PLMK6CE02500CDLFT

Texas Instruments

LMK6x High-Performance BAW Oscillator APRIL 2022

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LMK6x High-Performance BAW Oscillator

1 Features

Differential and single-ended output, any frequency within the given range can be supported: – LMK6P: LVPECL output, 1 – 400 MHz – LMK6D: LVDS output, 1 – 400 MHz – LMK6C: LVCMOS output, 1 – 200 MHz
Ultra-low jitter: – 100-fs RMS jitter, Fout ≥ 100 MHz, LMK6P/ LMK6D – 300-fs RMS jitter, Fout ≥ 25 MHz, LMK6C
±25-ppm total frequency stability inclusive of all factors and 10 year aging
Smallest industry standard package: 2.50 mm × 2.00 mm (DLF) – 3.20 mm × 2.50 mm (DLE) also available
Support extended industrial temperature grade: – LMK6P/LMK6D: –40°C to 85°C – LMK6C: –40°C to 105°C
Integrated LDO for robust supply noise immunity
< 5-ms start-up time
Supply voltage options of 1.8 V and 2.5 V – 3.3 V
Fixed-frequency devices, programmed at the factory. Short leadtime on new frequencies for sampling. Contact TI representative.

2 Applications

High-performance replacement for crystal oscillators
56G/112G PAM4 clocking
400G/800G Optical Transport Network and Coherent Optics
Network equipment, switches, routers, line cards, SAN, data centers and baseband units (BBU)
Test and measurement
Medical imaging
Professional audio/video
FPGA and ASIC clocking

3 Description

Texas Instruments' Bulk-Acoustic Wave (BAW) is a micro-resonator technology that enables the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuits. BAW is fully designed and manufactured at TI factories like other silicon-based fabrication processes. The LMK6x device is a low jitter, fixed-frequency oscillator which incorporates the BAW as the resonator source. With a high-performance fractional frequency divider, the LMK6x is capable of producing any frequency within the specified range providing a single device family for all frequency needs. The device is factory-programmed per specific operation mode, including frequency, voltage, output type, and function pin. Contact a TI representative for additional frequencies or other options. The high-performance clocking, mechanical stability, flexibility and small package options for this device are designed for reference and core clocks in high- speed SERDES used in Telecommunications, Data and Enterprise Network and Industrial applications. Device Information PART NUMBER OUTPUT TYPE PACKAGE(1) BODY SIZE (NOM) LMK6C (DLE) LVCMOS VSON (4) 3.20 mm × 2.50 mm LMK6C (DLF) VSON (4) 2.50 mm × 2.00 mm LMK6P (DLE)(2) LVPECL VSON (6) 3.20 mm × 2.50 mm LMK6P (DLF)(2) VSON (6) 2.50 mm × 2.00 mm LMK6D (DLE)(2) LVDS VSON (6) 3.20 mm × 2.50 mm LMK6D (DLF)(2) VSON (6) 2.50 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) Product preview. BAWVDD CLK Control Logic Output Divider EN Memory GND Power Conditioning LMK6x Simplified Block Diagram ADVANCE INFORMATION LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.

13.3 Receiving Notification of Documentation Updates..24

14 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES April 2022 * Initial release. LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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Product Folder Links: LMK6P LMK6D LMK6C

5 Device Comparison

Use Figure 5-1 and Figure 5-2 to understand the device nomenclature of the LMK6x orderable options. PLMK6 15625 TA Output Type P: LVPECL D: LVDS Sub-Family Options A: Pin 1 – Output Enable B: Pin 2 – Output Enable x: contact TI for other options Frequency Options 15625 = 156.25 MHz XXXXX = Custom Frequency Code A Voltage/Temperature Rating DLF -- Package Size DLE: 3.2 mm x 2.5 mm DLF: 2.5 mm x 2.0 mm Packaging Method T: Small Reel R: Large Reel Device Code Q1: Automotive XX: Custom Code Product Family Figure 5-1. Part Number Guide: LMK6P and LMK6D Note: Contact a TI representative to pre-order specific devices. Email: ti_osc_customer_requirement@list.ti.com www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LMK6P LMK6D LMK6C

