PS9309L RENESAS | Alldatasheet
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R08DS0047EJ0001 Rev.0.01 Page 1 of 12 Feb 20, 2012 Preliminary Data Sheet Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 LOW IF TOTEM POLE OUTPUT TYPE HIGH CMR, IPM DRIVER, 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9309L and PS9309L2 are optical coupled high-speed, totem pole output (active high output type) isolators containing a GaAlAs LED on the input side and a photodiode and a signal processing circuit on the output side on one chip. The PS9309L and PS9309L2 are specified high CMR and pulse width distortion with operating temperature. It is suitable for IPM drive. The PS9309L is lead bending type (Gull-wing) for surface mounting. The PS9309L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
- High common mode transient immunity (CMH, CML = ±15 kV/μs MIN.)
- Half size of 8-pin DIP
- Pulse width distortion (|tPLH − tPHL| = 80 ns MAX.)
- High isolation voltage (BV = 5 000 Vr.m.s.)
- Totem pole output (Active High Output Type)
- Embossed tape product : PS9309L-E3, PS9309L2-E3: 2 000 pcs/reel
- Pb-Free product
- Safety standards
- UL approved: No. E72422
- CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
- SEMKO approved: No. 1115598
- DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
- IPM Driver
- General purpose inverter R08DS0047EJ0001 Rev.0.01 Feb 20, 2012 PIN CONNECTION (Top View) 1. Anode 2. NC 3. Cathode 4. GND 5. V O 6. VCC 13 2 SHIELD
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 2 of 12 Feb 20, 2012 PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) 0.25±0.15 9.7±0.3 3.7±0.25 0.8±0.25 0.2±0.15 7.62 3.5±0.2 6.8±0.25 4.58±0.3 (0.82) PS9309L 0.4±0.1 0.25 M 1.27 0.2±0.15 PS9309L2 11.5±0.3 6.8±0.25 4.58±0.3 0.25±0.15 0.75±0.25 (0.82)3.7±0.25 3.5±0.2 7.62 0.4±0.1 0.25 M 1.27
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 3 of 12 Feb 20, 2012 PHOTOCOUPLER CONSTRUCTION Parameter PS9309L PS9309L2 Air Distance (MIN.) 7 mm 8 mm Outer Creepage Distance (MIN.) 7 mm 8 mm Isolation Distance (MIN.) 0.4 mm 0.4 mm BLOCK DIAGRAM Output H L LED ON OFF Shield MARKING EXAMPLE Rank Code Year Assembled (Last 1 Digit) Week Assembled N 1 31 9309 N131 No. 1 pin Mark Assembly Lot Type Number R Company initial
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 4 of 12 Feb 20, 2012
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number*1 PS9309L PS9309L-AX Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS9309L PS9309L-E3 PS9309L-E3-AX (Ni/Pd/Au) Em bossed Tape 2 000 (UL, CSA, SEMKO pcs/reel approved) PS9309L2 PS9309L2-AX 20 pcs (Tape 20 pcs cut) PS9309L2 PS9309L2-E3 PS9309L2-E3-AX Embossed Tape 2 000 pcs/reel PS9309L-V PS9309L-V-AX 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS9309L PS9309L-V-E3 PS9309L-V-E3-AX Embossed Tape 2 000 (VDE0884 Part2) pcs/reel approved (Option) PS9309L2-V PS9309L2-V-AX 20 pcs (Tape 20 pcs cut) PS9309L2 PS9309L2-V-E3 PS9309L2-V-E3-AX Embossed Tape 2 000 pcs/reel Note: *1. For the application of the Safety Standard, following part number should be used.
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 5 of 12 Feb 20, 2012 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current *1 I F 20 mA Reverse Voltage V R 5 V Detector Supply Voltage V CC −0.5 to +25 V Output Voltage V O −0.5 to +25 V Output Current I O 25 mA Power Dissipation *2 P C 210 mW Isolation Voltage *3 BV 5 000 Vr.m.s. Operating Ambient Temperature T A −40 to +110 °C Storage Temperature T stg −55 to +125 °C Notes: *1. Reduced to 0.32 mA/ °C at TA = 70°C or more. *2. Reduced to 3.75 mW/ °C at TA = 70°C or more *3. AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC 4.5 15 20 V Output Voltage V O 0 20 V Forward Current (ON) I F (ON) 4 10 mA Forward Voltage (OFF) V F (OFF) 0 0.8 V
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 6 of 12 Feb 20, 2012
ELECTRICAL CHARACTERISTICS
