PS8103

PS8103 RENESAS | Alldatasheet

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. PHOTOCOUPLER PS8103 HIGH-SPEED (200 kbps) ANALOG OUTPUT TYPE 5-PIN SOP (SO-5) PHOTOCOUPLER −NEPOC Series− Document No. PN10261EJ04V0DS (4th edition) Date Published April 2007 NS CP(N) Printed in Japan 2003, 2007The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

DESCRIPTION

The PS8103 is an optically coupled isol ator containing a GaAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications.

FEATURES

• Wide operating V CC range (VCC = −0.5 to +15 V)  Small package (SO-5)  High isolation voltage (BV = 3 750 Vr.m.s.)  High-speed response (t PHL, tPLH = 5 μs MAX. (@RL = 4.1 kΩ))  Ordering number of taping produc t: PS8103-F3, F4: 2 500 pcs/reel  Pb-Free product  Safety standards  UL approved: File No. E72422

APPLICATIONS

 Computer and peripheral manufactures  General purpose inverter  Substitutions for relays and pulse transformers  Power supply PIN CONNECTION (Top View) 1. Anode 2. Cathode 3. GND 4. V O 5. VCC <R>

Data Sheet PN10261EJ04V0DS 2 PS8103 PACKAGE DIMENSIONS (UNIT: mm) 1.27 0.1±0.1 2.6±0.2 4.4 7.0±0.3 0.5±0.3 0.15+0.10 –0.05 3.4 +0.3 –0.153 MARKING EXAMPLE No. 1 pin Mark Initial of NEC (Engraved mark) Rank Code Year Assembled (Last 1 Digit) Week Assembled N 7 31 Assembly Lot 8103 N731 N *1 *1 Bar : Pb-Free <R>

Data Sheet PN10261EJ04V0DS 3 PS8103

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number PS8103 PS8103-A Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8103 PS8103-F3 PS8103-F3-A Embossed Tape 2 500 pcs/reel (UL approved) PS8103-F4 PS8103-F4-A *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current I F 50 mA Reverse Voltage V R 5 V Power Dissipation P D 50 mW Detector Supply Voltage V CC −0.5 to +15 V Output Voltage V O −0.5 to +15 V Output Current I O 8 mA Power Dissipation P C 80 mW Isolation Voltage BV 3 750 Vr.m.s. Operating Ambient Temperature T A −40 to +100 °C Storage Temperature T stg −55 to +125 °C *1 Reduced to 0.5 mW/ °C at TA = 25°C or more. *2 Applies to output pin V O. Reduced to 0.8 mW/°C at TA = 25°C or more. *3 AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-5 shorted together. <R>

Data Sheet PN10261EJ04V0DS 4 PS8103 ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage V F I F = 16 mA 1.2 1.5 V Reverse Current I R V R = 3 V 10 μA Terminal Capacitance C t V = 0 V, f = 1 MHz 30 pF Detector High Level Output Current I OH (1) I F = 0 mA, VCC = VO = 5.5 V 7 500 nA High Level Output Current I OH (2) I F = 0 mA, VCC = VO = 15 V 100 μA Low Level Output Voltage V OL I F = 16 mA, VCC = 4.5 V, IOL = 1.1 mA 0.1 0.4 V High Level Supply Current I CCH I F = 0 mA, VO = open, VCC = 15 V 0.01 1 μA Low Level Supply Current I CCL I F = 16 mA, VO = open, VCC = 15 V 150 800 Coupled Current Transfer Ratio (I C/IF) CTR I F = 16 mA, VCC = 4.5 V, VO = 0.4 V 10 23 30 % Isolation Resistance R I-O V I-O = 1 kVDC, RH = 40 to 60% 10 Ω Isolation Capacitance C I-O V = 0 V, f = 1 MHz 0.4 pF Propagation Delay Time (H → L) tPHL I F = 16 mA, VCC = 5 V, RL = 4.1 kΩ, CL = 15 pF 1 5 μs Propagation Delay Time (L → H) tPLH 2 5 Propagation Delay Time (H → L) tPHL I F = 16 mA, VCC = 5 V, RL = 20 kΩ, CL = 15 pF 1 15 Propagation Delay Time (L → H) tPLH 7 15 *1 CTR rank L : 15 to 30 (%) N : 10 to 30 (%) *2 Test circuit for propagation delay time Pulse input (IF) 47 Ω (Pulse width = 100 s, Duty cycle = 1/10) μ RL = 4.1/20 kΩ VO (Monitor) VCC = 5 V Input (Monitor) 0.1 F μ CL = 15 pF Input Output 50% 1.5 V 5 V VOL tPHL tPLH CL includes probe and stray wiring capacitance. USAGE CAUTIONS 1. This product is weak for static el ectricity by designed with hi gh-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high te mperature and high humidity.

