PPC11001BLFBLK IRCTT | Alldatasheet

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IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc• 4222 South Staples Street • Corpus Christi T exas 78411 USAWire and Film Technologies Division T elephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate High temperature dielectric coating Solder over nickel barrier Metal Glaze™ Surface Mount Precision Power Chip PPC Series

  • Surge tolerant
  • Up to 1000 volts
  • Tight TCR - 25 ppm/°C
  • Tolerance down to ±0.1% Electrical Data Size Code Industry Footprint IRC Type Power Rating at 70°C (W) Working Voltage Resistance Range (ohms) Tolerance (±%) Qty / Reel (7") Qty / Reel (13") B 1206 PPC1/8 1/8 W 200 100 - 10K 0.1% (B) 0.25% (C) 0.5% (D) 2500 10000 D 2010 PPC1/2 1/2 W 300 100 - 10K 1500 5000 F 2512 PPC1 1 W 350 100 - 10K N/A 5000 H 3610 PPC2 2W 1.33W 500 100 - 10K N/A 1500 Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Solderability ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent) Life Test ±1% + 0.01 ohm 1200 gram push from underside of mounted chip for 60 seconds Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 1mm so as to exert pull on chip contacts for 5 seconds PPC Series Issue November 2008 Sheet 1 of 3
  • 4222 South Staples Street • Corpus Christi T exas 78411 USAWire and Film Technologies Division T elephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ Surface Mount Precision Power Chip Physical Data Size Code Industry Footprint Actual Size Dimensions (Inches and (mm)) L W C B 1206 0.128 ± 0.007 (3.25 ± 0.18) 0.057 ± 0.006 (1.45 ± 0.15) 0.020 ± 0.010 (0.51 ± 0.25) D 2010 0.200 ± 0.010 (5.08 ± 0.25) 0.079 ± 0.006 (2.01 ± 0.15) 0.030 ± 0.010 (0.761 ± 0.25) F 2512 0.251 ± 0.010 (6.38 ± 0.25) 0.079 ± 0.006 (2.01 ± 0.15) 0.040 ± 0.010 (1.02 ± 0.25) H 3610 0.367 ± 0.010 (9.32 ± 0.25) 0.105 ± 0.006 (2.67 ± 0.15) 0.050 ± 0.010 (1.27 ± 0.25) Recommended Solder Pad Dimensions (Reflow): Size Code Industry Footprint Dimensions (Inches and mm)) A B C D E F B 1206 0.076 (1.93) 0.093 (2.36) 0.058 (1.47) 0.098 (2.49) 0.032 (0.81) 0.211 (5.36) D 2010 0.111 (2.82) 0.126 (3.20) 0.096 (2.44) 0.152 (3.86) 0.040 (1.02) 0.318 (8.08) F 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) H 3610 0.170 (4.32) 0.160 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) F EB D A C A L C W Recommended Solder Pad Dimensions (Reflow): To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a large repeatable solder fillet to the PPC resistor on reflow processes and will provide maximum heat transfert to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the "tacky" state, the PPC will be held in position until solder reflow begins. The pad design thes uses the surface tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising above the board level directly beneath the PPC is not recommended. PPC Series Issue November 2008 Sheet 2 of 3
  • 4222 South Staples Street • Corpus Christi T exas 78411 USAWire and Film Technologies Division T elephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Sample Part No. IRC Type PPC 1/8, 1/2, 1, 2 Resistance Value (EIA 4-digit code) (≥100Ω - First 3 significant digits plus 4th digit multiplier) Example: 100Ω = 1000; 1000Ω = 1001 (>100Ω - "R" is used to designate decimal) Example: 10Ω = 10R0; 0.25Ω = R250 Tolerance (EIA format) RoHS Indicator LF indicates RoHS compliance Blank designates 60% Sn / 40% Pb Solder Packaging (BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel) Ordering Data PPC1 25 1001 F LF 13 Metal Glaze™ Surface Mount Precision Power Chip Size Code Industry Footprint Reel Diameter* Quantity Per Reel Carrier Tape Width Component Pitch B 1206 7", 13" 2,500 max., 10,000 max. 8mm 4mm D 2010 7", 13" 1,500 max., 5,000 max. 12mm 4mm F 2512 13" 5,000 max. 12mm 4mm H 3610 7" 1,500 max. 24mm 4mm Standard Reel Packaging Per EIA-481 * The 13" reel is considered standard and will be supplied unless otherwise specified. 30 40 50 60 70 80 90 100 110 120 130 140 150 % of Rated Power 100 Ambient Temperature (°C) PPC 1/8, 1/2, 1 PPC 2 Power Derating Curve Specify type, resistance, tolerance, RoHS-Compliance and packaging. This example is for a Surface Mount Precision Power Chip. Repetitive Surge Curve .1msec 1msec 10msec 100msec 10000msec Peak Power (watts) Surge or Pulse Duration (seconds) PPC 1 PPC 2 PPC 1/8 1000 100 PPC 1/2 PPC Series Issue November 2008 Sheet 3 of 3