8,89) ø0.187 (4,74) (30,06)1.42 (44,95)1.77 2.000(50,80) (61,46)2.42 (4,44) 0.175 0.325(8,25) Hole for #6–32 screws Note G (16,51) 0.65 (21,84) 0.86 (33,27) 1.31 0.235 (5,97) 0.350 (8,89) 0.100 (2,54) 13 Places(1,77) 0.07 (5,08) 0.20 0.040 (1,01)ø0.035 (0,88) MIN. 14 Places Plated through 0.140 MIN. (3,55) 4202008/B 02/02 Suffix G

MPSI017 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EED (R–PSIP–T14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3-place decimals are E. Recommended mechanical keep-out area. F. P-suffix parts include a metal heat spreader. The heat spreader is isolated but electrically conductive, it can be grounded. N-suffix does not include a metal heat spreader. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). 1.71 (43,43) MAX. (9,65) 0.38 0.59 (14,98) MAX. 1.22 (30,98) 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E Note F (10,66) 0.42 MAX. PC LAYOUT 1.77 (44,95) 0.235 (5,96) Plated through 0.100 (2,54) 13 Places ø0.035 (0,88) MIN. 14 Places (10,66) 0.42 0.040 (1,01) 4202009/A 02/01 (13,20) 0.52 0.012 (0,30) 0.018 (0,45)

MPSI018A – MARCH 2001 – REVUSED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEE (R–PSIP–T14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3-place decimals are E. Recommended mechanical keep-out area. F. The metal tab is isolated but electrically conductive, it can be grounded. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note F 0.42 (10,66) MAX. 0.017(0,43) TYP. PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. 2.36 (62,48) MAX. (8,25) 0.325 2.000 (50,80) 0.61 (15,49) 0.41 (10,41) (21,08) 0.83 (4,82) 0.19 0.350 (8,89) ø0.187 (4,74) Note E 0.170 (4,31) MIN. 1.77 (44,95) 0.235 (5,96) Plated through 0.100 (2,54) 13 Places ø0.035 (0,88) MIN. 14 Places 2.42 (61,46) (8,25) 0.325 0.040 (1,01) 0.42 (10,66) (1,77) 0.07 (2,79) 0.11

MPSI019A – MARCH 2001 – REVISED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEF (R–PSIP–G14) PLASTIC SINGLE-IN-LINE MODULE 0.080 (2,02) MIN. NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3–place decimal are E. Recommended mechanical keep-out area. F. The metal tab is isolated but electrically conductive. No signal traces are allowed under the metal tab area. A solid copper island is recommended, which may be grounded. G. Power pin connections should utilize two or more vias per input, ground and output pin. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E,F PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. 2.36 (62,48) MAX. (8,25) 0.325 2.000 (50,80) 0.61 (15,49) 0.41 (10,41) (21,08) 0.83 0.19 (4,82) 0.350 (8,89) 0.080 (2,03) 2 Places (5,33) 0.210(2,16) 0.085 (9,65) 0.38 (7,11) 0.280 (8,38) 0.33 Note H Note K ø0.187 (4,74) (30,06)1.42 (44,95)1.77 2.000(50,80) (61,46)2.42 (4,44) 0.175 0.325 (8,25) Hole for #6–32 screws (13,84) 0.545 Note L (16,25) 0.64 (21,84) 0.86 (28,44) 1.120 (34,29) 1.35 CLL Cto LC toCL 0.235 (5,97) 0.350 (8,89) 0.100 (2,54) 13 Places 0.040 (1,01) 14 Places Note G 0.150 (3,81) (4,32) 0.17 (2,54) 0.10 0.71 (18,07) (22,11) 0.87 Note J 0.040 (1,01) Gage Plane 0.017 (0,43) TYP. Note F Seating Plane 0.42 (10,66) MAX. 0°–7° 0.210 (5,33) 0.19 (4,82) 0.040 (1,01) 0.006 (0,15) MAX. H. Minimum copper land area required for solder tab. Vias are recommended to improve copper adhesion or connect land to other ground area.I J. Underside solder tabs detail. K. Solder mask openings to copper island for solder joints to mechanical pins. L. No copper, power or signal traces in this area. Suffix F

MPSI020 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEL (R–PSIP–G14) PLASTIC SINGLE-IN-LINE MODULE 0.006 (0,15) MAX. (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. 0.205 (5,20) Note E Note F 0.080 (2,02) MIN. PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. (30,06)1.42 (44,95)1.77 0.175 (4,44) (13,84) 0.545 Note L (28,44) 1.120 (34,29) 1.35 CLL CtoLC toCL 0.235 (5,97) 0.100 (2,54) 13 Places 0.035 (0,88) 14 Places Note G 0.150 (3,81) 0.17 (4,32) (2,54) 0.10 0.71 (18,07) (22,11) 0.87 Note J 0.017 (8,38) 0.085 (2,16) Gage Plane (7,11) (5,33) (9,65) 0.38 0.210 0.280 0.080 2 Places TYP. Note K Note H (2,03) (0,43) Seating Plane(10,66) 0.42 MAX. 0.040 (1,01) 0.33 0.042 0.036(0,91) (1,06) 4202012/A 02/01 0.19 (4,82) 0°–7° 0.210 (5,33) 0.040 (1,01) NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. E. Recommended mechanical keep-out area. F. The metal tab is isolated but electrically conductive. No signal traces are allowed under the metal tab area. A solid copper island is recommended, which may be grounded. G. Power pin connections should utilize two or more vias per input, ground and output pin. H. Minimum copper land area required for solder tab. Vias are recommended to improve copper adhesion or connect land to other ground area. J. Underside solder tabs detail K. Solder mask openings to copper island for solder joints to mechanical pins. L. No copper, power or signal traces in this area. 2–place decimals are/C00340.030 (/C00340, 76 mm). 3–place decimals are/C00340.010 (/C00340, 25 mm).

MPSI021 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 EEM (R–PSIP–T14) PLASTIC SINGLE-IN-LINE MODULE NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. C. 2-place decimals are D. 3-place deciamals are E. Recommended mechanical keep-out area. F. No copper, power or signal traces in this area. G. The metal tab is isolated but electrically conductive. No signal traces are allowed under the metal tab area. A solid copper island is recommended, which may be grounded to the two underside pins. /C00340.030 (/C00340, 76 mm). /C00340.010 (/C00340, 25 mm). (13,20) 0.52 0.100 (2,54) TYP. 0.017 (0,43) TYP. Note E Note G (10,66) 0.42 MAX. 0.017 (0,43) TYP. PC LAYOUT 1.22 (30,98) MAX. 0.38 (9,65) (14,98) 0.59 1.71 (43,43) MAX. 1.42 (30,06) 1.77 (44,95) 0.175 (4,44) Note F (33,27) 1.31 0.235 (5,97) 0.100 (2,54) 13 Places (1,77) 0.07 ø0.035 (0,88) MIN. 14 Places Plated through (1,01) 0.040 0.040 (1,01) 1.040 (26,41) 0.140 (3,55) MIN. 0.032 (0,81) LCCL to (18,54) 0.73 0.210 (5,33) 0.040 (1,01) Note G 0.036 0.042 (0,91) (1,06) 0.205 (5,20) 0.040 (1,01) 0.20 (5,08) 4202013/A 02/01 Plated through ø0.070 (1,77) MIN. 2 Places (26,41) 1.040 0.080 (2,03) (2,54) 0.100 3 Places0.917 (23,29) (19,81) 0.78 (5,33) 0.210

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated