PS7802 NEC | Alldatasheet

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Technical content

NEC's 4-PIN ULTRA SMALL FLAT-LEAD, LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET PS7802-1A

FEATURES

  • LOW C x R : C x R = 12.6 pF • Ω
  • 1 CHANNEL TYPE: 1a output
  • LOW ON-STATE RESISTANCE: R on = 1.1 Ω TYP
  • HIGH PASS CHARACTERISTICS: ERT = 45 ps TYP
  • DESIGNED FOR AC/DC SWITCHING LINE CHANGER
  • ULTRA SMALL FLAT-LEAD PACKAGE:
  • LOW OFFSET VOLTAGE
  • ORDERING NUMBER OF TAPING PRODUCT: PS7801-1A-F3, F4 (3 500 pcs/reel)

DESCRIPTION

NEC's PS7802-1A is a low output capacitance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOSFETs on the output side. An ultra small ß at-lead package has been provided which realizes a reduction in mounting area about 50% compared with the PS72xx series. It is suitable for high fre quen cy signal control, due to its low C x R, low on-state resistance, and low off-state leakage current. California Eastern Laboratories

APPLICATIONS

  • MEASUREMENT EQUIPMENT PART NUMBER PS7802-1A SYMBOLS PARAMETERS MIN TYP MAX UNITS Diode V F Forward Voltage, IF = 5 mA 1.1 1.4 V IR Reverse Current, VR = 5 V 5.0 μA MOS FET I LOFF Off-State Leakage Current, VD = 40 V 0.1 1 nA Cout Output Capacitance, VD = 0 V, f = 1 MHz 11.5 pF RON On-State Resistance, IF = 5 mA, IL = 250 mA 1.1 1.6 Ω tON Turn-on Time, IF = 5 mA, VO = 5 V, RL = 500 Ω, PW ≥ 10 ms 0.1 0.5 ms tOFF Turn-off Time, IF = 5 mA, VO = 5 V, RL = 500 Ω, PW ≥ 10 ms 0.08 0.50 ms RI-O Isolation Resistance, VI-O = 0.5 k VDC 109 Ω CI-O Isolation Capacitance, V = 0 V, f = 1 MHz 0.3 pF ERT Equivalent Rise Time, IF = 10 mA, tr (in) = 25.0 ps, V = 250 mV, 50 Ω termination 45 ps Input 50% VO = 5 V 90% 10% ton toff Output Rin VL IF RL Input monitor Pulse Input Vo monitor 1. Test Circuit for Switching Time 2. The turn-on time and turn-off time are speciÞ ed as input-pulse width ≥ 10 ms. Please note that when the device operates with an input-pulse of under 10 ms, the turn-on time and turn-off time will increase ELECTRICAL CHARACTERISTICS (TA = 25 °C)

SYMBOLS PARAMETERS RATINGS UNITS I F Forward Current (DC) 50 mA V R Reverse Voltage 5.0 V P D Power Dissipation 50 mW I FP Peak Forward Current2 1 A V L Break Down Voltage 40 V I L Continuous Load Current 250 mA I LP Pulse Load Current3 500 mA P D Power Dissipation 100 mW V iso Isolation Voltage4 500 V rms P T Total Power Dissipation 150 mW T A Operating Ambient Temp. -40 to +85 °C T STG Storage Temperature -40 to +100 °C ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) Notes: 1. Operation in excess of any one of these parameters may result in per ma nent damage. 2. PW = 100 μs, Duty Cycle = 1 % 3. PW = 100 ms, 1 shot 4. AC voltage for 1 minute at T A = 25ºC, RH = 60% between input and output MOS FET Diode PART NUMBER PACKAGE PACKING STYLE PS7802-1A-F3 4-PIN SSOP Embossed Tape 3 500 pcs PS7802-1A-F4

ORDERING INFORMATION

SYMBOL PARAMETER UNITS MIN TYP MAX IF LED Operating Current I F 25 2 0 VF LED Off Voltage V F 0 0.5 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) OUTLINE DIMENSIONS (Units in mm) N 2.5±0.3

4.8 MAX

0.2±0.1 0.36 0.15 0.4±0.11.85±0.05 1.27 0.2 ±0.1 4.2 ±0.2 3.6 +0.3 -0.4 +0.1 -0.05 0.2 MAX. 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET TOP VIEW RECOMMENDED MOUNT PAD DIMENSIONS 0.8 (0.35) 3.6 24-R0.1 4.4 5.3 0.6 (Units in mm)

