Comparator

PM2903BQDDFRQ1

Texas Instruments

LM2903-Q1 and LM2903B-Q1 Automotive Dual Comparators

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Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2903-Q1, LM2903B-Q1 SLCS141I –MAY 2003–REVISED JUNE 2020 LM2903-Q1andLM2903B-Q1AutomotiveDualComparators

1 Features

1• Qualified for automotive applications

AEC-Q100 qualified with the following results: – Device temperature grade 0: –40°C to 150°C ambient operating temperature range (LM2903E-Q1) – Device temperature grade 1: –40°C to 125°C ambient operating temperature range – Device HBM ESD classification level H1C – Device CDM ESD classification level C4B
Improved 2 kV HBM ESD for "B" device
Single supply or dual supplies
Low supply-current independent of supply voltage 200 uA Typ Per comparator ("B" Versions)
Low input bias current 3.5 nA Typ ("B" device)
Low input offset current 0.5 nA Typ ("B" device)
Low input offset voltage ±0.37 mV Typ ("B" device)
Common-mode input voltage range includes ground
Differential input voltage range equal to maximum- rated supply voltage ±36 V
Output compatible with TTL, MOS, and CMOS
Functional Safety-Capable – Documentation available to aid functional safety system design

2 Applications

Automotive – HEV/EV and power train – Infotainment and cluster – Body control module
Industrial
Appliances
Power delivery

3 Description

The LM2903B-Q1 device is the next generation version of the industry-standard LM2903-Q1 comparator family. This next generation family provides outstanding value for cost-sensitive applications, with features including lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, and improved 2kV ESD performance with improved negative input voltage handling and drop-in replacement convenience. All devices consist of two independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible as long as the difference between the two supplies is within 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. The LM2903-Q1 and LM2903B-Q1 are Qualified for the AEC-Q100 Grade 1 temperature range of -40°C to +125°C. The LM2903E-Q1 is Qualified for the AEC-Q100 Grade 0 extended temperature range of -40°C to +150°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM2903B-Q1 SOIC (8) 4.90 mm × 3.91 mm TSSOP (8) 3.00 mm × 4.40 mm VSSOP(8) 3.00 mm x 3.00 mm WSON (8) 2.00 mm x 2.00 mm SOT-23 (8) 1.60 mm × 2.90 mm LM2903-Q1 SOIC (8) 4.90 mm × 3.91 mm TSSOP (8) 3.00 mm × 4.40 mm VSSOP(8) 3.00 mm x 3.00 mm LM2903E-Q1 TSSOP (8) 3.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Family Comparison Table Specification LM2903B-Q1 LM2903-Q1 LM2903-Q1 "A" Devices LM2903-Q1 "AV" Devices LM2903E-Q1 Units Specified Supply Votlage 3 to 36 2 to 30 2 to 30 2 to 32 2 to 30 V Temperature Range −40 to 125 −40 to 125 −40 to 125 −40 to 125 -40 to 150 °C ESD (HBM / CDM) 2k / 1k 1k / 750 1k / 750 1k / 750 1k / 750 V Offset Voltage (max over temp) ± 4 ± 15 ± 4 ± 4 ± 15 mV Input Bias Current (typ / max) 3.5 / 25 25 / 250 25 / 250 25 / 250 25 / 250 nA Response Time (typ) 1 1.3 1.3 1.3 1.3 µsec

6.1 Absolute Maximum Ratings, LM2903-Q1 and

6.5 Recommended Operating Conditions, LM2903B-

6.6 Recommended Operating Conditions, LM2903-Q1.. 5

6.7 Recommended Operating Conditions, LM2903E-

6.8 Thermal Information, LM2903-Q1 and LM2903E-

6.12 Electrical Characteristics, LM2903-Q1 and

6.13 Switching Characteristics, LM2903-Q1 and

6.14 Typical Characteristics, LM2903-Q1 and LM2903E-

11.3 Receiving Notification of Documentation Updates 19

12 Mechanical, Packaging, and Orderable

4 Revision History

Changes from Revision H (January 2020) to Revision I Page Changes from Revision G (November 2018) to Revision H Page Changes from Revision F (May 2018) to Revision G Page

21IN± 7 2OUT 31IN+ 6 2IN ± 4GND 5 2IN+ Exposed Thermal Die Pad on Underside 1OUT 1IN− 1IN+ GND VCC 2OUT 2IN− 2IN+ LM2903-Q1, LM2903B-Q1 www.ti.com SLCS141I –MAY 2003–REVISED JUNE 2020 Product Folder Links: LM2903-Q1 LM2903B-Q1 Submit Documentation FeedbackCopyright © 2003–2020, Texas Instruments Incorporated