(TA = −40 to +110°C, VCC = 4.5 to 20 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. *1 MAX. Unit Diode Forward Voltage V F I F = 10 mA, TA = 25°C 1.3 1.55 1.8 V Reverse Current I R V R = 3 V, TA = 25°C 10 μA Input Capacitance C t V F = 0 V, f = 1 MHZ, TA = 25°C 30 pF Detector High Level Output Voltage V OH VCC = 4.5 V, IO = −2.6 mA, IF = 4 mA 2.7 3.2 V VCC = 20 V, IO = −2.6 mA, IF = 4 mA 17.4 18.6 Low Level Output Voltage *2 V OL I O = 3.5 mA, IF = 0 mA 0.25 0.6 V High Level Supply Current I CCH V CC = 4.5 V, IF = 4 mA 0.98 3 mA V CC = 20 V, IF = 4 mA 1.32 3 Low Level Supply Current I CCL V CC = 4.5 V, IF = 0 mA 1.23 3 mA V CC = 20 V, IF = 0 mA 1.53 3 IOSH High Level Output Short *3 Circuit Current VCC = 4.5 V, VO = GND, IF = 4 mA −7 −45 mA Low Level Output Short *3 Circuit Current IOSL V CC = VO = 4.5 V, VF = 0 V 7 34 mA Coupled Threshold Input Current IFLH VCC = 4.5 V, VO > 2.7 V, IO = −2.6 mA 1.57 3 mA Isolation Resistance R I-O VI-O = 500 VDC, RH = 60%, TA = 25°C 1012 Ω Isolation Capacitance C I-O V = 0 V, f = 1 MHz, TA = 25°C 0.6 pF Propagation Delay Time (H → L)*4 tPHL CL = 15 pF, IF = 4 → 0 mA, VTHHL = 1.3 V 124 200 ns Propagation Delay Time (L → H)*4 tPLH CL = 15 pF, IF = 0 → 4 mA, VTHLH = 1.3 V 113 200 ns Pulse Width Distortion (PWD) ⏐tPLH-tPHL⏐ CL = 15 pF, IF = 4 ↔ 0 mA 11 80 ns Maximum Propagation Delays (PDD) Rise Time (10-90%) *4 t r CL = 15 pF, IF = 0 → 4 mA 24 ns Fall Time (90-10%)*4 t f CL = 15 pF, IF = 4 → 0 mA 3.2 ns Common Mode Transient Immunity at High Level Output*5 CMH VCC = 5 V, TA = 25°C, IF = 4 mA, ⏐VCM⏐ = 1.0 kV 15 kV/ μs Common Mode Transient Immunity at Low Level Output*5 CML VCC = 5 V, TA = 25°C, IF = 0 mA, ⏐VCM⏐ = 1.0 kV 15 kV/ μs Notes: *1. Typical values at TA = 25°C *2. Because VO of 2.4 V may be output when the LED current is not input and when output supply of VCC = 4.5 V or less, it is important to confirm the characteristics (operation with the power supply on and off) during design, before using this device. *3. Duration of output short circuit time should not exceed 10 ms.
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 7 of 12 Feb 20, 2012 *4. Test circuit for propagation delay time IF Input Output VO 1.3 V VOH VOL 50% 90% 10% tPHLtPLH tftr Input (monitor) 47 Ω Pulse input (IF) μ(PW = 4 s, Duty cycle = 1/10) VCC = 4.5 V 0.1 Fμ CL = 15 pF VO (monitor) Remark CL includes probe and stray wiring capacitance. IF (ON)1 *5. Test circuit for common mode transient immunity 90% VOH VOL VCM VO (IF = 10 mA) VO (IF = 0 mA) 10% tr tf 2.4 V 0.6 V Remark CL includes probe and stray wiring capacitance. IF VCC = 5 V 0.1 Fμ VO (monitor) SW 1 kV VCM = 1 kV + −
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 8 of 12 Feb 20, 2012 TAPING SPECIFICATIONS (UNIT: mm) PS9309L-E3 330±2.0 100±1.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 2.0±0.5 17.5±1.0 21.5±1.0 2.0±0.1 4.0±0.1 5.08±0.1 8.0±0.1 1.5 +0.1 1.75±0.1 4.5 MAX. 7.5±0.1 10.2±0.1 16.0±0.3 0.35 1.5 +0.1 4.05±0.1 Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Packing: 2 000 pcs/reel 15.9 to 19.4 Outer edge of flange
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 9 of 12 Feb 20, 2012 PS9309L2-E3 330±2.0 100±1.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 2.0±0.5 25.5±1.0 29.5±1.0 2.0±0.1 4.0±0.1 5.08±0.1 8.0±0.1 2.0 +0.1 1.5 +0.1 0.35 11.5±0.1 Outline and Dimensions (Tape) Outline and Dimensions (Reel) Tape Direction Packing: 2 000 pcs/reel 23.9 to 27.4 Outer edge of flange 24.0±0.3 12.0±0.1
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 10 of 12 Feb 20, 2012 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) PS9309L A 10.2 9.2 B 1.27 1.27 C 0.8 0.8 D 2.2 2.2PS9309L2 Part Number Lead Bending lead bending type (Gull-wing) for long creepage distance (surface mount) lead bending type (Gull-wing) for surface mount D CB A
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 11 of 12 Feb 20, 2012 USAGE CAUTIONS 1. This product is weak for static electricity by designed w ith high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Pin 2 (which is an NC *1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 4. Avoid storage at a high te mperature and high humidity.
Specifications in this document are tentative and subject to change. PS9309L, PS9309L2 Chapter Title R08DS0047EJ0001 Rev.0.01 Page 12 of 12 Feb 20, 2012 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. Do not burn, destroy, cut, crush, or chemically dissolve the product. Do not lick the product or in any way allow it to enter the mouth.
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0.01 Feb 20, 2012 − First edition issued
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