C: LVCMOS Sub-Family Options E: Pin 1 – Output Enable x: contact TI for other options Frequency Options 05000 = 50.00 MHz XXXXX = Custom Frequency Code C Voltage/Temperature Rating DLF -- Package Size DLE: 3.2 mm x 2.5 mm DLF: 2.5 mm x 2.0 mm Packaging Method T: Small Reel R: Large Reel Device Code Q1: Automotive XX: Custom Code Product Family Figure 5-2. Part Number Guide: LMK6C Note: Contact a TI representative to pre-order specific devices. Email: ti_osc_customer_requirement@list.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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Product Folder Links: LMK6P LMK6D LMK6C

6 Pin Configuration and Functions

Figure 6-1. LMK6C 4-Pin VSON (Top View) Table 6-1. LMK6C Pin Functions PIN I/O(1) DESCRIPTION NAME NO. OE / NC 1 I / NC Output Enable (OE) pin. Internal pullup resistor. When pulled low, output is tri-stated. Internal pullup resistor > 90 kΩ. A No Connect (NC) option is available and must be left floating, if used. GND 2 G Device ground OUT 3 O LVCMOS output clock VDD 4 P Device power supply (1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power, NC = No Connect. 1OE / NC NC / OE GND VDD OUTN OUTP Figure 6-2. LMK6P or LMK6D 6-Pin VSON (Top View) Table 6-2. LMK6P or LMK6D Pin Functions PIN I/O(1) DESCRIPTION NAME NO. OE / NC 1 I / NC Output Enable (OE) pin. Internal pullup resistor. When pulled low, output is tri-stated. Internal pullup resistor > 90 kΩ. A No Connect (NC) option is available and must be left floating, if used. NC / OE 2 NC / I No Connect (NC). An Output Enable (OE) pin option is available. Internal pullup resistor. When pulled low, output is tri-stated. Internal pullup resistor > 90 kΩ GND 3 G Device ground OUTP 4 O Positive differential output clock OUTN 5 O Negative differential output clock VDD 6 P Device power supply (1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power, NC = No Connect. www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LMK6P LMK6D LMK6C

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD Device supply voltage(2) –0.3 3.63 V VDD Device supply voltage(3) –0.3 1.98 V EN Logic input voltage –0.3 VDD + 0.3 V OUTP, OUTN Clock Output Voltage(4) –0.3 VDD + 0.3 V TJ Junction temperature 125 ℃ Tstg Storage temperature 150 ℃ (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) For all devices with the recommended operating voltage of 2.5 V ±5% and 3.3 V ±5% (3) For all devices with the recommended operating voltage of 1.8 V ±5% (4) For all differential outputs. LMK6P and LMK6D.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1)(3) ±2000 V Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002(2)(3) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. (3) For Industrial Grade device

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Device supply voltage(1) 1.71 1.8 1.89 V VDD Device supply voltage(2) 2.375 2.5 2.625 V 3.135 3.3 3.465 V TA Ambient temperature(3) –40 85 °C TA Ambient temperature(4) –40 105 °C TJ Junction temperature 125 °C tRAMP VDD power-up ramp time(5) (2) 0.1 100 ms (1) For all devices with recommended operating voltage of 1.8 V ±5% (2) For all devices with recommended operating voltage of 2.5 V ±5% and 3.3 V ±5% (3) For all differential outputs. LMK6P and LMK6D. (4) For all single-ended outputs. LMK6C. (5) For Automotive LVCMOS only

7.4 LMK6P/D Thermal Information

THERMAL METRIC(1) LMK6P/D UNITDLE (VSON) DLF (VSON)

6 PINS 6 PINS

RθJA Junction-to-ambient thermal resistance 101.2 107.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.6 70.1 °C/W LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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THERMAL METRIC(1) LMK6P/D UNITDLE (VSON) DLF (VSON) RθJB Junction-to-board thermal resistance 31.3 39.4 °C/W ΨJT Junction-to-top characterization parameter 2.7 2.3 °C/W ΨJB Junction-to-board characterization parameter 31.1 39.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 LMK6C Thermal Information

THERMAL METRIC(1) LMK6C UNITDLE (VSON) DLF (VSON)

