PMBD914/DG

PMBD914_09 NXP | Alldatasheet

Document overview

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Technical content

1.1 General description

small Surface-Mounted Device (SMD) plastic package.

1.2 Features

1.3 Applications

1.4 Quick reference data

[2] When switched from IF = 10 mA to IR = 10 mA; RL = 100Ω ; measured at IR = 1 mA. Table 1. Product overview Table 2. Quick reference data

PMBD914_6 © NXP B.V. 2009. All rights reserved. Table 3. Pinning Table 4. Ordering information Table 5. Marking codes Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

PMBD914_6 © NXP B.V. 2009. All rights reserved. [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Tj=2 5°C prior to surge. [3] Soldering point of cathode tab. [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. [1] When switched from IF = 10 mA to IR = 10 mA; RL = 100Ω ; measured at IR = 1 mA. [2] When switched from IF = 10 mA; tr =2 0n s . Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Table 7. Thermal characteristics Table 8. Characteristics Tamb =2 5°C unless otherwise specified.

PMBD914_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 11 February 2009 4 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode (1) Tamb = 150°C; typical values (2) Tamb =2 5°C; typical values (3) Tamb =2 5°C; maximum values Based on square wave currents. Tj=2 5°C; prior to surge Fig 1. Forward current as a function of forward voltage Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values (1) VR = 75 V; maximum values (2) VR = 75 V; typical values (3) VR = 25 V; typical values f = 1 MHz; Tamb =2 5°C Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values 300 IF (mA ) 100 200 mbg382

1 VF (V)

(1) (2) (3) mbg704 102 IFSM (A) 10−1 tp (µs) 11 0 410310 10 2 105 104 2000 mga884

100 Tj (°C )

(nA) 103 102 (2) (1) (3) 08 1 6 124 0.8 0.6 0.4 0.2 mbg446 VR (V) C d (pF)

PMBD914_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 11 February 2009 5 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 8. Test information FR4 PCB, standard footprint Fig 5. Forward current as a function of ambient temperature; derating curve 0 50 100 200 250 200 msa562 150 150 100 IF (mA) Tamb (°C) (1) IR =1m A Fig 6. Reverse recovery time test circuit and waveforms Fig 7. Forward recovery voltage test circuit and waveforms trr (1) + IF t output signal tr tp t 10 % 90 %VR input signal V = VR + IF · R S R S = 50 W IF D.U.T. R i = 50 W SAMPLING OSCILLOSCOPE mga881 tr t tp 10 % 90 % I input signal R S = 50 Ω I R i = 50 Ω OSCILLOSCOPE 1 kΩ 450 Ω D.U.T. mga882 VFR t output signal V

PMBD914_6 © NXP B.V. 2009. All rights reserved. [1] For further information and the availability of packing methods, seeSection14. Table 9. Packing methods

PMBD914_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 11 February 2009 7 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 11. Soldering Fig 9. Reflow soldering footprint SOT23 (TO-236AB) Fig 10. Wave soldering footprint SOT23 (TO-236AB) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3·) 0.6 (3·) 0.6 (3·) 0.7 (3·) 3.3 2.9 1.7 1.9 Dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot023_fw 2.8 4.5 1.4 4.6 1.4 (2·) 1.2 (2·) 2.2 2.6 Dimensions in mm

PMBD914_6 © NXP B.V. 2009. All rights reserved. Table 10. Revision history

• Type number PMBD914/DG added
• Section 13 “Legal information”: updated PMBD914_5 20071126 Product data sheet - PMBD914_4 PMBD914_4 20040106 Product specification - PMBD914_3 PMBD914_3 19990511 Product specification - PMBD914_2 PMBD914_2 19960918 Product specification - PMBD914_1 PMBD914_1 19960404 Product specification - -

PMBD914_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 11 February 2009 9 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data —The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors PMBD914 Single high-speed switching diode © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 February 2009 Document identifier: PMBD914_6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents