PSSB05P PROTEC | Alldatasheet

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Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 1

05336 PSSB05P

ultRa lOW CaPaCItaNCE - SuPER SPEE d BuS PROtECtION - tVS aRRaY dESCRIP tION The PSSB05P is an ultra low capacitance transient voltage suppressor array, designed to protect super speed bus ap- plications such as USB 3.0, HDMI1.4 and eSATA from the damaging effects of Electrostatic Discharge and Electrical Fast Transients. The PSSB05P meets IEC 61000-4-2 (ESD) and IEC 61000-4-4 (EFT) requirements. At higher operating frequencies or faster edge rates, insertion loss and signal integrity are a major concern. This device offers an ultra low capacitance and low leakage current in a miniature DFN-2-0402 package.FEatuRES

  • Compatible with IEC 61000-4-2 (ESD): Air(Level 2) 6kV, Contact(Level 3) 6kV
  • Compatible with IEC 61000-4-4 (EFT)
  • Compatible with IEC 61000-4-5 (Surge)
  • 20 Watts Peak Pulse Power per Line (tp = 8/20µs)
  • ESD Protection
  • Low Clamping Voltage
  • Protects One Bidirectional Line
  • Ultra Low Capacitance: 0.3 pF Typical
  • RoHS Compliant
  • REACH Compliant MEChaNIC al ChaRaCtERIS tICS
  • Molded JEDEC DFN-2-0402 Package
  • Approximate Weight: 2 milligrams
  • Lead-Free Pure-Tin Plating (Annealed)
  • Solder Reflow Temperature: Pure-Tin - Sn, 100: 260-270°C
  • 8mm Tape and Reel Per EIA Standard 481
  • Flammability Rating UL 94V-0

aPPlICatIONS

  • USB 3.0 Interface
  • HDMI 1.4
  • Gigabit Ethernet
  • eSATA PIN CONFIG uRatION dFN-2 PaCkaGE

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 2 tYPIC al d EVICE ChaRaCtERIS tICS MaXIM uM RatINGS @ 25°C unless Otherwise Specified PaRaMEtER SYMBO l ValuE uNItS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 20 Watts Operating Temperature TA -55 to 150 °C Storage Temperature TSTG -55 to 150 °C ElECtRIC al ChaRaCtERIS tICS PER lINE @ 25°C unless Otherwise Specified PaRt NuMBER dEVICE MaRkING RatEd StaNd-OFF VOltaGE VWM VOltS MINIM uM BREakd OWN VOltaGE @ 1ma V(BR) VOltS MaXIM uM ClaMPING VOltaGE (Fig. 2) @IP = 1a VC VOltS MaXIM uM lEakaGE CuRREN t @VWM Id µa tYPIC al CaPaCItaNCE @0V, 1Mhz CJ pF PSSB05P S 5.0 6.0 20 1 0.3

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 3 tYPIC al d EVICE ChaRaCtERIS tICS FIG uRE 1 PEak PulSE POWER VS PulSE tIME td - Pulse duration - µs 20W, 8/20µs Waveform 0.1 1 10 100 1,000 10,000 PPP - Peak Pulse Power - Watts 100 1,000 TEST WAVEFORM PARAMETERS t f = 8µs td = 20µs tf e-t Peak Value IPP td = t/(IPP/2) FIG uRE 2 PulSE WaVE FORM t - time - µs 0 5 10 15 20 25 30 IPP - Peak Pulse Current - % of IPP 100 120

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 4 taBlE 1 - SPICE PaRaMEtERS PaRaMEtER uNIt aBd/tVS(d3) lCRd (d1) lCRd (d2) BV V 11.50 100 100 IBV mA 1 1 1 Cjo pF 60 0.3 0.3 IS A 1E-11 1E-11 1E-11 Vj V 0.6 0.6 0.6 M - 0.4 0.01 0.01 N - 1.1 1.1 1.1 RS Ohms 2.9 1.7 1.7 TT s 1E-9 1E-9 1E-9 EG eV 1.11 1.11 1.11 FIG uRE 1 SPICE MOdEl ABD (D3) - Avalanche Breakdown Diode (TVS) LCRD (D1/D2): Low Capacitance Rectifier Diode I/O

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 5 tYPIC al d EVICE ChaRaCtERIS tICS FIG uRE 3 EYE dIaGRaM - uSB 3.0

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 6 D+, D- Rx+, Rx- Tx+, Tx- GND GND VDD FIG uRE 1 - uSB 3.0 P ROtECtION Six PSSB05P devices placed right at the entry point of the connector or at the individual transmission traces. The PSSB05P provides dedicated ESD protection for each super high speed line for the USB interface. PCB traces are not constrained by the protection devices and can be routed in a manner that best suits the de- sign. These devices can also provide protection for USB 2.0 applications. CIRC uIt BOaRd RECOMMEN datIONS Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:

  • The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces.
  • The path length between the TVS device and the protected line should be minimized.
  • All conductive loops including power and ground loops should be minimized.
  • The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
  • Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 7 dFN-2-0402 PaCkaGE INFORM atION Outl INE dIMENSIONS dIM MIllIME tERS INC hES MIN MaX MIN MaX A 0.90 1.05 0.035 0.041 B 0.51 0.65 0.02 0.024 C 0.51 0.60 0.02 0.024 L1 0.45 0.55 0.018 0.022 L2 0.18 0.30 0.007 0.012 L4 0.65 BSC 0.026 BSC NOtES 1. Dimensioning and tolerances per ANSI Y14.M, 1985. 2. Controlling dimension: inches. 3. Dimensions are exclusive of mold flash and metal burrs. Pad laYOut d IMENSIONS dIM MIllIME tERS INC hES MIN MaX MIN MaX A 1.30 1.50 0.051 0.059 B 0.60 0.70 0.024 0.028 C 0.40 0.55 0.016 0.022 NOtES 1. Controlling dimension: inches. AL4 B C BOTTOM VIEW TOP VIEW B A C H SIDE VIEW

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 8 BaSE PaRt NuMBER lEadFREE S uFFIX taPE S uFFIX QtY/REEl REE l SIZE tuBE QtY PSSB05P n/a -T710 10,000 7” n/a

10 Pitches Cumulative

Tolerance on tape ± 0.2 WF EP2 P0D P T User Direction of Feed Top Cover Tape SPECIFIC atIONS REEl dIa. taPE WIdth a0 B0 k0 d E F W P0 P2 P tmax NOtES 1. Dimensions are in millimeters. 2. Surface mount product is taped and reeled in accordance with EIA-481. 3. Suffix - T710 = 7” Reel - 10,000 pieces per 8mm tape. 4. Marking on Part - marking code (see page 2). Package outline, pad layout and tape specifications per document number 06094.R1 3/11 - Option 2.

Only One Name Means ProTek’Tion™ www.protekdevices.com05336.R0 3/11 Page 9 ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), in- ductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. COPYRIGHT © ProTek Devices 2010 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. CONtaCt uS Corporate headquarters

2929 South Fair Lane

Tempe, Arizona 85282 USA By telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com Web www.protekdevices.com www.protekanalog.com