BQ25638 TI | Alldatasheet
Document overview
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Technical content
BQ25638 I2C Controlled, 5-A, Maximum 18-V Input, Charger with NVDC Power Path Management and USB OTG Boost Output
1 Features
- High-efficiency 5-A, 1.5-MHz, synchronous switch mode buck charger for single cell battery – >90% efficiency down to 10-mA output current from 5-V input – Charge current up to 5 A in 80-mA steps – Charge termination from 30 to 1000 mA in 10- mA steps – Flexible JEITA profile for safe charging over temperature
- BATFET control to support shutdown and full system reset – 1.5-μA quiescent current in battery only mode – 100-nA battery leakage current in shutdown
- Supports USB On-The-Go (OTG) – Boost mode operation with 3.84-V to 9.6-V output – Programmable current limit up to 3.2 A
- Supports a wide range of input sources – 3.9-V to 18-V wide input operating voltage range with 26-V absolute maximum input voltage – VINDPM threshold automatically tracks battery voltage – Input Current Optimizer (ICO) to maximize input power without overloading adapters
- Efficient battery operation with 7-mΩ BATFET
- Narrow VDC (NVDC) power path management – System instant-on with depleted or no battery – Battery supplement when adapter is fully loaded
- Flexible autonomous or I2C-controlled modes
- Integrated 12-bit ADC for voltage, current, and temperature monitoring – ADCIN pin for external signal up-to 1 V
- High accuracy – ±0.5% (TBD) charge voltage regulation – ±5% charge current regulation – ±5% input current regulation
- Safety – Battery temperature sensing – Thermal regulation and thermal shutdown – Battery/converter overcurrent protection – Charging safety timer
2 Applications
- Gaming and Computer Accessories
- Smart Phone, Tablet
- IP Camera, EPOS
- Portable Medical Equipment
- Consumer Wearables, Smartwatch
- Portable Speakers, TWS Earphone
3 Description
The BQ25638 is a highly-integrated 5-A switch-mode battery charge management and system power path management device for single cell Li-Ion and Li- polymer batteries. The solution is highly integrated with built-in current sensing, loop compensation, input reverse-blocking FET (RBFET, Q1), high-side switching FET (HSFET, Q2), low-side switching FET (LSFET, Q3), and battery FET (BATFET, Q4) between system and battery. It uses NVDC power path management, regulating the system slightly above the battery voltage without dropping below a configurable minimum system voltage. The low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. The I2C serial interface with charging and system settings makes BQ25638 a truly flexible solution.
Package Information
NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE (NOM) BQ25638 YBG (DSBGA 30) 2.6 mm × 2.1 mm 2.6 mm × 2.1 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. I2C Bus USB Host CE System Load VBUS SW BTST SYS BAT BQ25638 TS QON Optional GND 3.9 - 18V 1.8 – 4.8V 2.6 – 4.85V 1 uH PG SYS STAT TS_BIAS ILIM BQ25638 Simplified Application ADVANCE INFORMATION BQ25638 SLUSFA2 – OCTOBER 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
4 Description (continued)
The device supports a wide range of input sources, including standard USB host port, USB charging port, and USB compliant high voltage adapter. BQ25638D sets the default input current limit based on the built-in D+/D- USB adapter detection interface. It is compliant with USB 2.0 and USB 3.0 power specifications for input current and voltage regulation. In addition, the Input Current Optimizer (ICO) supports the detection of maximum power point of the input source without overload. BQ25638 has an ILIM pin to set the default input current limit and a TS_BIAS pin for controlled thermistor bias. The device also meets USB On-the-Go (OTG) operation power rating specification with constant current limit up to 3.2 A. The power path management regulates the system slightly above battery voltage but does not drop below the programmable minimum system voltage. With this feature, the system maintains operation even when the battery is completely depleted or removed. When the input current limit or input voltage limit is reached, the power path management automatically reduces the charge current. If the system load continues to increase, the power path discharges the battery until the system power requirement is met. This supplement mode prevents overloading the input source. The device initiates and completes a charging cycle without host control. By sensing the battery voltage, it charges the battery in four different phases: trickle charge, pre-charge, constant current (CC) charge and constant voltage (CV) charge. At the end of the charging cycle, the charger automatically terminates when the charge current is below a preset threshold and the battery voltage is higher than the recharge threshold. Termination is supported for TS pin COOL, PRECOOL, NORMAL, WARM and PREWARM temperature zones. When the full battery voltage falls below the programmable recharge threshold, the charger automatically starts a new charging cycle. The charger provides various safety features for battery charging and system operations, including battery negative temperature coefficient (NTC) thermistor monitoring, charging safety timer and overvoltage and overcurrent protections. The thermal regulation reduces charge current when the junction temperature exceeds the programmable threshold. The STAT output reports the charging status and any fault conditions. Other safety features include battery temperature sensing for charge mode and OTG boost mode, thermal shutdown and input UVLO and over-voltage protection. The PG output indicates if a good power source is present and above the programmable PG_TH value. The INT output immediately notifies the host when a fault occurs or status changes. The device also provides a 12-bit analog-to-digital converter (ADC) for monitoring charge current and input/ battery/system (VBUS, BAT, SYS, TS) voltages. In addition, the ADCIN pin can be used to monitor an external signal up-to 1V. The QON pin provides BATFET enable and reset control to exit low power ship mode or initiate a full system reset. BQ25638 is available in a 30-ball, 2.6 mm × 2.1 mm DSBGA package. BQ25638 SLUSFA2 – OCTOBER 2023 www.ti.com ADVANCE INFORMATION
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5 Device and Documentation Support
5.1 Device Support
5.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation see the following:
- BQ25601 and BQ25601D (PWR877) Evaluation Module User's Guide
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
5.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
5.5 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com BQ25638 SLUSFA2 – OCTOBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: BQ25638
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. BQ25638 SLUSFA2 – OCTOBER 2023 www.ti.com ADVANCE INFORMATION
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6.1 Package Option Addendum
6.1.1 Packaging Information
Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(4) MSL Peak Temp (3) Op Temp (°C) Device Marking(5) (6) BQ25638YBGR PREVIEW DSBGA YBG 30 3000 SNAGCU Level-1-260C-UNLIM -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space (4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. space (5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (6) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. www.ti.com BQ25638 SLUSFA2 – OCTOBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: BQ25638
6.1.2 Tape and Reel Information
Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant BQ25638 SLUSFA2 – OCTOBER 2023 www.ti.com ADVANCE INFORMATION
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TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25638YBGR DSBGA YBG 30 3000 360.0 360.0 36.0 www.ti.com BQ25638 SLUSFA2 – OCTOBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: BQ25638
6.2 Mechanical Data
www.ti.com PACKAGE OUTLINE C
0.5 MAX
0.20 0.14 TYP
1.6 TYP
0.4 TYP
30X 0.27 0.23 B E A D 4224242/A 04/2018 DSBGA - 0.5 mm max heightYBG0030 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2 3
0.015 C A B
B C D E F SCALE 6.000 BQ25638 SLUSFA2 – OCTOBER 2023 www.ti.com ADVANCE INFORMATION
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www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 30X ( 0.23) (0.4) TYP (0.4) TYP ( 0.23) SOLDER MASK OPENING ( 0.23) METAL 4224242/A 04/2018 DSBGA - 0.5 mm max heightYBG0030 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 4 5 A B D E F EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 30X NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED METAL UNDER SOLDER MASK EXPOSED METAL www.ti.com BQ25638 SLUSFA2 – OCTOBER 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: BQ25638
www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP 30X ( 0.25) (R0.05) TYP 4224242/A 04/2018 DSBGA - 0.5 mm max heightYBG0030 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE: 30X METAL TYP C 1 2 3 4 5 A B D E F BQ25638 SLUSFA2 – OCTOBER 2023 www.ti.com ADVANCE INFORMATION
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www.ti.com 14-Oct-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PQ25638YBGR ACTIVE DSBGA YBG 30 3000 TBD Call TI Call TI -40 to 85 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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