PS8103-F4

PS8103 NEC | Alldatasheet

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. PHOTOCOUPLER PS8103 HIGH-SPEED (200 kbps) ANALOG OUTPUT TYPE 5-PIN SOP PHOTOCOUPLER Document No. PN10261EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan ©NEC Compound Semiconductor Devices, Ltd. 2003, 2005 −NEPOC Series

DESCRIPTION

The PS8103 is an optically coupled isolator containing a GaAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications.

FEATURES

• Wide operating VCC range (VCC = −0.5 to +15 V)
• Small package (5-pin SOP)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL, tPLH = 5 µs MAX. (@RL = 4.1 kΩ))
• Ordering number of taping product: PS8103-F3, F4: 2 500 pcs/reel
• Pb-F ree product
• Safety standards
• UL approved: File No. E72422 PIN CONNECTION (Top View) 1. Anode 2. Cathode 3. GND 4. VO 5. VCC

APPLICATIONS

• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Pow er supply The mark  shows major revised points.

PACKAGE DIMENSIONS (UNIT: mm) 1.27 0.4+0.10 –0.05 0.25 M 0.1±0.1 4.4 7.0±0.3 0.5±0.3 0.15+0.10 –0.05 3.4 +0.3 –0.1 2.6±0.2 MARKING No. 1 pin Mark Initial of NEC (Engraved mark) Rank Code Year Assembled (Last 1 Digit) Week Assembled N 2 34 Assembly Lot 8103 N234 N *1 *1 Bar : Pb-Free Data Sheet PN10261EJ02V0DS 2

Data Sheet PN10261EJ02V0DS 3 PS8103

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number PS8103 PS8103-A Pb-Free Magazine case 100 pcs Standard products PS8103 PS8103-F3 PS8103-F3-A Embossed Tape 2 500 pcs/reel (UL approved) PS8103-F4 PS8103-F4-A *1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current IF 50 mA Reverse Voltage VR 5 V Power Dissipation PD 50 mW Detector Supply Voltage VCC −0.5 to +15 V Output Voltage VO −0.5 to +15 V Output Current IO 8 mA Power Dissipation PC 80 mW Isolation Voltage BV 2 500 Vr.m.s. Operating Ambient Temperature TA −40 to +100 °C Storage Temperature Tstg −55 to +125 °C *1 Reduced to 0.5 mW/°C at TA = 25°C or more. *2 Applies to output pin VO. Reduced to 0.8 mW/°C at TA = 25°C or more. *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together.

ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage VF IF = 16 mA 1.2 1.5 V Reverse Current IR VR = 3 V 10 µA Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 7 500 nA High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 15 V 100 µA Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IOL = 1.1 mA 0.1 0.4 V High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 15 V 0.01 1 µA Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 15 V 150 800 Coupled Current Transfer Ratio (IC/IF) CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 10 23 30 % Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60% 10 Ω Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF Propagation Delay Time (H → L) tPHL IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ, CL = 15 pF 1 5 µs Propagation Delay Time (L → H) tPLH 2 5 Propagation Delay Time (H → L) tPHL IF = 16 mA, VCC = 5 V, RL = 20 kΩ, CL = 15 pF 1 15 Propagation Delay Time (L → H) tPLH 7 15 *1 CT R rank L : 15 to 30 (%) N : 10 to 30 (%) *2 Test circuit for propagation delay time Pulse input (IF) 47 Ω (Pulse width = 100 s, Duty cycle = 1/10) µ RL = 4.1/20 kΩ VO (Monitor) VCC = 5 V Input (Monitor) 0.1 Fµ CL = 15 pF Input Output 50% 1.5 V 5 V VOL tPHL tPLH CL includes probe and stray wiring capacitance. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 µF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. Data Sheet PN10261EJ02V0DS 4

Data Sheet PN10261EJ02V0DS 5 PS8103 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) 25 50 75 100 Ambient Temperature TA (˚C) Diode Power Dissipation PD (mW) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TA = +100˚C +50˚C +25˚C 0˚C –25˚C 100 0.01 0.1 Forward Voltage VF (V) Forward Current IF (mA) FORWARD CURRENT vs. FORWARD VOLTAGE VCC = 4.5 V, VO = 0.4 V 0.5 5 10 501 Forward Current IF (mA) CURRENT TRANSFER RATIO vs. FORWARD CURRENT Current Transfer Ratio CTR (%) 120 100 25 50 75 100 Ambient Temperature TA (˚C) Transistor Power Dissipation PC (mW) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE IF = 0 mA VCC = VO = 15 V 5.5 V 1 000 0.1 100 50 100–25 0 25 75 Ambient Temperature TA (˚C) High Level Output Current IOH (nA) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 1.6 0.0 1.2 0.4 1.4 1.0 0.8 0.6 0.2 0 50 100–50 –25 25 75 Ambient Temperature TA (˚C) Normalized Current Transfer Raio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE Normalized to 1.0 at TA = 25˚C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V Remark The graphs indicate nominal characteristics.

IF = 25 mA 4 8 18 20162 6 10 12 14 Output Voltage VO (V) Output Current IO (mA) OUTPUT CURRENT vs. OUTPUT VOLTAGE VCC = 5 V, IF = 16 mA tPHL tPLH 0.1 10 1001 Load Resistance RL (kΩ) PROPAGATION DELAY TIME vs. LOAD RESISTANCE Propagation Delay Time tPHL, tPLH ( s)µ tPHL tPLH 3.0 0.5 1.0 1.5 2.0 2.5 –50 0 50 100–25 7525 Ambient Temperature TA (˚C) NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURENormalized Propagation Delay Time tPHL, tPLH Normalized to 1.0 at TA = 25˚C, IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ, 20 kΩ 12 16 20482 6 10 14 18 Forward Current IF (mA) Output Voltage VO (V) OUTPUT VOLTAGE vs. FORWARD CURRENT RL = 4.1 kΩ 20 kΩ VCC = 5 V 1051 5 2520 Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT Propagation Delay Time tPHL, tPLH ( s)µ tPHL (RL = 4.1 kΩ) tPLH (RL = 20 kΩ) tPLH (RL = 4.1 kΩ)tPHL (RL = 20 kΩ) Remark The graphs indicate nominal characteristics. Data Sheet PN10261EJ02V0DS 6

Data Sheet PN10261EJ02V0DS 7 PS8103 TAPING SPECIFICATIONS (UNIT: mm) Tape Direction Outline and Dimensions (Tape) Outline and Dimensions (Reel) Packing: 2 500 pcs/reel 2.0±0.5 R 1.0 13.0±0.2φ 21.0±0.8φ 330±2.0φ 100±1.0φ 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 13.0±0.2φ PS8103-F3 PS8103-F4 1.55±0.1 2.0±0.05 4.0±0.1 1.75±0.1 3.9±0.1 3.45 MAX. 7.4±0.1 0.3±0.058.0±0.1 1.5+0.1 5.5±0.1 12.0±0.2 3.0±0.1

1. Recommended soldering conditions (1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 ±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) 120±30 s (preheating) 220˚C 180˚C Package Surface Temperature T (˚C) Time (s) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s to 60 s 260˚C MAX. 120˚C (2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°C Data Sheet PN10261EJ02V0DS 8

Data Sheet PN10261EJ02V0DS 9 PS8103 (4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aw are that w hen voltage is applied suddenly bet ween the photocoupler’s i nput and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is w ithin the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.

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Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZ Lead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.