5 Pin Configuration and Functions

D, DGK, DDF OR PW PACKAGE Top View 8-Pin WSON With Exposed Pad Top View Connect thermal pad directly to GND pin. Pin Functions PIN I/O DESCRIPTION NAME SOIC, VSSOP, PDIP, SO, DDF and TSSOP DSG 1OUT 1 1 Output Output pin of comparator 1 1IN– 2 2 Input Negative input pin of comparator 1 1IN+ 3 3 Input Positive input pin of comparator 1 GND 4 4 — Ground 2IN+ 5 5 Input Positive input pin of comparator 2 2IN- 6 6 Input Negative input pin of comparator 2 2OUT 7 7 Output Output pin of comparator 2 VCC 8 8 — Positive Supply Thermal Pad — PAD — Connect directly to GND pin

LM2903-Q1, LM2903B-Q1 SLCS141I –MAY 2003–REVISED JUNE 2020 www.ti.com Product Folder Links: LM2903-Q1 LM2903B-Q1 Submit Documentation Feedback Copyright © 2003–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to GND. (3) Differential voltages are at IN+ with respect to IN−.

6 Specifications

6.1 Absolute Maximum Ratings, LM2903-Q1 and LM2903E-Q1

over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 36 V VCC Supply voltage, LM2903E-Q1 Only(2) 32 V VID Differential input voltage(3) –36 36 V VI Input voltage range (either input) −0.3 36 V VO Output voltage 36 V IO Output current 20 mA TSCG Duration of output short-circuit to ground Unlimited s (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Differential voltages are at IN+ with respect to IN- (3) Short circuits from outputs to V+ can cause excessive heating and eventual destruction.

6.2 Absolute Maximum Ratings, LM2903B-Q1

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) -0.3 38 V Differential input voltage : VID (2) ±38 V Input pins (IN+, IN–) -0.3 38 V Current into input pins (IN+, IN–) -50 mA Output pin (OUT) -0.3 38 V Output sink current 25 mA Output short-circuit duration(3) Unlimited s (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings, LM2903-Q1 and LM2903E-Q1

Tstg Storage temperature range LM2903-Q1 Only –65 150 °C V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) -1000 1000 V Charged device model (CDM), per AEC Q100-011 All pins -750 750 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 ESD Ratings, LM2903B-Q1

Tstg Storage temperature range –65 150 °C V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) -2000 2000 V Charged device model (CDM), per AEC Q100-011 All pins -1000 1000

6.5 Recommended Operating Conditions, LM2903B-Q1

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) 3 36 V Ambient temperature, TA, LM2903B –40 125 °C Input voltage range, VIVR –0.1 (V+) – 2 V

6.6 Recommended Operating Conditions, LM2903-Q1

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC (non-V devices) 2 30 V VCC (V devices) 2 32 V TJ Junction Temperature -40 125 °C

6.7 Recommended Operating Conditions, LM2903E-Q1

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC 2 30 V TJ Junction Temperature -40 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.8 Thermal Information, LM2903-Q1 and LM2903E-Q1

THERMAL METRIC(1) LM2903E-Q1 LM2903-Q1 UNITPW (TSSOP) DGK (VSSOP) PW (TSSOP) D (SOIC)

8 PINS 8 PINS 8 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 178.9 199.4 186.6 126.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 70.7 120.8 79.6 74.2 RθJB Junction-to-board thermal resistance 108.9 90.2 116.5 66.4 ψJT Junction-to-top characterization parameter 11.9 21.5 17.7 25.4 ψJB Junction-to-board characterization parameter 107.3 119.1 114.9 65.9 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.9 Thermal Information, LM2903B-Q1

THERMAL METRIC(1) LM2903B-Q1 UNITD (SOIC) DGK (VSSOP) PW (TSSOP) DSG (WSON) DDF (SOT-23)

8 PINS 8 PINS 8 PINS 8 PINS 8 PINS

°C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 38.7 -

6.10 Electrical Characteristics LM2903B - Q1

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV VS = 5 to 36V, TA = –40°C to +125°C –4 4 IB Input bias current –3.5 –25 nA TA = –40°C to +125°C –50 nA IOS Input offset current –10 ±0.5 10 nA TA = –40°C to +125°C –25 25 nA VCM Common mode range VS = 3 to 36V (V–) (V+) – 1.5 V VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +125°C 550 mV IOH-LKG High-level output leakage current (V+) = VO = 5 V; VID = 1V 0.1 20 nA (V+) = VO = 36V; VID = 1V 0.3 50 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA IQ Quiescent current (all comparators) VS = 5 V, no load 400 600 µA VS = 36 V, no load, TA = –40°C to +125°C 550 800 µA (1) High-to-low and low-to-high refers to the transition at the input.

