PS9113-F4

PS9113 NEC | Alldatasheet

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. PHOTOCOUPLER PS9113

1 Mbps, OPEN COLLECTOR OUTPUT

HIGH CMR, INTELLIGENT POWER MODULE 5-PIN SOP PHOTOCOUPLER −NEPOC Series−

DESCRIPTION

The PS9113 is an optically coupled is olator containing a GaAlAs LED on the input side and a photo diode and a signal processing circuit on the output side on one chip. The PS9113 is specified high CMR, high CTR and pulse w idth distortion with operating temperature. It is suitable for IPM drive.

FEATURES

1. Anode 2. Cathode 3. GND 4. VO 5. VCC (Top View)

• High instantaneous common mode rejection voltage (CMH, CML = ±15 kV/µs MIN.)
• Small package (5-pin SOP)
• High-speed response (tPHL = 500 ns MAX., tPLH = 750 ns MAX.)
• Maximum propagation delays (tPLH − tPHL = 270 ns TYP.)
• Pulse width distortion ( tPHL − tPLH = 270 ns TYP.)
• Ordering number of taping product: PS9113-F3, F4: 2 500 pcs/reel
• Pb-F ree product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option)

APPLICATIONS

• IPM Driver
• General purpose inverter Document No. PN10265EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan © NEC Compound Semiconductor Devices, Ltd. 2003, 2005 The mark  shows major revised points.

PACKAGE DIMENSIONS (UNIT: mm) 1.27 0.4+0.10 –0.05 0.25 M 0.1±0.1 2.6±0.2 4.4 7.0±0.3 0.5±0.3 0.15+0.10 –0.05 3.4 +0.3 –0.1 FUNCTIONAL DIAGRAM LED Output ON L OFF H Shield Data Sheet PN10265EJ02V0DS 2

No. 1 pin Mark Initial of NEC (Engraved mark) Rank Code Year Assembled (Last 1 Digit) Week Assembled N 2 34 Assembly Lot 9113 N234 N *1 *1 Bar : Pb-Free Data Sheet PN10265EJ02V0DS 3

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number PS9113 PS9113-A Pb-Free Magazine case 100 pcs Standard products PS9113 PS9113-F3 PS9113-F3-A Embossed Tape 2500 pcs/reel (UL approved) PS9113-F4 PS9113-F4-A PS9113-V PS9113-V-A Magazine case 100 pcs DIN EN60747-5-2 PS9113-V-F3 PS9113-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2) PS9113-V-F4 PS9113-V-F4-A Approved (Option) *1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current IF 25 mA Reverse Voltage VR 5 V Detector Supply Voltage VCC −0.5 to +35 V Output Voltage VO −0.5 to +35 V Output Current IO 15 mA Power Dissipation PC 100 mW Isolation Voltage BV 2 500 Vr.m.s. Operating Ambient Temperature TA −40 to +100 °C Storage Temperature Tstg −55 to +125 °C *1 Reduced to 0.33 mA/°C at TA = 70°C or more. *2 Reduced to 1.9 mW/°C at TA = 70°C or more. *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit High Level Input Current IFH 10 20 mA Output Voltage VO 0 30 V Supply Voltage VCC 4.5 30 V LED Off Voltage VF 0 0.8 V Data Sheet PN10265EJ02V0DS 4

ELECTRICAL CHARACTERISTICS (TA = −40 to +100°C, VCC = 15 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage VF IF = 10 mA 1.3 1.65 2.1 V Reverse Current IR VR = 3 V 200 µA Terminal Capacitance Ct V = 0 V, f = 1 MHz, TA = 25°C 30 pF Detector Low Level Output Voltage VOL IF = 10 mA, IOL = 2.4 mA 0.13 0.6 V High Level Output Current IOH VCC = VO = 30 V, VF = 0.8 V 0.01 50 µA High Level Supply Current ICCH VCC = 30 V, VF = 0.8 V, VO = open 0.6 1.3 mA Low Level Supply Current ICCL VCC = 30 V, IF = 10 mA, VO = open 0.6 1.3 mA Coupled Threshold Input Current (H → L) IFHL VO = 0.8 V, IO = 0.75 mA 1.5 5.0 mA Current Transfer Ratio (IC/IF) CTR IF = 10 mA, VO = 0.6 V 44 110 % Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60%, TA = 25°C Ω Isolation Capacitance CI-O V = 0 V, f = 1 MHz, TA = 25°C 0.6 pF Propagation Delay Time (H → L) tPHL IF = 10 mA, RL = 20 kΩ, CL = 100 pF, VTHHL = 1.5 V, VTHLH = 2.0 V 250 500 ns Propagation Delay Time (L → H) tPLH 520 750 Maximum Propagation Delays tPLH−tPHL −200 270 650 Pulse Width Distortion (PWD) tPHL-tPLH 270 650 Common Mode Transient Immunity at High Level Output CMH TA = 25°C, IF = 0 mA, VO > 3.0 V, VCM = 1.5 kV, RL = 20 kΩ, CL = 100 pF 15 kV/µs Common Mode Transient Immunity at Low Level Output CML TA = 25°C, IF = 10 mA, VO < 1.0 V, VCM = 1.5 kV, RL = 20 kΩ, CL = 100 pF 15 kV/µs Data Sheet PN10265EJ02V0DS 5

