MQFP INTERSIL | Alldatasheet
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Technical content
Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages (MQFP/PQFP) D E E1 -A- PIN 1 A2 A1 A 5o-16o 5o-16o 0o-7o 0.40 0.016MIN L 0o MIN PLANE B 0.005/0.009 0.13/0.23WITH PLATING BASE METAL SEATING 0.005/0.007 0.13/0.17 -B- e 0.008
0.20 A-B SD SCM
0.10 0.004 -C- -D- -H- Q120.28x28 (JEDEC MO-108DA-1 ISSUE A)
120 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
A - 0.160 - 4.07 - A2 0.125 0.144 3.17 3.67 - B 0.012 0.018 0.30 0.45 6 B1 0.012 0.016 0.30 0.40 - D 1.219 1.238 30.95 31.45 3 D1 1.098 1.106 27.90 28.10 4, 5 E 1.219 1.238 30.95 31.45 3 E1 1.098 1.106 27.90 28.10 4, 5 L 0.026 0.037 0.65 0.95 - N 120 120 7 e 0.032 BSC 0.80 BSC - Rev. 0 1/94 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane . 4. Dimensions D1 and E1 to be determined at datum plane 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total. 7. “N” is the number of terminal positions. -C- -H-