PS1105WA STANLEY | Alldatasheet

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Package Dome Lenz Type, Water clear epoxy Half Intensity Angle Rank grouping parameter Soldering methods ESD Reflow soldering, and manual soldering ※Please refer to Soldering Conditions about soldering. 2kV (HBM) Sorted by photo current per rank taping Assembly method Auto pick & place machine (Auto Mounter) Taping and reel 2,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm 2009.3.24

Surface Mount Phototransistor/Flat Lenz Type Abs olute Ma ximum R a tings Item Symbo l Unit Collector Dissipation Pc mW Collector-Emitter Voltage V CEO V Emitter-Collector Voltage V ECO V Collector Current Ic mA O perating Temperature T opr ℃ Storage Temperature T st g ℃ Electro-O ptical Characteristics Min . 1. 6 m A TYP. 8 mA Ma x . 19 m A Response Time tr/ tf TYP. 8/ 9 μs Da rk Curre nt I CEO Ma x . 0. 1 μA Peak S ensitivity Wavelength λp TYP . 880 nm S patial Half Width ⊿θ TYP. 45 deg. ※1 Color temperature is 2,856K. Employs a standard tungsten lamp. -30～+85 -40～+90 Abs olute Maximum Ratings Photo Current Ic VCE =5V, Ee=5mW/ cm 2 ※1 Conditions VCE =10V, Ic=2mA, RL =100Ω VCEO =10V VCE =5V VCE =5V CharacteristicsItem UnitSymbol (Ta=25℃) (Ta=25℃) 2009.3.24

Photo Current Rank (Ta=25℃) ※Please contact our sales staff concerning rank designation. MIN. MA X . A1 . 6 3 . 2 B2 . 8 5 . 6 C4 . 8 9 . 6 D 8.4 16.8 E 14.4 19.0 Ic (mA) V CE = 5V Ee = 5 m W / cm2 ConditionRank PS1105WA Surface Mount Phototransistor/Flat Lenz Type 2009.3.24

Irradiance vs. Relative Photo Current Condition : Ta = 25℃, Vce = 5V Irradiance Ee(mW/cm2) Collector-Emitter Voltage vs. Photo Current Condition : Ta = 25℃ Collector-Emitter Voltage VCE(V) Wavelength vs. Relative Sensitivity Condition : Ta = 25℃, Vce = 0V Wavelength [nm] Page 4 2009.3.24 Technical Data Spatial Distribution Example Relative Sensitivity (%)Relative Photo Current Ic It is based on Ee=5mW/cm2. Employs a standard tungsten lamp of 2,856K. Relative Photo Current (%) Condition : Ta = 25℃ Photo Current Ic (mA) Employs a standard tungsten lamp of 2,856K. PS1105WA Surface Mount Phototransistor/Flat Lenz Type

Ambient Temperature vs. Relative Photo Current Condition : VCE=10V, Ic=2mA, Ta=25℃ Load Resistance : RL(Ω) Ambient Temperature vs. Collector Dissipation Ambient Temperature : Ta(℃) Ambient Temperature vs. Dark Current Condition : VCEO = 10V Ambient Temperature : Ta(℃) Page 5 2009.3.24 Technical Data Response Time Measuring Circuit Response Time (μs)Dark Current : ICEO(μA) Collector Dissipation : Pc(mW) PS1105WA Surface Mount Phototransistor/Flat Lenz Type

2009.3.24 Technical Data Ambient Temperature vs. Relative Photo Current Condition : VCE = 5V Ambient Temperature : Ta(℃) Relative Photo Current PS1105WA Surface Mount Phototransistor/Flat Lenz Type

Recommended Soldering Pattern (Unit: mm) Taping Specification (Unit: mm) (Unit: mm) Quantity: 2,000pcs/ reel (standard) Weight: (7.80)mg PS1105WA Surface Mount Phototransistor/Flat Lenz Type 2009.3.24

Reflow Soldering Conditions Manual Soldering Conditions Iron tip temp. Soldering time and frequency 3 s 1 time 350 ℃ (MAX.) (MAX.) (MAX.) (30 W Max.) PS1105WA Surface Mount Phototransistor/Flat Lenz Type 1) The above profile temperature gives the maximum temperature of the device resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the device from absorbing moisture. 3) Temperature fluctuation to the device during the pre-heating process shall be minimized. 2009.3.24

Reliability Testing Result Failure Criteria PS1105WA Surface Mount Phototransistor/Flat Lenz Type Items Symbols Conditions Failure criteria Photo Current I C EE Value of each product Irradiance of Photo Current VCE Value of each product Collector-emitter Voltage of Photo Current Testing Max. Value ≧Initial Value x 1.3 Testing Min. Value ≦ Initial Value x 0.7 Dark Current I CEO VCEO Value of each product Collector-emitter Voltage of Dark Current Testing Max. Value ≧ Spec. Max. Value x 1.2 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking Reliability Testing Result Applicable Standard Duration Failure Room Temp. Operating Life EIAJ ED- 4701/100(101) 1,000 h 0/16 Resistance to Soldering Heat EIAJ ED- 4701/300(301) Twice 0/16 Temperature Cycling EIAJ ED- 4701/100(105) 5 cycles 0/16 Wet High Temp. Storage Life EIAJ ED- 4701/100(103) 1,000 h 0/16 High Temp. Storage Life EIAJ ED- 4701/200(201) 1,000 h 0/16 Low Temp. Storage Life EIAJ ED- 4701/200(202) 1,000 h 0/16 Vibration, Variable Frequency EIAJ ED- 4701/400(403) 2 h 0/16 Testing Conditions Ta = 25℃, Pc = Maxium Rated Power Dissipation Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180℃ 120s Operating Heating 230℃ Min. Peak temperature 260℃ Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction 2009.3.24

Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet Page 10 PS1105WA Surface Mount Phototransistor/Flat Lenz Type 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2009.3.24