PMPS-E-1206 Series

Document overview

  • Manufacturer or author: ProTek Devices
  • PDF pages: 7

Technical content

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 1

05462 PMPS-E-1206 SERIES

DESCRIPTION

Surface mount PTC devices are the preferred over-current protection method for computer, consumer electronic, por- table electronics and automotive applications. These devices are suitable for automated assembly and are designed to save on board space.

FEATURES

  • Over-Current Protection
  • Compatible with High-Volume Electronic Assembly
  • RoHS Compliant
  • Halogen Free MECHANICAL CHARACTERISTICS
  • Surface Mount Device: Size 1206
  • Approximate Weight: 0.0058 grams
  • Lead-Free
  • 8mm Tape and Reel Per EIA Standard 481

APPLICATIONS

  • Motherboard USB & IEEE 1394 Protection
  • USB Hubs, Ports and Peripherals
  • Battery PCM
  • Mobile Internet Device (MID)
  • Game Console Port Protection
  • Optical Electronics
  • Security Systems
  • Industrial Controls
  • Set-Top Box and HDMI
  • IC VCC Protection PTC DEVICE

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 2 TYPICAL DEVICE CHARACTERISTICS ELECTRICAL SPECIFICATIONS PART NUMBER MARKING CODE MAXIMUM HOLDING CURRENT (Note 1) IH AMPS MINIMUM TRIP CURRENT (Note 2) IT AMPS MAXIMUM INTERRUPT VOLTAGE (Note 3) VMAX VOLTS MAXIMUM FAULT CURRENT (Note 4) IMAX AMPS MAXIUM TIME-TO-TRIP CURRENT (Note 5) TTRIP AMPS @ S ecs TYPICAL POWER DISSIPATION (Note 6) PD WATTS MINIMUM RESISTANCE (Note 7) RMIN OHMS MAXIMUM RESISTANCE (Note 8) RMAX OHMS NOTES 1. The maximum current at which the device will not trip at 25°C in still air. 2. The minimum current at which the device will always trip at 25°C in still air. 3. The maximum interrupt voltage the device can withstand without damage at the rated current. 4. The maximum fault current the device can withstand without damage at the rated voltage. 5. The maximum time to trip at the assigned current. 6. The typical amount of power dissipated by the device when in state air environment. 7. The minimum device resistance at 25°C prior to tripping. 8. The maximum device resistance at 25°C measured one hour post reflow.

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 3 TYPICAL DEVICE CHARACTERISTICS TEST PROCEDURES AND REQUIREMENTS TEST CONDITIONS ACCEPTANCE CRITERIA Resistance In Still Air @ 25°C Rmin <= R <= Rmax Time to Trip (TTrip) Specified Current Vmax - In Still Air @ 25°C T <= Max Time to Trip Holding Current (IH) 30 Minutes at IH - In Still Air @ 25°C No Trip Trip Life Cycle Vmax, Imax, 100 Cycles - In Still Air @ 25°C No Arcing or Burning Trip Endurance Vmax, 60 Minutes - In Still Air @ 25°C No Arcing or Burning Ambient Temperature - °C FIGURE 1 THERMAL DERATING CURVE (Rated Holding Current at Ambient Temperature) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 % of Rated Holding and Trip Current 100 120 140 160 MAXIMUM AMBIENT OPERATING TEMPERATURES - °C BASE PART NUMBER PMPS-E-1206 T (°C) -40 -20 0 25 40 50 60 70 85