Data Sheet PN10261EJ04V0DS 5 PS8103 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) 25 50 75 100 Ambient Temperature TA (˚C) Diode Power Dissipation PD (mW) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TA = +100˚C +50˚C +25˚C 0˚C –25˚C 100 0.01 0.1 Forward Voltage VF (V) Forward Current IF (mA) FORWARD CURRENT vs. FORWARD VOLTAGE VCC = 4.5 V, VO = 0.4 V 0.5 5 10 501 Forward Current IF (mA) CURRENT TRANSFER RATIO vs. FORWARD CURRENT Current Transfer Ratio CTR (%) 120 100 25 50 75 100 Ambient Temperature TA (˚C) Detector Power Dissipation PC (mW) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE IF = 0 mA VCC = VO = 15 V 5.5 V 1 000 0.1 100 50 100–25 0 25 75 Ambient Temperature TA (˚C) High Level Output Current IOH (nA) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 1.6 0.0 1.2 0.4 1.4 1.0 0.8 0.6 0.2 0 50 100–50 –25 25 75 Ambient Temperature TA (˚C) Normalized Current Transfer Raio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE Normalized to 1.0 at TA = 25˚C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V Remark The graphs indicate nominal characteristics.

Data Sheet PN10261EJ04V0DS 6 PS8103 20 mA 15 mA 10 mA 5 mA IF = 25 mA 4 8 18 20 162 6 10 12 14 Output Voltage VO (V) Output Current IO (mA) OUTPUT CURRENT vs. OUTPUT VOLTAGE VCC = 5 V, IF = 16 mA tPHL tPLH 0.1 10 1001 Load Resistance RL (kΩ) PROPAGATION DELAY TIME vs. LOAD RESISTANCE Propagation Delay Time tPHL, tPLH ( s)μ tPHL tPLH 3.0 0.5 1.0 1.5 2.0 2.5 –50 0 50 100–25 75 25 Ambient Temperature TA (˚C) NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURENormalized Propagation Delay Time tPHL, tPLH Normalized to 1.0 at TA = 25˚C, IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ, 20 kΩ 12 16 20482 6 10 14 18 Forward Current IF (mA) Output Voltage VO (V) OUTPUT VOLTAGE vs. FORWARD CURRENT RL = 4.1 kΩ 20 kΩ VCC = 5 V 1051 5 2 5 20 Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT Propagation Delay Time tPHL, tPLH ( s)μ tPHL (RL = 4.1 kΩ) tPLH (RL = 20 kΩ) tPLH (RL = 4.1 kΩ)tPHL (RL = 20 kΩ) Remark The graphs indicate nominal characteristics.

Data Sheet PN10261EJ04V0DS 7 PS8103 TAPING SPECIFICATIONS (UNIT: mm) Tape Direction Outline and Dimensions (Tape) Outline and Dimensions (Reel) Packing: 2 500 pcs/reel 2.0±0.5 R 1.0 13.0±0.2φ 21.0±0.8φ 330±2.0φ 100±1.0φ 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 13.0±0.2φ PS8103-F3 PS8103-F4 1.55±0.1 2.0±0.05 4.0±0.1 1.75±0.1 3.9±0.1 3.45 MAX. 7.4±0.1 0.3±0.058.0±0.1 1.5+0.1 5.5±0.1 12.0±0.2 3.0±0.1

Data Sheet PN10261EJ04V0DS 8 PS8103 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering  Peak reflow temperature 260 °C or below (package surface temperature)  Time of peak reflow temperature 10 seconds or less  Time of temperature higher than 220°C 60 seconds or less  Time to preheat temperature from 120 to 180°C 120 ±30 s  Number of reflows Three  Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) 120±30 s (preheating) 220˚C 180˚C Package Surface Temperature T (˚C) Time (s) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s to 60 s 260˚C MAX. 120˚C (2) Wave soldering  Temperature 260 °C or below (molten solder temperature)  Time 10 seconds or less  Preheating conditions 120 °C or below (package surface temperature)  Number of times One (Allowed to be dipped in solder including plastic mold portion.)  Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron  Peak Temperature (lead part temperature) 350 °C or below  Time (each pins) 3 seconds or less  Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°C

Data Sheet PN10261EJ04V0DS 9 PS8103 (4) Cautions  Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly bet ween the photocoupler’s i nput and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high te mperature and high humidity.

Data Sheet PN10261EJ04V0DS 10 PS8103 The information in this document is current as of April, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":

Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.  Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.  Do not burn, destroy, cut, crush, or chemically dissolve the product.  Do not lick the product or in any way allow it to enter the mouth.