4 PINS 4 PINS

RθJA Junction-to-ambient thermal resistance 124.8 128.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.2 73.2 °C/W RθJB Junction-to-board thermal resistance 42.5 39.8 °C/W ΨJT Junction-to-top characterization parameter 2.8 2.4 °C/W ΨJB Junction-to-board characterization parameter 42.3 39.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.6 Electrical Characteristics

over the parameters listed in the Recommended Operating Conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current Consumption Characteristics IDD Device Power Consumption LVPECL output, Fout ≤ 200 MHz(1) 60 TBD mA IDD Device Power Consumption LVPECL output, 200 MHz < Fout ≤ 400 MHz(1) 90 TBD mA IDD Device Power Consumption LVDS output, Fout ≤ 200 MHz(1) 52 TBD mA IDD Device Power Consumption LVDS output, 200 MHz < Fout ≤ 400 MHz(1) 80 TBD mA IDD Device Power Consumption LVCMOS output, Fout ≤ 200 MHz, CL = No Load 50 TBD mA IDD-PD Device Power-Down Current OE = GND TBD mA LVPECL Output Characteristics Fout Output Frequency 1 400 MHz VOD Output Voltage Swing (VOH – VOL) AC Load, VDD = 3.3 V 550 650 750 mV VOD Output Voltage Swing (VOH – VOL) AC Load, VDD = 2.5 V 500 600 700 mV VOD Output Voltage Swing (VOH – VOL) AC Load, VDD = 1.8 V 325 400 450 mV VOD Output Voltage Swing (VOH – VOL) DC Load, VDD = 2.5 V/ 3.3 V(2) 700 800 900 mV VOD Output Voltage Swing (VOH – VOL) DC Load, VDD = 1.8 V(2) 500 600 700 mV VOD,DIFF Differential Output peak-peak swing 2x|VOD| V VOS Output Common-Mode Voltage VDD = 3.3 V(2) 1.5 1.6 1.7 V VDD = 2.5 V(2) 0.825 0.9 0.975 V VOS Output Common-Mode Voltage VDD = 1.8 V(2) 0.45 0.5 0.55 V tR/tF Output Rise/Fall Time 20% to 80% of VOD,DIFF 120 200 ps ODC Output Duty Cycle 45 50 55 % www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LMK6P LMK6D LMK6C

over the parameters listed in the Recommended Operating Conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) Fout = 156.25 MHz –158 dBc/Hz LVDS Output Characteristics Fout Output Frequency 1 400 MHz VOD Output Voltage Swing (VOH – VOL) Under LVDS Load condition 250 350 450 mV VOD,DIFF Differential Output peak-peak swing 2x|VOD| V VOS Output Common-Mode Voltage VDD = 1.8 V 0.80 0.9 1.0 V tR/tF Output Rise/Fall Time 20% to 80% of VOD,DIFF 150 250 ps ODC Output Duty Cycle 45 50 55 % PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) Fout = 156.25 MHz –158 dBc/Hz LVCMOS Output Characteristics Fout Output Frequency 1 200 MHz VOL Output Low Voltage IOL = 3.6 mA, VDD = 1.8 V 0.36 V VOL Output Low Voltage IOL = 5.0 mA, VDD = 2.5 V 0.5 V IOL = 6.6 mA, VDD = 3.3 V 0.66 V VOH Output High Voltage IOH = 3.6 mA, VDD = 1.8 V 1.44 V VOH Output High Voltage IOH = 5.0 mA, VDD = 2.5 V 2 V IOH = 6.6 mA, VDD = 3.3 V 2.64 V tR/tF Output Rise/Fall Time 20% to 80% of VOH – VOL, CL = 2 pF 0.5 1 ns ODC Output Duty Cycle 45 50 55 % PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) Fout = 50 MHz –155 dBc/Hz Rout Output Impedance 40 50 60 Ω CL Maximum capacitive load Fout > 50 MHz 15 pF CL Maximum capacitive load Fout < 50 MHz 30 pF EN Input Characteristics VIL Input Low Voltage 0.6 V VIH Input High Voltage 1.3 V IIL Input Low Current EN = GND –40 µA IIH Input High Current EN = VDD 40 µA CIN Input Capacitance 2 pF LVPECL and LVDS Frequency Tolerance FT Total Frequency Stability Inclusive of: solder shift, initial tolerance, variation over –40℃ to 85℃, variation over rated supply voltage range, and 10 year aging at 25℃. ±25 ppm LVCMOS Frequency Tolerance FT Total Frequency Stability Inclusive of: solder shift, initial tolerance, variation over –40℃ to 105℃, variation over rated supply voltage range, and 10 year aging at 25℃. ±25 ppm PSRR Spur induced by 50 mV power supply ripple at 156.25MHz output, VDD = 2.5V/3.3 V Sine wave at 50 kHz –85 dBc Sine wave at 100 kHz –85 dBc Sine wave at 500 kHz –85 dBc Sine wave at 1 MHz –85 dBc Power-On Characteristics LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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over the parameters listed in the Recommended Operating Conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tSTART_UP Start-up Time Time elapsed from 0.95 × VDD until output is enabled and output is within specification 5 ms tOE-EN Output Enable Time Time elapsed from OE = VIH until output is enabled and output is within specification, Fout > 10 MHz 25 µs tOE-DIS Output Disable Time Time elapsed from OE = VIL until output is disabled, Fout > 10 MHz 25 µs LVPECL - Clock Output Jitter RJ Random Phase Jitter Fout ≥ 100 MHz, Integration BW: 12 kHz –

