PLM2904BIDGKR

LM358_V01 TI | Alldatasheet

Document overview

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Technical content

= 1 + V V OUT IN R R F G 1 + sR C1 1( ( ( ( 2/c112 R C1 1 f =/c45 3 dB Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 Industry-StandardDualOperationalAmplifiers

1 Features

1• Wide supply range of 3 V to 36 V (B version)

• Quiescent current: 300 µA per amplifier (B version, typical)
• Unity-gain bandwidth of 1.2 MHz (B version)
• Common-mode input voltage range includes ground, enabling direct sensing near ground
• Low input offset voltage of 3 mV at 25°C (A and B versions, maximum)
• Internal RF and EMI filter (B version)
• On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

2 Applications

• Merchant network and server power supply units
• Multi-function printers
• Power supplies and mobile chargers
• Motor control: AC induction, brushed DC, brushless DC, high-voltage, low-voltage, permanent magnet, and stepper motor
• Desktop PC and motherboard
• Indoor and outdoor air conditioners
• Washers, dryers, and refrigerators
• AC inverters, string inverters, central inverters, and voltage frequency drives
• Uninterruptible power supplies
• Programmable logic controllers
• Electronic point-of-sale systems Single-Pole, Low-Pass Filter

3 Description

The LM358B and LM2904B devices are the next- generation versions of the industry-standard operational amplifiers (op amps) LM358 and LM2904, which include two high-voltage (36-V) op amps. These devices provide outstanding value for cost- sensitive applications, with features including low offset (300 µV, typical), common-mode input range to ground, and high differential input voltage capability. The LM358B and LM2904B op amps simplify circuit design with enhanced features such as unity-gain stability, lower offset voltage of 3 mV (maximum at room temperature), and lower quiescent current of 300 µA per amplifier (typical). High ESD (2 kV, HBM) and integrated EMI and RF filters enable the LM358B and LM2904B devices to be used in the most rugged, environmentally challenging applications. The LM358B and LM2904B amplifiers are available in micro-sized packaging, such as the SOT23-8, as well as industry standard packages, including SOIC, TSSOP, and VSSOP. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM358B, LM2904B, LM358, LM358A, LM2904, LM2904V, LM258, LM258A SOIC (8) 4.90 mm × 3.90 mm LM358B, LM2904B, LM358, LM358A, LM2904, LM2490V TSSOP (8) 3.00 mm × 4.40 mm LM358B(2), LM2904B(2), LM358, LM358A, LM2904, LM2904V, LM258, LM258A VSSOP (8) 3.00 mm × 3.00 mm LM358B(2), LM2904B(2) SOT-23 (8) 2.90 mm × 1.60 mm LM358, LM2904 SO (8) 5.20 mm × 5.30 mm LM358, LM2904, LM358A, LM258, LM258A PDIP (8) 9.81 mm × 6.35 mm LM158, LM158A CDIP (8) 9.60 mm × 6.67 mm LM158, LM158A LCCC (20) 8.89 mm × 8.89 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) Package is for preview only.

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated Table of Contents 7.5 Electrical Characteristics: LM358B and LM358BA ... 8

7.6 Electrical Characteristics: LM2904B and

9.2 Functional Block Diagram - LM358B, LM358BA,

13.3 Receiving Notification of Documentation Updates 29

14 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision W (October 2019) to Revision X Page Changes from Revision V (September 2018) to Revision W Page

• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Information Changes from Revision U (January 2017) to Revision V Page

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated

• Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEW-
• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition
• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28 Changes from Revision T (April 2015) to Revision U Page Changes from Revision S (January 2014) to Revision T Page
• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Changes from Revision R (July 2010) to Revision S Page

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated

5 Device Comparison Table

VOS (MAXIMUM AT 25°C) IQ / CH (TYPICAL AT 25°C) INTEGRATED EMI FILTER PACKAGE LM358B 3 V–36 V –40°C to 85°C 3 mV 300 µA Yes D, DDF, DGK, PW LM2904B 3 V–36 V –40°C to 125°C 3 mV 300 µA Yes D, DDF, DGK, PW LM358 3 V–32 V 0°C to 70°C 7 mV 350 µA No D, PW, DGK, P, PS LM2904 3 V–26 V –40°C to 125°C 7 mV 350 µA No D, PW, DGK, P, PS LM358A 3 V–32 V 0°C to 70°C 3 mV 350 µA No D, PW, DGK, P LM2904V 3 V–32 V –40°C to 125°C 7 mV 350 µA No D, PW LM158 3 V–32 V –55°C to 125°C 5 mV 350 µA No JG, FK LM158A 3 V–32 V –55°C to 125°C 3 mV 350 µA No JG, FK LM258 3 V–32 V –25°C to 85°C 5 mV 350 µA No D, DGK, P LM258A 3 V–32 V –25°C to 85°C 3 mV 350 µA No D, DGK, P

