PS7200R NEC | Alldatasheet

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Technical content

NEC's 4 PIN SOP, 1.1 pF LOW OUTPUT CAPACITANCE 1-ch OPTICAL COUPLED MOSFET PS7200R-1A

FEATURES

  • LOW C X R: C X R = 11 pF • Ω • LOW OUTPUT CAPACITANCE: COUT = 1.1 pF TYP
  • 1 CHANNEL TYPE: (1a output)
  • DESIGNED FOR AC/DC SWITCHING LINE CHANGER
  • SMALL AND THIN PACKAGE: 4 pin SOP, Height = 2.1 mm • HIGH ISOLATION VOLTAGE: BV = 1500 Vr.m.s.
  • LOW OFFSET VOLTAGE
  • AVAILABLE ON TAPE AND REEL: PS7200R-1A-E3, E4, F3, F4

DESCRIPTION

NEC's PS7200R-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. It is suitable for high-frequency signal control, due to its low C x R, low output capacitance, and low off-state leakage current.

APPLICATIONS

  • MEASUREMENT EQUIPMENT PART NUMBER PS7200R-1A SYMBOLS PARAMETERS UNITS MIN TYP MAX VF Forward Voltage, IF = 10 mA V 1.2 1.4 IR Reverse Current, VR = 5 V µA 5.0 ILOFF Off-State Leakage Current, VD = 40 V nA 10 COUT Output Capacitance, V = 0 V, f = 1 MHz pF 1.1 IFon LED On-state Current, I L = 120 mA mA 2.0 RON1 On-State Resistance, IF = 10 mA, IL = 10 mA Ω 10 12.5 RON2 IF = 10 mA, IL = 120 mA, t ≤ 10 ms Ω 11 14 tON Turn-on Time, IF = 10 mA, VO = 5 V, RL = 500 Ω, PW ≥ 10 ms ms 0.03 0.5 tOFF Turn-off Time, IF = 10 mA, VO = 5 V, RL = 500 Ω, PW ≥ 10 ms ms 0.3 1.0 RI-O Isolation Resistance, VI-O = 1.0 kVDC Ω 109 CI-O Isolation Capacitance, V = 0 V, f = 1 MHz pF 0.3 Diode Coupled ELECTRICAL CHARACTERISTICS (TA = 25 °C) MOSFET PS7200R-1A 1 2 Notes: 1. Test Circuit for Switching Time: 2. The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width of under 10 ms, the turn-on time and turn-off time will increase. Input 50% VO = 5 V 90% 10% ton toff Output IF Pulse Input Input Monitor VO Monitor VL Rin RL California Eastern Laboratories

SYMBOLS PARAMETERS UNITS RATINGS Diode IF Forward Current (DC) mA 50 VR Reverse Voltage V 5.0 PD Power Dissipation mW 50 IFP Peak Foward Current2 A1 MOS FET VL Break Down Voltage V 40 IL Continuous Load Current mA 120 ILP Pulse Load Current3 mA 240 (AC/DC Connection) PD Power Dissipation mW 200 Coupled BV Isolation Voltage 4 Vr.m.s. 1500 PT Total Power Dissipation mW 250 TA Operating Ambient Temp. °C -40 to +85 TSTG Storage Temperature °C -40 to +100 ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. PW = 100 µs, Duty Cycle = 1 %. 3. PW = 100 ms, 1 shot. 4. AC voltage for 1 minute at T A = 25 °C, RH = 60 % between input and output. PS7200R-1A SYMBOLS PARAMETERS UNITS MIN TYP MAX IF LED Operating Current mA 2 10 20 VF LED Off Voltage V 0 0.5 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PART NUMBER PS7200R-1A OUTLINE DIMENSIONS (Units in mm) 4.0±0.5 2.54 0.4 7.0±0.3 4.4 0.5±0.3 +0.10 -0.050.15 1 2 +0.10 -0.05 2.05 +0.08 -0.050.5 +0.08 -0.05 0.25 M TOP VIEW 1. LED Anode 2. LED Cathode 3. MOSFET 4. MOSFET 100 -25 0 25 50 75 100 85 150 100 -25 0 25 50 75 85 100 TYPICAL PERFORMANCE CURVES (TA = 25ûC) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature (TA ûC) Maximum Forward Current, I F (mA) Ambient Temperature (TA ûC) Maximum Load Current, I L (mA)