20 MHz 100 125 fs

RJITT,RMS RMS Period Jitter Fout ≥ 25 MHz 0.7 ps RJITT,PK Peak-peak Period Jitter Fout ≥ 25 MHz 7 ps LVDS - Clock Output Jitter RJ Random Phase Jitter Fout ≥ 100 MHz, Integration BW: 12 kHz – RJITT,RMS RMS Period Jitter Fout ≥ 25 MHz 0.7 ps RJITT,PK Peak-peak Period Jitter Fout ≥ 25 MHz 7 ps LVCMOS - Clock Output Jitter RJ Random Phase Jitter Fout = 24 MHz, Integration BW: 12 kHz –

5 MHz 400 fs

RJ Random Phase Jitter Fout = 156.25 MHz, Integration BW: 12 kHz – 20 MHz 200 500 fs RJITT,RMS RMS Period Jitter Fout ≥ 25 MHz 0.7 ps RJITT,PK Peak-peak Period Jitter Fout ≥ 25 MHz 7 ps (1) Excluding Load current (2) DC Load condition

7.7 Timing Diagrams

VOD = VOH - VOL OUTx_N OUTx_P VOUT-DIFF = 2 × VOD0 V 20% 80% tR tF VOH VOL Figure 7-1. Differential Output Voltage and Rise/Fall Time www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LMK6P LMK6D LMK6C

VOUT,SE tR tF OUT_REFx/2 20% 80% Figure 7-2. Single-Ended Output Voltage and Rise/Fall Time LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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8 Parameter Measurement Information

8.1 Device Output Configurations

Figure 8-1. LMK6C Output Test Configuration LMK6C Device Phase Noise Analyzer Figure 8-2. LMK6C Output Phase Noise Test Configuration LMK6D Device Balun Phase Noise Analyzer Figure 8-3. LMK6D Output Phase Noise Configuration Rp Rp LMK6P Device Oscilloscope (50- inputs) Figure 8-4. LMK6P Output Test Configuration Table 8-1. LMK6P Output Test Configuration Rp Values SUPPLY (V) Rp (Ω) 3.3 V 207.5 2.5 V 112.5 1.8 V 83.3 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LMK6P LMK6D LMK6C

Figure 8-5. LMK6P Output Phase Noise Configuration Table 8-2. LMK6P Output Phase Noise Configuration Rp Values SUPPLY (V) Rp (Ω) 3.3 V 207.5 2.5 V 112.5 1.8 V 83.3 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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9 Detailed Description

9.1 Overview

The LMK6x is a fixed-frequency BAW based oscillator that can provide ultra-low jitter both for differential and single-ended output types.

