PSTG25HDT MEDER | Alldatasheet

Document overview

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Technical content

Features

  • Package with DCB ceramic base plate and soldering pins for PCB mounting
  • Isolation voltage over 3000 V∼
  • Trench Gate
  • Enhancement Mode N-Channel Device
  • Non Punch through Structure
  • High Switching Speed
  • Low On-state Saturation Voltage
  • High Input Impedance Simplifies Gate Drive
  • Latch-Free Operation
  • Fully Short Circuit Rated to 10 µs
  • Wide RBSOA

Applications

  • High Frequency Inverters
  • Motor Control
  • Switch Mode Power Supplies
  • High Frequency Welding
  • UPS Systems
  • PWM Drives Caution: These devices are sensitive to electrostatic discharge. Users should observe proper ESD handling precautions. MB H C LN A G NT C Preliminary Data Sheet

POWERSEM GmbH, Walpersdorfer Str. 53

91126 D- Schwabach

Phone: 09122 - 9764-0 Fax.: 09122 - 9764-20  2005 POWERSEM reserves the right to change limits, test conditions and dimensions NTC 25°C 470 kΩ Symbol Test Conditions Characteristic Value typ. max. ICES VCE = VCES, VGE = 0 V, TVJ = 25°C 0.2 mA TVJ = 125°C 1 mA IGES VCE = 0 V, VGE = ±20 V 500 nA VCE(sat) IC = 25A, VGE = 15 V TVJ = 25°C 1.9 2.3 V TVJ = 125°C 2.1 V VGE(th) IC = 25A, VGE = VCE 7 V td(on) 170 ns tr Inductive load, TVJ = 125°C 17 ns td(off) VCE = 50% VCEs, IC = 25 A 340 ns tf RG = 5 Ω, VGE = ±15 V 60 ns Eon 2 mJ Eoff 3.5 mJ Cies VCE = 75 V, VGE = 15 V, f= 1 MHz 8000 pF Coes VCE = 75 V, VGE = 15 V, f= 1 MHz 340 pF Cies VCE = 75 V, VGE = 15 V, f= 1 MHz 50 pF VFM IF = 25 A, TVJ = 25°C 1.9 V TVJ = 125°C 1.92 V trr IF = 25 A, diRR / dt = 200 A/µs, 90 ns IRRM VR = 50% VRRM 12 A Package style and outline Dimensions in mm (1mm = 0.0394“)