PSR-4000 PF9

PSR-4000PF9L TAIYO | Alldatasheet

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2007.01 Z TAIWAN TAIYO INK CO.,LTD TEL:886-3-483-3231 FAX:886-3-483-3599 PSR-4000 PF9L / CA-40 PF9 (PSR-4000GW / CA-40GW) 1. FEATURES : PSR-4000 PF9L / CA-40 PF9 is a liquid photo imageable hole plugging ink ( alkaline development type ), used for screen printing. Which has the characteristic such as gnot appear the crack ghollow are less gfine blistering resistance gtack dry window are wider gfine solvent resistance 2. SPECIFICATION : Main agent PSR-4000 PF9L Hardener CA-40 PF9 Color* Green Mixing ratio Main agent : 70 / Hardener : 30 ( By weight ) Viscosity* 150 dPa ‧ s ( C o n e / P l a t e V i s c o m e t e r , 5 m i n-1 / 25Ċ) Tack free window* 80Ċ / 7 0 m i n ( M a x i m u m ) Exposure energy* 300 ~ 500 mJ/cm 2 ( o n t h e s o l d e r m a s k ) Pot life* 24 hours ( stored in dark place at less than 25 Ċ ) Shelf life** 6 m o n t h s ( stored in dark place at less than 25Ċ ) * : After mixing ** : After manufacturing

/CA-40 PF9 3. PROCESS CONDITION PROCESS RANGE PWB FR – 4 , 1.6 mm Pre-treatment Acid treatment ÷ brushing Printing 100 mesh-count 90 ~ 125 mesh Hold time 10 min 10 ~ 20 min Tack free ¾ Both sides simultaneous exposure 1 st printing : 80Ċ / 15 min 2nd printing : 80Ċ / 25 min ( Hot air convention oven ) ¾ Single side exposure 80Ċ / 30 min ( Hot air convection oven ) 80Ċ / 10~20 min 80Ċ / 20~30 min 80Ċ / 20~40 min Exposure 400 mJ/cm 2 ( on the solder mask ) 300 ~ 500 mJ/cm 2 Hold time 10 min 10 ~ 20 min Development Aqueous alkaline solution : 1 wt% Na 2CO3 Temperature of developer : 30 Ċ Spray pressure : 0.196 MPa Developing time : 60 sec 0.196 ~ 2.45 MPa 60 ~ 90 sec Water rinse Temperaturej 25Ċ Spray pressurej0.098 MPa Dwelling timej 45sec 30Ċ or below 0.098~0.147Mpa 45~60 sec Post cure 80Ċ / 30 min ÷ 110Ċ / 30min, 150 Ċ 60min ( Hot air convection oven ) 4. ATTENTION ON EACH PROCESS : ¾ As to the operation environment. It is desirable to deal with the ink under the yellow lamps in the clean room. Please avoid using it under white fluorescent lamps or sunlight (directly or indirectly). ¾ The adequate thickness is 10 ~ 20 um (on the copper after curing). Thin coating possibly reduces its solder heat resistance. On the other hand, thick coating possibly causes the under -cut or low tackiness. ¾ Please set the pre-cure conditions and tack free window after the confirm ation test because they are influenced according to the type of the drying machine and the quantity of the board to be dried.

/CA-40 PF9 ¾ Please set th e exposing energy after the confirmation test of under-cut, surface gloss, back side exposure and so on because it is influenced according to the material of the board, the thickness of ink, etc. ¾ Regarding the developing process, please control the developer density , the temperature, the spray pressure and the developer time, etc. The inadequacy of control causes the degradation of the developability and the increase of under -cut. ¾ Please set the post cure conditions considering the curing time of the m arking ink. Insufficient curing or over curing may cause the degradation of properties. 5. CHARACTERISTIC (1) TACK FREE TOLERANCE WINDOW : Drying time ( 80Ċ / min ) 50 60 70 80 Developability ´ ´ ´ Ō (2) PHOTO SENSITIVITY : Item Thickness Energy Developing time Sensitivity 200 mJ/cm2 5 step 300 mJ/cm2 6 step Sensitivity Kodak No.2 (Step density tablet) 22 Ô 2 DŽm 400 mJ/cm2 60 sec. 7 step 200 mJ/cm2 50DŽm 300 mJ/cm2 50DŽm Resolution (Between QFP) 40 Ô 2 DŽm 400 mJ/cm2 60 sec. 50DŽm The exposure energy is measured on the solder mask by using ORC HMW-680,7Kw,metal halide lamp.

/CA-40 PF9 (3) PROPERTIES : Item Test method Test result Adhesion GIF-007AA Standard Cross-cut tape stripping test 100 / 100 Pencil hardness GIF-009AA Standard On copper foil, no Cu exposure 6H (min) Solder heat resistance Solder float test : Rosin flux, 260Ċ / 30 sec (10sec 3 tim es) Passed Solvent resistance PMA dipping, room temp./ 30 min Scotch tape stripping Passed Acid resistance 10 vol % H 2SO4, room temp./ 30 min Scotch tape stripping Passed Alkaline resistance 10 wt% NaOH, room temp./ 30 min Scotch tape stripping Passed Insulation resistance IPC comb type B pattern 25Ċ, 65% RH, 500V / 1 min Moisture conditioned:DC100V 25~65Ċ (cycle), 90% RH, 7 days Initial : 4.2 Ò 1013Ƹ A f t e r : 5.6 Ò 1011Ƹ Note : The above-mentioned test data is just for reference, not to guarantee the result. 6. Attention A. Operate in area supported by local exhaus t or general room ventilation to avoid build-up of high concentration of solvent vapors. B. Use gloves and apron during operation. Wash w ith soap and water if ink is attached to the skin. C. Wash hands and face with soap and wate r . Rinse out the mouth before eating or smoking.