9.2 Functional Block Diagram

BAWVDD CLK_POutput Divider EN Memory GND Power Conditioning Temp Sensor TCF Interface & control logic Signal Path Logic CLK_N

9.3 Feature Description

9.3.1 Bulk Acoustic Wave (BAW)

TI’s BAW resonator technology uses piezoelectric transduction to generate high-Q resonance at 2.5 GHz. The resonator is defined by the quadrilateral area overlaid by top and bottom electrodes. Alternating high- and low-acoustic impedance layers form acoustic mirrors beneath the resonant body to prevent acoustic energy leakage into the substrate. Furthermore, these acoustic mirrors are also placed on top of the resonator stack to protect the device from contamination and minimize energy leakage into the package materials. This unique dual-Bragg acoustic resonator (DBAR) allows efficient excitation without the need of costly vacuum cavities around the resonator. As a result, TI’s BAW resonator is immune to frequency drift caused by adsorption of surface contaminants and can be directly placed in a non-hermetic plastic package with the oscillator IC in small standard oscillator footprints.

9.3.2 Device Block-Level Description

High-Q resonant tank of BAW die is complimented with an ultra-low noise oscillator on a base die, designed in CMOS process node. Temperature variations of oscillation frequency are continuously monitored by a co-located precision temperature sensor. Correction for frequency is done using an advance signal processing algorithm which runs continuously in the background while making use of per part calibration coefficients, stored in NVM, to compensate frequency within ±10 ppm. A very low jitter, low power fractional output divider (FOD) in the frequency correction path allows necessary compensation with minimum impact to the phase jitter while generating a per-programmed output frequency clock. The output driver is capable of providing both single-ended LVCMOS and differential LVPECL and LVDS output formats. Finally, a small power-reset-clock management system consisting of several low noise LDOs and digital controller makes sure noise sensitive modules work with enough isolation while maintaining output clock fidelity.

9.3.3 Function Pin(s)

The function pin is identified as pin 1 on the LMK6C and pin 1 or pin 2, depending on the grade of the device, for the LMK6P and LMK6D. In addition to output enable, the function pin is also capable of providing a chip disable / standby feature. In this mode, all blocks will be powered down to provide a maximum current consumption savings for a non-operation mode, meaning the output clock is not available. The return to the output clock active time corresponds to the initial start-up time. The function pin can also be designed to be active high or active low. This allows for compatibility and drop in replacement with hardware that may have terminated to ground. Contact your TI representative to discuss options not listed on Figure 5-1 and Figure 5-2. www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LMK6P LMK6D LMK6C

9.3.4 Clock Output Interfacing and Termination

These figures show the recommended output interfacing and termination circuits. LMK6C Device LVCMOS Receiver Figure 9-1. LMK6C Output to LVCMOS Receiver

100 LMK6D Device LVDS

Figure 9-2. LMK6D Output DC-Coupled to LVDS Receiver With Internal Termination/Biasing LMK6P Device LVPECL Receiver Vdd R1 R1 R2 R2 Figure 9-3. LMK6P Output DC-Coupled to LVPECL Receiver With External Termination/Biasing (T-Network) Table 9-1. LMK6P T-Network DC-Coupled Resistor Values SUPPLY (V) R1 (Ω) R2 (Ω) 3.3 133 82 2.5 250 62.5 1.8 450 56.5 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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Figure 9-6. LMK6P Output AC-Coupled to LVPECL Receiver With External Termination/Biasing (Y-Network) Table 9-4. LMK6P Y-Network AC-Coupled Resistor Values SUPPLY (V) Rp (Ω) R1 (Ω) R2 (Ω) 3.3 207.5 50 78.8 2.5 112.5 50 31.3 1.8 83.3 50 16.7

9.3.5 Temperature Stability

Figure 9-7 shows the frequency stability of LMK6x BAW oscillator over the full temperature range –40°C to 105°C on 64 units. This represents the typical temperature stability of the device, remaining below ±10-ppm. Figure 9-7. Frequency Change Over Temperature LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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9.3.6 Mechanical Robustness

For reference oscillators, vibration and shock are common causes for increased phase noise and jitter, frequency shift and spikes, or even physical damages to the resonator and its package. Compared to quartz crystals, the BAW resonator is more immune to vibration and shock due to its orders of magnitude smaller mass and higher frequency—that is force applied to the device from acceleration is much smaller due to smaller mass. Figure 9-8 shows the LMK6x BAW oscillator vibration performance. In this test, the LMK6x oscillator mounted on an EVM is subject to 10g acceleration force, ranging from 50 Hz to 2 kHz in x, y, and z-axis. Frequency deviation is measured in Hz through the E5052 phase noise analyzer under transient mode. The measurement is then converted to ppb and normalized to ppb/g and plotted below. LMK6x performance under vibration is approximately 1 ppb/g while most quartz oscillators best case is 3 ppb/g and worse can be above10 ppb/g. Figure 9-8. LMK6X BAW Oscillator Vibration Performance