6.11 Switching Characteristics LM2903B - Q1

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tresponse Propagation delay time, high-to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns tresponse Propagation delay time, high-to-low; Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns

LM2903-Q1, LM2903B-Q1 www.ti.com SLCS141I –MAY 2003–REVISED JUNE 2020 Product Folder Links: LM2903-Q1 LM2903B-Q1 Submit Documentation FeedbackCopyright © 2003–2020, Texas Instruments Incorporated (1) Full range (MIN or MAX) for LM2903-Q1 is −40°C to 125°C and −40°C to 150°C for the LM2903E-Q1 . All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices. (3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common- mode voltage range is VCC+ − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the VCC level; the comparator provides a proper output state. Either or both inputs can go to 30 V (32V for V-suffix devices) without damage.

6.12 Electrical Characteristics, LM2903-Q1 and LM2903E-Q1

at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) MIN TYP MAX UNIT VIO Input offset voltage VO = 1.4 V, VIC = VIC(min), VCC = 5 V to MAX(2) Non-A devices 25°C 2 7 mV Full range 15 A-suffix devices 25°C 1 2 Full range 4 IIO Input offset current VO = 1.4 V 25°C 5 50 nA Full range 200 IIB Input bias current VO = 1.4 V 25°C −25 −250 nA Full range −500 VICR Common-mode input voltage range(3) 25°C 0 to VCC−1.5 V Full range 0 to VCC−2 AVD Large-signal differential-voltage amplification VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC 25°C 25 100 V/mV IOH High-level output current VOH = 5 V VID = 1 V 25°C 0.1 50 nA VOH = VCC MAX(2) Full range 1 µA VOL Low-level output voltage IOL = 4 mA, VID = −1 V 25°C 150 400 mV Full range 700 IOL Low-level output current VOL = 1.5 V, VID = −1 V 25°C 6 mA ICC Supply current RL = ∞ VCC = 5 V 25°C 0.8 1 mA VCC = MAX(2) Full range 2.5 (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.

6.13 Switching Characteristics, LM2903-Q1 and LM2903E-Q1

VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Response time RL connected to 5 V through 5.1 kΩ, 100-mV input step with 5-mV overdrive 1.3 µs CL = 15 pF(1)(2) TTL-level input step 0.3

6.14 Typical Characteristics, LM2903-Q1 and LM2903E-Q1 Only

Figure 1. Supply Current vs. Supply Voltage Figure 2. Supply Current vs. Supply Voltage Figure 3. Input Bias Current vs. Supply Voltage Figure 4. Input Bias Current vs. Supply Voltage Figure 5. Output Low Voltage vs. Output Current Figure 6. Output Low Voltage vs. Output Current

6.15 Typical Characteristics, LM2903B-Q1 Only

Figure 7. Total Supply Current Figure 8. Total Supply Current Figure 9. Total Supply Current Figure 10. Total Supply Current Figure 11. Total Supply Current Figure 12. Total Supply Current

62 Channels

63 Channels

Figure 13. Input Offset Voltage Figure 14. Input Offset Voltage Figure 15. Input Offset Voltage Figure 16. Input Offset Voltage Figure 17. Input Offset Voltage Figure 18. Input Offset Voltage

Figure 19. Input Offset Voltage Figure 20. Input Offset Voltage Figure 21. Input Bias Current Figure 22. Input Bias Current Figure 23. Input Bias Current Figure 24. Input Bias Current

7 Detailed Description

7.1 Overview

wide supply voltages range (2 V to 36 V), low Iq and fast response. enable the comparator to be used in AND functionality.

7.2 Functional Block Diagram

Figure 39. Schematic (Each Comparator)

7.3 Feature Description

mode voltage capability, allowing LM2903-Q1 to accurately function from ground to VCC–1.5V differential input. This is enables much head room for modern day supplies of 3.3 V and 5.0 V. and LM2903E-Q1 Only section for VOL values with respect to the output current.

7.4 Device Functional Modes

7.4.1 Voltage Comparison

input differential polarity.

8 Application and Implementation

8.1 Application Information

LM2903-Q1 will typically be used to compare a single signal to a reference or two signals against each other. shifting to a higher or lower voltage.

8.2 Typical Application

Figure 40. Single-ended and Differential Comparator Configurations

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters

8.2.2 Detailed Design Procedure

Input Voltage Range
Minimum Overdrive Voltage
Output and Drive Current
Response Time

8.2.2.1 Input Voltage Range

When both IN- and IN+ are both within the common mode range:

When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking

8.2.2.2 Minimum Overdrive Voltage

and negative response times with respect to overdrive voltage.

8.2.2.3 Output and Drive Current

Figure 5 to determine VOL based on the output current. The output current can also effect the transient response. More will be explained in the next section.

8.2.2.4 Response Time

equivalent collector-emitter resistance (RCE).

The positive response time (τp) is approximately τP ~ RPULLUP × CL
The negative response time (τN) is approximately τN ~ RCE × CL – RCE can be determine by taking the slope of Figure 5 in it's linear region at the desired temperature, or by dividing the VOL by Iout

8.2.3 Application Curves

The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe. Figure 41. Response Time for Various Overdrives Figure 42. Response Time for Various Overdrives

8 VCC

9 Power Supply Recommendations

comparator's input common mode range and create an inaccurate comparison.

10 Layout

10.1 Layout Guidelines

used, do not put a capacitor between the IC's GND pin and system ground.

10.2 Layout Example

Figure 43. LM2903Q1 Layout Example

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

11.2 Related Links

resources, tools and software, and quick access to sample or buy. Table 2. Related Links

11.3 Receiving Notification of Documentation Updates

changed. For change details, review the revision history included in any revised document.

11.4 Support Resources

from the experts. Search existing answers or ask your own question to get the quick design help you need. not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 4-Nov-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM2903AVQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ LM2903AVQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ LM2903AVQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ LM2903AVQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ LM2903BQDDFRQ1 PREVIEW SOT-23-THIN DDF 8 250 TBD Call TI Call TI -40 to 125 LM2903BQDGKRQ1 PREVIEW VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 LM2903BQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903BQ LM2903BQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903BQ LM2903BWDSGRQ1 PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 LM2903EPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 150 2903Q0 LM2903QDGKRQ1 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAUAG Level-2-260C-1 YEAR -40 to 125 KACQ LM2903QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1 LM2903QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1 LM2903QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1 LM2903QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1 LM2903VQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1 LM2903VQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1 LM2903VQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ

www.ti.com 4-Nov-2020 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM2903VQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ PLM2903BWDSGRQ1 ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 PM2903BQDDFRQ1 ACTIVE SOT-23-THIN DDF 8 3000 TBD Call TI Call TI -40 to 125 PM2903BQDGKRQ1 ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 4-Nov-2020 Addendum-Page 3 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2903-Q1, LM2903B-Q1 :

Catalog: LM2903 , LM2903B NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2903AVQDRQ1 SOIC D 8 2500 340.5 338.1 20.6 LM2903AVQPWRG4Q1 TSSOP PW 8 2000 367.0 367.0 35.0 LM2903AVQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0 LM2903BQDRQ1 SOIC D 8 2500 340.5 338.1 20.6 LM2903BQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0 LM2903EPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0 LM2903QDGKRQ1 VSSOP DGK 8 2500 366.0 364.0 50.0 LM2903QPWRG4Q1 TSSOP PW 8 2000 853.0 449.0 35.0 LM2903QPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0 LM2903VQPWRG4Q1 TSSOP PW 8 2000 367.0 367.0 35.0 LM2903VQPWRQ1 TSSOP PW 8 2000 853.0 449.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C TYP2.95 2.65

1.1 MAX

6X 0.65 8X 0.4 0.2 1.95 TYP0.20 0.08 0 - 8 0.1 0.0 0.25 GAGE PLANE 0.6 0.3 A NOTE 3 2.95 2.85 B 1.65 1.55 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 1 8

0.1 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT (2.6) 8X (1.05) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE SYMM SYMM LAND PATTERN EXAMPLE SCALE:15X 4 5 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (2.6) 6X (0.65) 8X (0.45) 8X (1.05) (R ) TYP0.05 4222047/B 11/2015 SOT-23 - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. WSON - 0.8 mm max heightDSG 8 PLASTIC SMALL OUTLINE - NO LEAD2 x 2, 0.5 mm pitch 4224783/A

www.ti.com PACKAGE OUTLINE C TYP6.6 6.2

1.2 MAX

6X 0.65 8X 0.30 0.19 1.95 0.15 0.05 (0.15) TYP 0 - 8 0.25 GAGE PLANE 0.75 0.50 A NOTE 3 3.1 2.9 B NOTE 4 4.5 4.3 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. 1 8 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT (5.8)

0.05 MAX

0.05 MIN

8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 4 5 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.8) 6X (0.65) 8X (0.45) 8X (1.5) (R ) TYP0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X

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Product Information

PM2903BQDDFRQ1 specifications and overview.

Summary

LM2903-Q1 and LM2903B-Q1 Automotive Dual Comparators

Description

LM2903-Q1 and LM2903B-Q1 Automotive Dual Comparators

Source title PM2903BQDDFRQ1 Datasheet(PDF) - Texas Instruments

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