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 4 TYPICAL DEVICE CHARACTERISTICS SOLDERING PARAMETERS PROFILE FEATURES PB-FREE ASSEMBLY Average Ramp-Up Rate - Tsmin to Tp 3°C/Second Max Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) 150°C 200°C 60-180 Seconds Time Maintained Above: - Temperature (Tm) - Time (tm) 217°C 60-150 Seconds Peak Temperature (Tp) 260°C Time within 5°C of Tp (tp) 20-40 Seconds Ramp-Down Rate 6°C/Seconds Max Time 25°C to Tp 8 Minutes Max 1. All temperatures refer to topside of the package, mea- sured on the package body surface. 2. Recommended reflow methods: IR, Vapor Phase, Hot Air Oven. 3. Devices are not designed to be wave soldered to the bot- tom side of the board. 4. Devices can be cleaned using standard industry methods and solvents. 5. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. t 25°C to Peak Time Ramp-Down ts Preheat Tsmin Tsmax Tm Tp Temperature tm Ramp-Up Tp Critical Zone Tm to Tp NOTICES The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are antici- pated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame. WARNING Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product. Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual force should remain on the device after installation. Mechanical damage to Polymeric thermistors chip may affect device performance and should be avoided. Chemical contamination of Polymeric thermistors should be avoided. Certain greases, solvents, hydraulic fluids, fuels, industrial cleaning agents, volatile components of adhesives, silicones and electrolytes can have an adverse effect on the device performance. Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases, corrosive agents, humid or salty conditions. Contact with any liquids and solvents should be prevented. Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal and mechanical procedures for electronic components.

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 5 PACKAGE OUTLINE AND PAD LAYOUT INFORMATION OUTLINE DIMENSIONS DIM MILLIMETERS INCHES MIN MAX MIN MAX A 3.00 3.40 0.12 0.14 B 1.50 1.80 0.06 0.07 C 0.60 0.02 D 0.25 0.75 0.01 0.03 E 0.05 0.45 0.002 0.018 NOTES 1. Dimensions are exclusive of mold flash and metal burrs. OUTLINE DIMENSIONS DIM MILLIMETERS INCHES NOM NOM F 1.80 0.07 G 1.00 0.040 H 1.80 0.07 NOTES 1. Dimensions are exclusive of mold flash and metal burrs. D E A F C G G H B

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ORDERING INFORMATION

BASE PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE QTY PMPSxxx-E-1206 N/A -T7 4,000 7” N/A This device is only available in a Lead-Free configuration. The ambient temperature for storage is -40°C~40°C, with a maximum relative humidity recommended at 70%RH.

10 Pitches Cumulative

Tolerance on tape ± 0.2 WF EP2 P0D P t User Direction of Feed Top Cover Tape SPECIFICATIONS REEL DIA. TAPE WIDTH A0 B0 K0 D E F W P0 P2 P t NOTES 1. Dimensions are in millimeters. 2. Surface mount product is taped and reeled in accordance with EIA-481. 3. Suffix - T7 = 7” Reel - 4,000 pieces per 8mm tape. 4. Marking on Part - marking code.

Only One Name Means ProTek’Tion™ www.protekdevices.com 05462.R0 6/14Page 7 COPYRIGHT © ProTek Devices 2014 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. CONTACT US Corporate Headquarters

2929 South Fair Lane

Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: & Marketing: 602-414-5109 Customer Service: 602-414-5114 Product Technical Support: 602-414-5107 By Fax General: 602-431-2288 By E-mail: Asia Sales: asiasales@protekdevices.com Europe Sales: europesales@protekdevices.com U.S. Sales: ussales@protekdevices.com Distributor Sales: distysales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com ProTek Devices (Asia Pacific) Pte. Ltd.

8 Ubi Road 2, #06-19

Tel: +65-67488312 Fax: +65-67488313 Web www.protekdevices.com COMPANY PROFILE In business more than 20 years, ProTek Devices™ is a privately held semiconductor company. The company offers a product line of overvoltage pro- tection and overcurrent protection components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering diode TVS array and electronics SMD chip fuses. These components deliver circuit protection in electronic systems from numerous overvoltage and overcurrent events. They include lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electro- magnetic interference (EMI) / radio frequency interference (RFI). ProTek Devices also offers high performance interface and linear products. They include analog switches; multiplexers; LED drivers; LED wafer die for ESD protection; audio control ICs; RF and related high frequency products.