9.4 Device Functional Modes

The device has one mode of operation that applies when operated within the Recommended Operating Conditions. www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LMK6P LMK6D LMK6C

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

10.1 Application Information

The LMK6x is high-performance, fixed-frequency oscillator that can be used as a reference clock. The product family supports any output frequency, differential or singled-ended output types, and 1.8-V or 2.5-V through 3.3-V supply rails.

10.2 Typical Application

For reference schematic to help implement the LMK6x family of oscillators, refer to the Power Supply Recommendations for supply rail decoupling and Clock Output Interfacing and Termination for output clock required termination and biasing. Figure 10-1 shows the LMK6x EVM schematic which can be used as a reference, as well. Figure 10-1. LMK6x EVM Schematic

10.2.1 Design Requirements

The LMK6x is a fixed-frequency oscillator with no programming needed. Make sure to follow the recommended termination options as described in the Clock Output Interfacing and Termination section closely. LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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11 Power Supply Recommendations

For the best electrical performance of the LMK6x, TI recommends using a combination of 10 µF, 1 µF, and 0.1 µF on its power supply bypass network. TI also recommends using component side mounting of the power-supply bypass capacitors, and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane.

12 Layout

12.1 Layout Guidelines

The following sections provides recommendations for board layout, solder reflow profile and power-supply bypassing when using the LMK6x to ensure good thermal and electrical performance and signal integrity of the entire system.

12.1.1 Ensuring Thermal Reliability

The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12-1, to maximize thermal dissipation out of the package. The equation below describes the relationship between the PCB temperature around the LMK6x and its junction temperature. TB = TJ – ΨJB × P (1) where

TB: PCB temperature around the LMK6x
TJ: Junction temperature of LMK6x
ΨJB: Junction-to-board thermal resistance parameter of LMK6x (refer to the Thermal Information tables in the Specifications section for this information)
P: On-chip power dissipation of LMK6x www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LMK6P LMK6D LMK6C

12.1.2 Best Practices for Signal Integrity

For the best electrical performance and signal integrity of entire system with the LMK6x, TI recommends routing vias into decoupling capacitors and then to the LMK6x. TI also recommends increasing the via count and width of the traces wherever possible. These steps ensure the lowest impedance and shortest path for high-frequency current flow. Figure 12-1 shows the layout recommendation for the LMK6x. Figure 12-1. LMK6x Layout Recommendation for Power Supply and Ground

12.1.3 Recommended Solder Reflow Profile

TI recommends following the solder paste supplier's recommendations to optimize flux activity and to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20. It is preferable for the LMK6x to be processed with the lowest peak temperature possible while also remaining below the components peak temperature rating as listed on the MSL label. The exact temperature profile would depend on several factors including maximum peak temperature for the component as rated on the MSL label, Board thickness, PCB material type, PCB geometries, component locations, sizes, densities within PCB, as well solder manufactures recommended profile, and capability of the reflow equipment to as confirmed by the SMT assembly operation. LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

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Product Folder Links: LMK6P LMK6D LMK6C

12.2 Layout Examples

Figure 12-2 through Figure 12-5 show the printed circuit board (PCB) layout examples as done on the evaluation module (EVM) for the LMK6x. Figure 12-2. PCB Layout Example from LMK6 EVM, Top Layer Figure 12-3. PCB Layout Example from LMK6 EVM, GND Layer Figure 12-4. PCB Layout Example from LMK6 EVM, GND Layer Figure 12-5. PCB Layout Example from LMK6 EVM, Bottom Layer www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LMK6P LMK6D LMK6C

13 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation, see the following: Texas Instruments, LMK6xxEVM Evaluation Instructions

13.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully-qualified development-support product. X and P devices and TMDX development-support tools are shipped against the following disclaimer: To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, your device ). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS). Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. TMS Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully-qualified development-support product. TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

22 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMK6P LMK6D LMK6C

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, your package), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz (for example, your device speed range ). Figure x provides a legend for reading the complete device name for any your device device. For orderable part numbers of your device devices in the your package package types, see the Package Option Addendum of this document, ti.com, or contact your TI sales representative. For additional description of the device nomenclature markings on the die, see the Silicon Errata. PLMK6 15625 TA Output Type P: LVPECL D: LVDS Sub-Family Options A: Pin 1 – Output Enable B: Pin 2 – Output Enable x: contact TI for other options Frequency Options 15625 = 156.25 MHz XXXXX = Custom Frequency Code A Voltage/Temperature Rating DLF -- Package Size DLE: 3.2 mm x 2.5 mm DLF: 2.5 mm x 2.0 mm Packaging Method T: Small Reel R: Large Reel Device Code Q1: Automotive XX: Custom Code Product Family Note: Contact your TI representative to pre-order specific devices. Email: ti_osc_customer_requirement@list.ti.com Figure 13-1. Part Number Guide: LMK6P and LMK6D Device Nomenclature www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: LMK6P LMK6D LMK6C

C: LVCMOS Sub-Family Options E: Pin 1 – Output Enable x: contact TI for other options Frequency Options 05000 = 50.00 MHz XXXXX = Custom Frequency Code C Voltage/Temperature Rating DLF -- Package Size DLE: 3.2 mm x 2.5 mm DLF: 2.5 mm x 2.0 mm Packaging Method T: Small Reel R: Large Reel Device Code Q1: Automotive XX: Custom Code Product Family Note: Contact your TI representative to pre-order specific devices. Email: ti_osc_customer_requirement@list.ti.com Figure 13-2. Part Number Guide: LMK6C Device Nomenclature

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

13.5 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

0.1 C A B

0.05 C B SYMM SYMM 2.6 2.4 3.3 3.1 PIN 1 INDEX AREA 1.0 0.8 0.05 0.00 (0.1) TYP SEATING PLANE C 1.7 1.9 4X 0.95 6X 0.7 0.5 4X 0.75 0.65 2X 0.55 0.45 0.05 C PIN 1 ID (OPTIONAL) 3 4 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . EXAMPLE BOARD LAYOUT 4224885/B 10/2020 www.ti.com VSON - 1 mm max heightDLE0006A PLASTIC QUAD FLAT PACK-NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SOLDER MASK DETAILS NON- SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL

0.07 MAX

0.07 MIN

(1.7) (0.95) (1.9) 6X (0.6) 4X (0.7) 2X (0.5) (R0.05) TYP 3 4 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4224885/B 10/2020 www.ti.com VSON - 1 mm max heightDLE0006A PLASTIC QUAD FLAT PACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE: 20X SYMM SYMM (1.7) (0.95) (1.9) 6X (0.6) 4X (0.65) 2X (0.5) (R0.05) TYP 3 4 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. PACKAGE OUTLINE 4225945/B 10/2020 www.ti.com VSON - 1 mm max height PLASTIC QUAD FLAT PACK-NO LEAD DLE0004A A 0.08 C 0.05 C B SYMM SYMM 2.6 2.4 3.3 3.1 PIN 1 INDEX AREA 1.0 0.8 0.05 0.00 (0.1) TYP SEATING PLANE C 1.6 2.1 4X 0.7 0.5 4X 0.75 0.65 PIN 1 ID (OPTIONAL) 2 3 1.05 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . EXAMPLE BOARD LAYOUT 4225945/B 10/2020 www.ti.com VSON - 1 mm max heightDLE0004A PLASTIC QUAD FLAT PACK-NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SOLDER MASK DETAILS NON- SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL (1.6) (1.05) TYP (2.1) 4X (0.6) 4X (0.7) (R0.05) TYP 2 3 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4225945/B 10/2020 www.ti.com VSON - 1 mm max heightDLE0004A PLASTIC QUAD FLAT PACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE ALL PADS: 93% SCALE: 20X SYMM SYMM (1.6) (1.05) TYP (2.1) 4X (0.6) 4X (0.65) (R0.05) TYP 2 3 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. PACKAGE OUTLINE 4224884/B 10/2020 www.ti.com VSON - 1 mm max height PLASTIC QUAD FLAT PACK-NO LEAD DLF0006A A 0.08 C 0.05 C B SYMM SYMM 2.1 1.9 2.6 2.4 PIN 1 INDEX AREA 1.0 0.8 0.05 0.00 (0.1) TYP SEATING PLANE C 1.3 1.65 4X 0.825 6X 0.8 0.6 4X 0.7 0.6 2X 0.3 0.2 0.05 C PIN 1 ID (OPTIONAL) 3 4 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . EXAMPLE BOARD LAYOUT 4224884/B 10/2020 www.ti.com VSON - 1 mm max heightDLF0006A PLASTIC QUAD FLAT PACK-NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SOLDER MASK DETAILS NON- SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL (1.5) (0.825) (1.65) 6X (0.9) 4X (0.65) 2X (0.25) (R0.05) TYP 3 4 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4224884/B 10/2020 www.ti.com VSON - 1 mm max heightDLF0006A PLASTIC QUAD FLAT PACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE: 20X SYMM SYMM (1.5) (0.825) (1.65) 6X (0.9) 4X (0.6) 2X (0.25) (R0.05) TYP 3 4 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. PACKAGE OUTLINE 4225946/B 10/2020 www.ti.com VSON - 1 mm max height PLASTIC QUAD FLAT PACK-NO LEAD DLF0004A A 0.08 C 0.05 C B SYMM SYMM 2.1 1.9 2.6 2.4 PIN 1 INDEX AREA 1.0 0.8 0.05 0.00 (0.1) TYP SEATING PLANE C 1.3 1.65 0.825 6X 0.8 0.6 4X 0.7 0.6 PIN 1 ID (OPTIONAL) 3 4 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . EXAMPLE BOARD LAYOUT 4225946/B 10/2020 www.ti.com VSON - 1 mm max heightDLF0004A PLASTIC QUAD FLAT PACK-NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SOLDER MASK DETAILS NON- SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL (1.5) (0.825) (1.65) 6X (0.9) 4X (0.65) (R0.05) TYP 3 4 www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: LMK6P LMK6D LMK6C

NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4225946/B 10/2020 www.ti.com VSON - 1 mm max heightDLF0004A PLASTIC QUAD FLAT PACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE: 20X SYMM SYMM (1.5) (0.825) (1.65) 6X (0.9) 4X (0.6) (R0.05) TYP 3 4 LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

14.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(4) MSL Peak Temp (3) Op Temp (°C) Device Marking(5) (6) PLMK6CE02400CDLFT ACTIVE VSON DLF 4 Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE02500CDLFT ACTIVE VSON DLF 4 Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE15625CDLFT ACTIVE VSON DLF 4 Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE05000CDLFT ACTIVE VSON DLF 4 Call TI Call TI Call TI Call TI Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space (4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. space (5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: LMK6P LMK6D LMK6C

14.2 Tape and Reel Information

Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PLMK6CE02400CDLFT VSON DLF 4 250 Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE02500CDLFT VSON DLF 4 250 Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE15625CDLFT VSON DLF 4 250 Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI PLMK6CE05000CDLFT VSON DLF 4 250 Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 www.ti.com ADVANCE INFORMATION

Product Folder Links: LMK6P LMK6D LMK6C

TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PLMK6CE02400CDLFT VSON DLF 4 250 Call TI Call TI Call TI PLMK6CE02500CDLFT VSON DLF 4 250 Call TI Call TI Call TI PLMK6CE15625CDLFT VSON DLF 4 250 Call TI Call TI Call TI PLMK6CE05000CDLFT VSON DLF 4 250 Call TI Call TI Call TI www.ti.com LMK6P, LMK6D, LMK6C SNAS826 – APRIL 2022 ADVANCE INFORMATION Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: LMK6P LMK6D LMK6C

www.ti.com 14-May-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PLMK6CE02400CDLFT ACTIVE VSON DLF 4 250 TBD Call TI Call TI -40 to 105 Samples PLMK6CE02500CDLFT ACTIVE VSON DLF 4 250 TBD Call TI Call TI -40 to 105 Samples PLMK6CE05000CDLFT ACTIVE VSON DLF 4 250 TBD Call TI Call TI -40 to 105 Samples PLMK6CE15625CDLFT ACTIVE VSON DLF 4 250 TBD Call TI Call TI -40 to 105 PCEC Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

www.ti.com 14-May-2022 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated

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