PS7212-1A NEC | Alldatasheet

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. © 1998, 1999 4-PIN SOP 100 V BREAK DOWN VOLTAGE 1-ch Optical Coupled MOS FET Solid State Relay OCMOS FET PS7212-1A Document No. P13927EJ4V0DS00 (4th edition) Date Published October 1999 NS CP(K) Printed in Japan The mark  shows major revised points.

DESCRIPTION

The PS7212-1A is a solid state relay containing GaAs LEDs on the light emitting side (input side) and normally open (N.O.) contact MOS FETs on the output side. It is suitable for analog signal control because of its low offset and high linearity.

FEATURES

  • Small and thin package (4-pin SOP, Height = 2.1 mm)
  • 1 channel type (1 a output)
  • Low LED operating current (I F = 2 mA)
  • Designed for AC/DC switching line changer
  • Low offset voltage
  • Ordering number of taping product: PS7212-1A-E3, E4, F3, F4

APPLICATIONS

  • Laptop PC, PDA
  • Modem card
  • Telephone, FAX
  • Measurement equipment

Data Sheet P13927EJ4V0DS002 PS7212-1A 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET TOP VIEW PACKAGE DIMENSIONS in millimeters 4.4 7.0±0.3 0.5±0.3 0.15+0.10 –0.05 2.54 4.0±0.5 0.05+0.08 –0.05 2.05+0.08 –0.05 0.40+0.10 –0.05 0.25 M

Data Sheet P13927EJ4V0DS00 3 PS7212-1A

ORDERING INFORMATION

Part Number Package Packing Style Application Part Number PS7212-1A 4-pin SOP Magazine case 100 pcs PS7212-1A PS7212-1A -E3 Embossed Tape 900 pcs/reel PS7212-1A -E4 PS7212-1A -F3 Embossed Tape 3 500 pcs/reel PS7212-1A -F4 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (T A = 25 °°°°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current (DC) I F 50 mA Reverse Voltage V R 5.0 V Power Dissipation P D 50 mW Peak Forward Current IFP 1A MOS FET Break Down Voltage V L 100 V Continuous Load Current IL 200 mA Pulse Load Current (AC/DC Connection) ILP 400 mA Power Dissipation P D 300 mW Isolation Voltage BV 1 500 Vr.m.s. Total Power Dissipation P T 350 mW Operating Ambient Temperature T A −40 to +80 °C Storage Temperature T stg −40 to +100 °C *1 PW = 100 µs, Duty Cycle = 1 % *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output

Data Sheet P13927EJ4V0DS004 PS7212-1A RECOMMENDED OPERATING CONDITIONS (T A = 25 °°°°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current I F 21 0 2 0 m A LED Off Voltage V F 00 . 5 V ELECTRICAL CHARACTERISTICS (T A = 25 °°°°C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage V F IF = 10 mA 1.2 1.4 V Reverse Current I R VR = 5 V 5.0 µA MOS FET Off-state Leakage Current ILoff VD = 100 V 0.03 1.0 µA Output Capacitance C out VD = 0 V, f = 1 MHz 57 pF Coupled LED On-state Current I Fon IL = 200 mA 2.0 mA On-state Resistance R on1 IF = 10 mA, IL = 10 mA 3.0 6.0 Ω R on2 IF = 10 mA, IL = 200 mA, t ≤ 10 ms Turn-on Time ton IF = 10 mA, VO = 5 V, PW ≥ 10 ms 0.35 1.0 ms Turn-off Time toff 0.08 0.2 Isolation Resistance R I-O VI-O = 1.0 kVDC 10 Ω Isolation Capacitance C I-O V = 0 V, f = 1 MHz 0.5 pF *1 Test Circuit for Switching Time VL R L IF R in Pulse Input Input monitor monitor VO ton toff 10 % 90 % VO = 5 V 50 % Output Input

Data Sheet P13927EJ4V0DS00 5 PS7212-1A TYPICAL CHARACTERISTICS (T A = 25 °°°°C, unless otherwise specified) –25 0 25 50 7580 100 100 Ambient Temperature TA (˚C) Maximum Forward Current IF (mA) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 1 mA 5 mA 20 mA 30 mA IF = 50 mA 10 mA –25 0 25 50 75 100 1.6 1.4 1.2 1.0 0.8 Ambient Temperature TA (˚C) Forward Voltage VF (V) AMBIENT TEMPERATURE FORWARD VOLTAGE vs. Ambient Temperature TA (˚C) Maximum Load Current IL (mA) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE f = 1 MHz 20 40 60 80 120100 125 100 Applied Voltage VD (V) Output Capacitance Cout (pF) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE –25 0 25 50 7580 100 150 250 300 200 100 LOAD CURRENT vs. LOAD VOLTAGE Load Voltage VL (V) Load Current IL (mA) Applied Voltage VD (V) Off-state Leakage Current ILoff (A) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE IF = 10 mA 200 100 –100 –200 12010080402006 0 10–8 10–6 10–4 10–3 10–7 10–9 10–5 25 ˚C TA = 80 ˚C

Data Sheet P13927EJ4V0DS006 PS7212-1A 5 15 20 30 2510 0.5 0.4 0.3 0.2 0.1 TURN-OFF TIME vs. FORWARD CURRENT Forward Current IF (mA) Turn-off Time toff (ms) Turn-off Time toff (ms) Number (pcs) TURN-OFF TIME DISTRIBUTION 5 15 20 2510 30 2.5 2.0 1.5 1.0 0.5 TURN-ON TIME vs. FORWARD CURRENT Forward Current IF (mA) Turn-on Time ton (ms) Turn-on Time ton (ms) Number (pcs) TURN-ON TIME DISTRIBUTION Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, IL = 10 mA –25 0 25 50 75 100 3.0 2.5 2.0 1.0 0.0 0.5 1.5 Ambient Temperature TA (˚C) Normalized On-state Resistance Ron NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION Number (pcs) On-state Resistance Ron (Ω ) n = 50 pcs, IF = 10 mA, IL = 10 mA VO = 5 V V O = 5 V n = 50 pcs, IF = 10 mA, VO = 5 V n = 50 pcs, IF = 10 mA, VO = 5 V

Data Sheet P13927EJ4V0DS00 7 PS7212-1A Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V –25 0 25 50 75 100 3.0 2.5 2.0 1.0 0.0 0.5 1.5 Ambient Temperature TA (˚C) Normalized Turn-on Time ton NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE –25 0 25 50 75 100 3.0 2.5 2.0 1.0 0.0 0.5 1.5 Ambient Temperature TA (˚C) Normalized Turn-off Time toff NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE Remark The graphs indicate nominal characteristics.

Data Sheet P13927EJ4V0DS008 PS7212-1A TAPING SPECIFICATIONS (in millimeters) 1.55±0.1 2.0±0.1 4.0±0.1 1.55±0.1 1.75±0.15.5±0.1 12.0±0.2 4.6±0.1 2.4±0.1 7.4±0.1 0.3 8.0±0.1 PS7212-1A-E3 PS7212-1A-E4 180 13.0±0.5 21.0±0.8 13.0±1.0 2.0±0.5 13.0±0.5 15˚ 15˚ 2.0 Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Packing: 900 pcs/reel

Data Sheet P13927EJ4V0DS00 9 PS7212-1A 1.55±0.1 2.0±0.1 4.0±0.1 1.55±0.1 1.75±0.15.5±0.1 12.0±0.2 4.6±0.1 2.4±0.1 7.4±0.1 0.3 8.0±0.1 PS7212-1A-F3 PS7212-1A-F4 12.4+2.0 –0.0 1.5 80±5.0φ 13.0±0.5φ 330φ1.5±0.5 2.0±0.5 6.0±1 120˚ 60 ˚ 21.0±0.8φ Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Packing: 3 500 pcs/reel

Data Sheet P13927EJ4V0DS0010 PS7212-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering

  • Peak reflow temperature 235 °C (package surface temperature)
  • Time of temperature higher than 210 °C 30 seconds or less
  • Number of reflows Two
  • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) 60 to 120 s (preheating) 210 ˚C 100 to 160 ˚C Package Surface Temperature T (˚C) Time (s) (heating) to 10 s to 30 s 235 ˚C (peak temperature) Recommended Temperature Profile of Infrared Reflow (2) Dip soldering
  • Temperature 260 °C or below (molten solder temperature)
  • Time 10 seconds or less
  • Number of times One
  • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions
  • F l u x e s Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

Data Sheet P13927EJ4V0DS00 11 PS7212-1A [MEMO]

Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.• The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

  • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
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  • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
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