TYPICAL CHARACTERISTICS (TA = 25ºC) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE Maximum Forward Current, IF (mA) Ambient Temperature, TA (ºC) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE Maximum Load Current, IL (mA) Ambient Temperature, TA (ºC) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE Forward Voltage, VF (mA) Ambient Temperature, TA (ºC) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE Output Capacitance, Cout (pF) Applied Voltage, VD (V) OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE Off-state Leakage, Current IF (mA) Ambient Temperature, TA (ºC) LOAD CURRENT vs. LOAD VOLTAGE Load Current, IL (mA) Load Voltage, VL (V) -25 0 25 50 75 100 85 100 -25 0 25 50 75 100 85 100 200 150 250 300 1.6 1.4 1.2 1.0 0.8 -25 0 25 50 75 100 IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA 5 0 10 20 30 40 50 60 f = 1 MHz 10-7 VD = 40 V 02 0 4 0 6 08 0 100 10-8 10-9 10-10 10-11 10-12 10-13 -1.0 -0.5 0.5 -200 -100 100 200 IF = 5 mA 1.00

TYPICAL CHARACTERISTICS (TA = 25ºC) NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE Normalized On-state Resistance, Ron (mA) Ambient Temperature, TA (ºC) ON-STATE RESISTANCE DISTRIBUTION Maximum Load Current, IL (mA) On-state Resistance, Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT Turn-on Time, ton (ms) Forward Current, IF (mA) TURN-ON TIME vs. FORWARD CURRENT Turn-off Time, toff (ms) Forward Current, IF (mA) TURN-ON TIME DISTRIBUTION Number (pcs) Turn-on Time, Ton (ms) TURN-OFF TIME DISTRIBUTION Number (pcs) Turn-off Time, toff (ms) Normalized to 1.0 at TA = 25ºC, IF = 5 mA IL = 250 mA 1007550250-25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 60 n = 50 pcs, I F = 5 mA IL = 250 mA VO = 5 V, RL = 500 Ω 0.10 0.06 0.08 0.02 05 1 0 15 20 25 30 0.04 VO = 5 V, RL = 500 Ω 0.5 0.3 0.4 0.1 05 1 0 15 20 25 30 0.2 n = 50 pcs, IF = 5 mA VO = 5 V, RL = 500 Ω n = 50 pcs, IF = 5 mA VO = 5 V, RL = 500 Ω

TYPICAL CHARACTERISTICS (TA = 25ºC) NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE Normalized Turn-on Time, ton Ambient Temperature, TA (ºC) NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE Normalized Turn-off Time, toff Ambient Temperature, TA (ºC) -25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Normalized to 1.0 at T A = 25ºC, IF = 5 mA, VO = 5V, RL = 500 Ω 02 5 5 0 7 5 100 -25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Normalized to 1.0 at T A = 25ºC, IF = 5 mA, VO = 5V, RL = 500 Ω 02 5 5 0 7 5 100 ERT (Equivalent Rate Time) measurement 250 mV 250 mV Output ERT = tr (out)2 – tr (in)2 Input 90% 10% 90% 10% tr (out) tr (in)

2.0±0.05 4.0±0.1 1.5 1.75±0.1

2.9 MAX

0.3 2.4±0.1 PS7802-1-F3 Outline and Dimensions (Reel) PS7802-1-F4 2.0±0.5 2.0±0.5 ∅13.0±0.2 13.0±0.2 100±1.0∅ 330±2.0 ∅21.0±0.8 R 1.0 13.5±1.0 17.5±1.0 11.9 to 15.4 Outer edge of flangePacking: 3 500 pcs/reel 12.0±0.2 5.3±0.1 5.5±0.05 +0.1 2.9±0.1 4.0±0.1 1.55±0.05 N N N N NNNN Tape Direction Outline and Dimensions (Tape) N TAPING SPECIFICATIONS (Units in mm) PS7802-1A

(1) Infrared refl ow soldering • Peak refl ow temperature 260 ûC (package surface temperature) • Time of Peak refl ow temperature 10 seconds or less • Time of temperature higher than 220 ˚C 60 seconds or less • Time to preheat temperature from 120 to 180 ˚C 120±30 s

  • Number of re fl ows Three
  • Flux Rosin ß ux containing small amount of chlorine (The ß ux with a max. chlorine content of 0.2 Wt % is recommended) Recommended Temperature Profi le of Infrared Refl ow RECOMMENDED SOLDERING CONDITIONS A Business Partner of NEC Compound Semiconductor Devices, Ltd. 03/16/2004 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. Package Surface Temperatire T (ºC) (heating) t0 10 s 180 ºC 120 ºC 120±30 s (preheating) Time (s) 260 ºC MAX. 220 ºC to 60 s (2) Wave soldering • Temperature 260 ûC or below (molten solder temperature) • Time 10 seconds or less
  • Preheating conditions 120ûC or below (package surface temperature)
  • Number of times One
  • Flux Rosin ß ux containing small amount of chlorine (The ß ux with a max. chlorine content of 0.2 Wt % is recommended.) (3) Cautions • Fluxes Avoid removing the residual ß ux with freon-based and chlorine-based cleaning solvent.