PS7200R California Eastern Laboratories- 1ATYPICAL PERFORMANCE CURVES (TA = 25ûC) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE Ambient Temperature (TA ûC) Applied Voltage, VD (V) Forward Voltage, V F (V) Output Capacitance, C OUT (pF) 1.6 1.4 1.2 1.0 0.8 -25 0 25 50 75 100 30 mA 20 mA 10 mA 5 mA 1 mA IF = 50 mA f = 1 MHz 5.0 4.0 3.0 2.0 1.0 01 0 2 0 3 0 4 0 5 0 60 10-7 10-8 10-9 10-10 10-11 10-12 10-13 02 04 0 6 08 0 100 VD = 40 V 200 100 IF = 10 mA -100 -200 -1.0 1.0-2.0 2.0 0 3.0 Normalized to 1.0 at TA = 25ûC, IF = 10 mA IL = 10 mA 2.5 2.0 1.5 1.0 0.5 0.0 -25 0 25 50 75 100 n = 50 pcs IF = 10 mA IL = 10 mA OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE LOAD CURRENT vs. LOAD VOLTAGE Ambient Temperature,TA (ûC) Off-state Leakage Current, IL off (A) On-state Resistance, Ron (Ω) Number (pcs) NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE Normalized On-state Resistance, R on Ambient Temperature,TA (ûC) ON-STATE RESISTANCE DISTRIBUTION Load Voltage, VL (V) Load Current, I L (mA)

TURN-OFF TIME vs. FORWARD CURRENT Turn-off Time t off (mS) Turn-off Time toff (ms) 05 1 0 15 20 25 30 0.10 0.08 0.06 0.04 0.02 VO = 5 V RL = 500 Ω Forward Current IF (mA) Turn-on Time t on (mS) TURN-ON TIME vs. FORWARD CURRENT Forward Current IF (mA) n = 50 pcs IF = 10 mA VO = 5 V RL = 500 Ω n = 50 pcs IF = 10 mA VO = 5 V, RL = 500 Ω Turn-on Time ton (ms) Number (pcs) Number (pcs) NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE Ambient Temperature,TA (ûC) Normalized Turn-off Time, t off Normalized to 1.0 at TA = 25ûC, IF = 10 mA VO = 5 V RL = 500 Ω 3.0 2.0 2.5 1.5 1.0 0.5 0.0 -25 0 25 50 75 100 Normalized to 1.0 at TA = 25ûC, IF = 10 mA VO = 5 V RL = 500 Ω 3.0 2.0 2.5 1.5 1.0 0.5 0.0 -25 0 25 50 75 100 NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE Ambient Temperature,TA (ûC) Normalized Turn-on Time, t on VO = 5 V, RL = 500 Ω 2.0 1.6 1.2 0.8 0.4 05 1 0 15 20 25 30 TYPICAL PERFORMANCE CURVES (TA = 25ûC) PS7200R-1A TURN-ON TIME vs. FORWARD CURRENT TURN-ON TIME vs. FORWARD CURRENT

TAPING SPECIFICATIONS (Units in mm) 2.0 ± 0.05 4.0 ± 0.1 ø1.5 1.55 ± 0.1 8.0 ± 0.1 4.6 ± 0.1

2.9 MAX

0.3 2.4±0.1 5.5 ± 0.5 7.4 ± 0.1 1.75 ± 0.1 12.0 ± 0.2 +0.1 PS7200R-1A-E3 PS7200R-1A-E4 2.0±0.5 ø13.0±0.5 15° 15° ø21.0±0.8 2.0 13.0±0.5 13.0±1.0 ø60 ø180 Reel Outline and Dimensions Tape Direction Tape Outline and Dimensions Packing: 900 pcs/reel

2.0 ± 0.1 1.55 ± 0.1 8.0 ± 0.1 4.6 ± 0.1 2.4 ± 0.1 0.3 5.5 ± 0.1 7.4 ± 0.1 1.75 ± 0.1 12.0 ± 0.2 2.0 ± 0.5 1.5 ± 0.5 12.4 +2.0 -0.0 φ21.0 ± 0.8 6.0 ± 1 120 φ 330 φ80±5.0 φ13.0±0.5 60° 1.5 Reel Outline and Dimensions Tape Direction Tape Outline and Dimensions TAPING SPECIFICATIONS (Units in mm) PS7200R-1A-F3 PS7200R-1A-F4

RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 235 °C or below (package surface temperature) •T ime of temperature higher than 210 °C 30 seconds or less • Number of reflows Two • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Recommended Temperature Profile of Infrared Reflow (2) Dip soldering •T emperature 260 °C or below (molten solder temperature) •T ime 10 seconds or less • Preheating conditions 100 °C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Time (s) Package Surface Temperature T (ûC) 100 to 160 ûC 60 to 120 s (preheating) (heating) to 10 s to 30 s 235 ûC (peak temperature) 210 ûC A Business Partner of NEC Compound Semiconductor Devices, Ltd. 11/11/2002 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.