5IN1± 6NC 7IN1+ 8NC 9NC 10V± 11NC 12IN2+ 13NC 14 NC

15 IN2 ±

17 OUT2

2 OUT1

2IN1± 7 OUT2 3IN1+ 6 IN2 ± 4V± 5 IN2+ Not to scale LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated

6 Pin Configuration and Functions

D, DDF, DGK, P, PS, PW, and JG Packages 8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP Top View 20-Pin LCCC Top View NC - No internal connection (1) For a listing of which devices are available in what packages, see Device Comparison Table. Pin Functions PIN I/O DESCRIPTION NAME LCCC(1) SOIC, SOT23-8, VSSOP, CDIP, PDIP, SO, TSSOP, CFP(1) IN1– 5 2 I Negative input IN1+ 7 3 I Positive input IN2– 15 6 I Negative input IN2+ 12 5 I Positive input OUT1 2 1 O Output OUT2 17 7 O Output V– 10 4 — Negative (lowest) supply or ground (for single- supply operation) 13, 14, 16, 18, 19 — — No internal connection V+ 20 8 — Positive (highest) supply

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Differential voltages are at IN+, with respect to IN−. (3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VS = ([V+] – [V–]) LM358B, LM358BA, LM2904B, LM2904BA ±20 or 40 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V ±16 or 32 LM2904 ±13 or 26 Differential input voltage, VID(2) LM358B, LM358BA, LM2904B, LM2904BA,LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V –32 32 V LM2904 –26 26 Input voltage, VI Either input LM358B, LM358BA, LM2904B, LM2904BA –0.3 40 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V –0.3 32 LM2904 –0.3 26 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VS ≤ 15 V(3) Unlimited s Operating ambient temperature, TA LM158, LM158A –55 125 LM258, LM258A –25 85 LM358B, LM358BA –40 85 LM358, LM358A 0 70 LM2904B, LM2904BA, LM2904, LM2904V –40 125 Operating virtual-junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

LM358B, LM358BA, LM2904B, AND LM2904BA V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted) MIN MAX UNIT VS Supply voltage, VS= ([V+] – [V–]) LM358B, LM358BA, LM2904B, LM2904BA 3 36 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V 3 30 LM2904 3 26 VCM Common-mode voltage V– V+ – 2 V TA Operating ambient temperature LM358B, LM358BA –40 85 LM2904B, LM2904BA, LM2904, LM2904V –40 125 LM358, LM358A 0 70 LM258, LM258A –20 85 LM158, LM158A –55 125 (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) For a listing of which devices are available in what packages, see Device Comparison Table.

7.4 Thermal Information

THERMAL METRIC(1) LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V(2) LM158, LM158A UNITD (SOIC) DGK (VSSOP) P (PDIP) PS (SO) PW (TSSOP) FK (LCCC) JG (CDIP)

8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS

RθJA Junction-to-ambient thermal RθJC(top) Junction-to-case (top) RθJB Junction-to-board thermal ψJT Junction-to-top ψJB Junction-to-board RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — 10.6 22.3 °C/W

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated (1) Specified by characterization only