*1 Typical values at TA = 25°C. *2 Test circuit for propagation delay time CL includes probe and stray wiring capacitance. Pulse input (IF = 10 mA) 47 Ω (PW = 10 s, Duty cycle = 1/10) µ RL = 20 kΩ VO (Monitor) VCC = 15 V Input (Monitor) 0.1 Fµ CL = 100 pF Input Output VTHHL = 1.5 V VTHLH = 2.0 V 15 V VOL tPHL tPLH IF (ON) 50% IF (ON) *3 Test circuit for common mode transient immunity CL includes probe and stray wiring capacitance. 90% 10% 1.5 kV 0 V 15 V 3.0 V 1.0 V VOL VCM tr tf VO (Switch A: IF = 0 mA) VO (Switch B: IF = 10 mA) VO (Monitor) RL = 20 kΩ CL = 100 pF VCC = 15 V 0.1 Fµ VCM SW IF BA USAGE CAUTIONS 1. This product is weak for static el ectricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 µF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. Data Sheet PN10265EJ02V0DS 6

TYPICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) 20 40 60 80 1000 20 40 60 80 1000 100 150 –50 –25 0.1 0.2 0.3 0.4 0.5 250 50 75 100 VCC = 15 V, VO = 0.8 V, IO = 0.75 mA –50 –25 0 25 50 75 100 400 200 600 1 000 800 1 200 VCC = 30 V, VO = Open, ICCH : VF = 0.8 V, ICCL : IF = 10 mA ICCL ICCH 0.6 –50 –25 0 25 50 75 100 µ µ VCC = 15 V, IF = 10 mA, IO = 2.4 mA Ambient Temperature TA (˚C) Maximum Forward Current IF (mA) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA (˚C) Detector Power Dissipation PC (mW) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Ambient Temperature TA (˚C) High Level Supply Current ICCH ( A), Low Level Supply Current ICCL ( A) SUPPLY CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA (˚C) Threshold Input Current IFHL (mA) THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA (˚C) Low Level Output Voltage VOL (V) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE Forward Voltage VF (V) Forward Current IF (mA) FORWARD CURRENT vs. FORWARD VOLTAGE 1.0 0.01 0.1 100 TA = +85˚C +50˚C +25˚C 0˚C –25˚C Remark The graphs indicate nominal characteristics. Data Sheet PN10265EJ02V0DS 7

Output Current IO (mA) Forward Current IF (mA) Ambient Temperature TA (˚C) Output Current (Relative Value) 0 5 10 15 20 –40 –20 0 20 40 60 80 100 Load Capacitance CL (pF) Propagation Delay Time tPHL, tPLH (ns) 100 200 300 400 500 600 700 0.70 0.80 0.75 0.85 0.95 1.05 0.90 1.00 1.10 IF = 10 mA, VCC = 15 V, CL = 100 pF, RL = 20 kΩ IF = 10 mA, VO = 0.6 V IF = 10 mA, CL = 100 pF, RL = 20 kΩ VCC = 15 V, CL = 100 pF, RL = 20 kΩ IF = 10 mA, VCC = 15 V, RL = 20 kΩ –40 –20 0 20 40 60 80 100 100 200 300 400 500 600 700 200 400 600 800 1 000 1 200 1 400 1 600 0 100 200 300 400 500 01 0 20 30 200 400 600 800 1 000 1 200 1 400 1 600 1 800 –200 tPHL tPLH tPLH – tPHL PWD tPHL tPLH tPLH – tPHL tPHL tPLH tPLH tPHL Forward Current IF (mA) Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH – tPHL (ns) PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. FORWARD CURRENT Ambient Temperature TA (˚C) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE Supply Voltage VCC (V) Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH – tPHL (ns) PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. SUPPLY VOLTAGE PROPAGATION DELAY TIME vs. LOAD CAPACITANCE OUTPUT CURRENT vs. FORWARD CURRENT OUTPUT CURRENT vs. AMBIENT TEMPERATURE 0 5 10 15 20 VO = 0.6 V –40˚C +100˚C TA = +25˚C Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion tPHL – tPLH (ns) Remark The graphs indicate nominal characteristics. Data Sheet PN10265EJ02V0DS 8

IF = 10 mA, VCC = 15 V, CL = 100 pF IF = 10 mA, VCC = 5 V, CL = 15 pF 0 5 10 15 20 25 100 150 200 250 300 350 400 450 500 01 0 20 30 40 50 –200 200 400 800 600 1 000 tPHL tPLH tPHL tPLH tPLH – tPHL tPLH – tPHL Load Resistance RL (kΩ) Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH – tPHL (ns) PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. LOAD RESISTANCE Load Resistance RL (kΩ) Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH – tPHL (ns) PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. LOAD RESISTANCE Remark The graphs indicate nominal characteristics. Data Sheet PN10265EJ02V0DS 9

TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Packing: 2 500 pcs/reel 100±1.0φ 13.0±0.2φ 330±2.0φ 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 PS9113-F3 PS9113-F4 1.55±0.1 2.0±0.05 4.0±0.1 1.75±0.1 3.9±0.1 3.45 MAX. 7.4±0.1 0.3±0.058.0±0.1 1.5+0.1 5.5±0.1 12.0±0.2 3.0±0.1 Data Sheet PN10265EJ02V0DS 10

1. Recommended soldering conditions (1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 ±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) 120±30 s (preheating) 220˚C 180˚C Package Surface Temperature T (˚C) Time (s) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s to 60 s 260˚C MAX. 120˚C (2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°C Data Sheet PN10265EJ02V0DS 11

(4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aw are that w hen voltage is applied suddenly bet ween the photocoupler’s input and output or betw een collector-emitters at startup, the output transistor may enter the on state, even if the voltage is w ithin the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10265EJ02V0DS 12

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use o f such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility o f customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications o f a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard" : Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special" : Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific" : Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC' s willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Data Sheet PN10265EJ02V0DS 13

Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or i any way allow it to enter the mouth. NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact