PPR EDI | Alldatasheet
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Technical content
2.0 Amp
Max. DC Reverse Current @ PRV and 25 oC, IR 1.0 100IFSM (8.3ms) Amp STG -55 to +150 oC Thermal Resistance (Total Bridge), R0 j-c 7.0typ. oC/ W- A PRV/ l eg 50V 100V 200V 400V 600V 800V 1000V Type No. PPR05 PPR10 PPR20 PPR40 PPR60 PPR80 PPR100 Max. Reverse Recovery , Trr (Fig.4) 200 Nano Sec. Ambient Operating Temperature Range,TA -55 to +150 oC NOTE: O EDI reserves the right to change these specifications at any time without notice. This mark indicates recognition under the component program ofUnderwriters Laboratories,inc. PPR SERIES ELECTRICAL CHARACTERISTICS PER LEG (at TA=25 C Unl ess Oth erw ise Spe cifie d) Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 C. SINGLE-PHASE FULL WAVE BRIDGE
5.0 AMPERES HEAT SINK MOUNTING
2.0 AMPERES FOR P.C. BOARD MOUNTING Max. Forward Voltage Drop, V F =1.3 V @ IF= Max. Peak Surge Current, Storage Temperature Range, T
IF(AV). AVERAGE FORWARD CURRENT (AMP) PT(AV). TOTAL AVERAGE POWER DISSIPATION (WATTS) 0 2 4 6 8 BRIDGE OUTPUT RES IND LOADS 0 20 40 60 80 100 120 IF(AV). AVERAGE FORWARD CURRENT (AMP) BRIDGE OUTPUT RES IND LOADS O TEMPERATURE ( C) 140 1.0A 0.5A TRR ZERO REFERENCE 0.25A R R1, 2 NON-INDUCTIVE RESISTORS PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV. IKC REP.RATE, 10 SEC. PULSE WIDTH ADJUST PULSE AMPLITUDE FOR PEAK IR TEST CIRCUIT PULSE GENERATOR D.U.T. SCOPER2
1 OHM
50 OHM
21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828 ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951. Ee-mail:sales@edidiodes.com Wwebsite: http://www.edidiodes.com* 160 A B A=CASE TEMPERATURE HEAT SINK MOUNTED B=AMBIENT TEMPERATURE NON- REPETITIVE SURGE CURRENT 0.1SEC 1.0SEC 100 1 2 3 4 5 6 7 9 10 20 30 40 50 608 CYCLES(60 Hz) % MAXIMUM SURGE Figure 2 PPR SERIES MECHANICAL OUTLINE CAC B A A AC E D F LTR A B C D E F INCHES .411-.441 .137-.167 DIA .590-.610 .038-.042
1.000 MIN
.300 MAX 7.62 MAX
25.4 MIN
.97-1.07 14.99-15.49 MILLIMETERS 10.44-11.20 3.48-4.24 DIA Figure 4 NOTE: A thin film of silicone thermal compound is recommended between the Minibridge case and mounting surface for improved thermal conduction. PPR SERIES CURRENT DERATING POWER DISSIP ATION