7.5 Electrical Characteristics: LM358B and LM358BA

VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage LM358B ±0.3 ±3.0 mV TA = –40°C to +85°C ±4 mV LM358BA ±2.0 mV TA = –40°C to +85°C ±2.5 mV dVOS/dT Input offset voltage drift TA = -40°C to +85°C(1) ±3.5 11 µV/°C PSRR Power Supply Rejection Ratio ±2 15 µV/V Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V (V–) (V+) – 1.5 V VS = 5 V to 36 V TA = –40°C to +85°C (V–) (V+) – 2 V CMRR Common-mode rejection ratio (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100 µV/V (V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +85°C 25 316 INPUT BIAS CURRENT IB Input bias current ±10 ±35 nA TA = –40°C to +85°C(1) ±50 nA IOS Input offset current 0.5 4 nA TA = –40°C to +85°C(1) 5 nA dIOS/dT Input offset current drift TA = –40°C to +85°C 10 pA/℃ NOISE En Input voltage noise f = 0.1 to 10 Hz 3 µVPP en Input voltage noise density f = 1 kHz 40 nV/√/Hz INPUT IMPEDANCE ZID Differential 10 || 0.1 MΩ|| pF ZIC Common-mode 4 || 1.5 GΩ|| pF OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-) 70 140 V/mV TA = –40°C to +85°C 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G = + 1 0.5 V/µs Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 ° tOR Overload recovery time VIN × gain > VS 10 µs ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 µs THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz 0.001 % OUTPUT VO Voltage output swing from rail Positive Rail (V+) IOUT = 50 µA 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA(1) 1.5 1.61 V Negative Rail (V-) IOUT = 50 µA 100 150 mV IOUT = 1 mA 0.75 1 V VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +85°C 5 20 mV IO Output current VS = 15 V; VO = V-; VID = 1 V Source(1) -20 -30 mA TA = –40°C to +85°C -10 VS = 15 V; VO = V+; VID = -1 V Sink(1) 10 20 TA = –40°C to +85°C 5 VID = -1 V; VO = (V-) + 200 mV 60 100 μA ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA CLOAD Capacitive load drive 100 pF RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω POWER SUPPLY IQ Quiescent current per amplifier VS = 5 V; IO = 0 A TA = –40°C to +85°C 300 460 µA IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated (1) Specified by characterization only

7.6 Electrical Characteristics: LM2904B and LM2904BA

VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage LM2904B ±0.3 ±3.0 mV TA = –40°C to +125°C ±4 mV LM2904BA ±2.0 mV TA = –40°C to +125°C ±2.5 mV dVOS/dT Input offset voltage drift TA = –40°C to +125°C(1) ±3.5 12 µV/°C PSRR Power Supply Rejection Ratio ±2 15 µV/V Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V (V–) (V+) – 1.5 V VS = 5 V to 36 V TA = –40°C to +125°C (V–) (V+) – 2 V CMRR Common-mode rejection ratio (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100 µV/V (V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +125°C 25 316 INPUT BIAS CURRENT IB Input bias current ±10 ±35 nA TA = –40°C to +125°C(1) ±50 nA IOS Input offset current 0.5 4 nA TA = –40°C to +125°C(1) 5 nA dIOS/dT Input offset current drift TA = –40°C to +125°C 10 pA/℃ NOISE En Input voltage noise f = 0.1 to 10 Hz 3 µVPP en Input voltage noise density f = 1 kHz 40 nV/√/Hz INPUT IMPEDANCE ZID Differential 10 || 0.1 MΩ|| pF ZIC Common-mode 4 || 1.5 GΩ|| pF OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-) 70 140 V/mV TA = –40°C to +125°C 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G = + 1 0.5 V/µs Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 ° tOR Overload recovery time VIN × gain > VS 10 µs ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 µs THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz 0.001 % OUTPUT VO Voltage output swing from rail Positive Rail (V+) IOUT = 50 µA 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA(1) 1.5 1.61 V Negative Rail (V-) IOUT = 50 µA 100 150 mV IOUT = 1 mA 0.75 1 V VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +125°C 5 20 mV IO Output current VS = 15 V; VO = V-; VID =

1 V Source(1) -20 -30

TA = –40°C to +125°C -10 VS = 15 V; VO = V+; VID = -1 V Sink(1) 10 20 TA = –40°C to +125°C 5 VID = -1 V; VO = (V-) + 200 mV 60 100 μA ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA CLOAD Capacitive load drive 100 pF RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω POWER SUPPLY IQ Quiescent current per amplifier VS = 5 V; IO = 0 A TA = –40°C to +125°C 300 460 µA IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM358 and LM358A. (2) All typical values are TA = 25°C.

7.7 Electrical Characteristics: LM358, LM358A

For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V LM358 3 7 mV TA = 0°C to 70°C 9 LM358A 2 3 TA = 0°C to 70°C 5 dVOS/dT Input offset voltage drift LM358 TA = 0°C to 70°C 7 µV/°C LM358A TA = 0°C to 70°C 7 20 PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM358 (V–) (V+) – 1.5 V VS = 30 V LM358A VS = 5 V to 30 V LM358 TA = 0°C to 70°C (V–) (V+) – 2 VS = 30 V LM358A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 65 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM358 –20 –250 nA TA = 0°C to 70°C –500 LM358A –15 –100 TA = 0°C to 70°C –200 IOS Input offset current VO = 1.4 V LM358 2 50 nA TA = 0°C to 70°C 150 LM358A 2 30 TA = 0°C to 70°C 75 dIOS/dT Input offset current drift pA/°C LM358A TA = 0°C to 70°C 300 NOISE en Input voltage noise density f = 1 kHz 40 nV/√Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 25 100 V/mV TA = 0°C to 70°C 15 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = 0°C to 70°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = 0°C to 70°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM358A –60 TA = 0°C to 70°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = 0°C to 70°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = 0°C to 70°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V. (2) All typical values are TA = 25°C.

7.8 Electrical Characteristics: LM2904, LM2904V

For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP (2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to maximum; VCM = 0 V; VO = 1.4 V Non-A suffix devices 3 7 mV TA = –40°C to 125°C 10 A-suffix devices 1 2 TA = –40°C to 125°C 4 dVOS/dT Input offset voltage drift TA = –40°C to 125°C 7 µV/°C PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to maximum (V–) (V+) – 1.5 V CMRR Common-mode rejection ratio VS = 5 V to maximum; VCM = 0 V 65 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V –20 –250 nA TA = –40°C to 125°C –500 IOS Input offset current VO = 1.4 V Non-V suffix device 2 50 nA TA = –40°C to 125°C 300 V-suffix device 2 50 TA = –40°C to 125°C 150 dIOS/dT Input offset current drift TA = –40°C to 125°C 10 pA/°C NOISE en Input voltage noise density f = 1 kHz 40 nV/√Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 25 100 V/mV TA = –40°C to 125°C 15 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail RL ≥ 10 kΩ VS – 1.5 V Non-V suffix device VS = maximum; RL = 2 kΩ TA = –40°C to 125°C VS = maximum; RL ≥ 10 kΩ 2 3 V-suffix device VS = maximum; RL = 2 kΩ 6 VS = maximum; RL ≥ 10 kΩ 4 5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –40°C to 125°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA TA = –40°C to 125°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –40°C to 125°C 5 VID = -1 V; VO = 200 mV Non-V suffix device 30 µA V-suffix device 12 40 ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –40°C to 125°C 350 600 µA VS = maximum; VO = maximum / 2; IO = 0 A 500 1000

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM158 and LM158A. (2) All typical values are TA = 25°C. (3) On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.9 Electrical Characteristics: LM158, LM158A

For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V LM158 3 5 mV TA = –55°C to 125°C 7 LM158A TA = –55°C to 125°C 4 dVOS/dT Input offset voltage drift LM158 TA = –55°C to 125°C 7 µV/°C LM158A TA = –55°C to 125°C 7 15(3) PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM158 (V–) (V+) – 1.5 V VS = 30 V LM158A VS = 5 V to 30 V LM158 VS = 30 V LM158A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM158 –20 –150 nA TA = –55°C to 125°C –300 LM158A –15 –50 TA = –55°C to 125°C –100 IOS Input offset current VO = 1.4 V LM158 2 30 nA TA = –55°C to 125°C 100 LM158A 2 10 TA = –55°C to 125°C 30 dIOS/dT Input offset current drift pA/°C LM158A TA = –55°C to 125°C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/√Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 50 100 V/mV TA = –55°C to 125°C 25 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = –55°C to 125°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –55°C to 125°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM158A –60 TA = –55°C to 125°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –55°C to 125°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –55°C to 125°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM258 and LM258A. (2) All typical values are TA = 25°C.

7.10 Electrical Characteristics: LM258, LM258A

For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V LM258 3 5 mV TA = –25°C to 85°C 7 LM258A 2 3 TA = –25°C to 85°C 4 dVOS/dT Input offset voltage drift LM258 TA = –25°C to 85°C µV/°C LM258A 7 15 PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM258 (V–) (V+) – 1.5 V VS = 30 V LM258A VS = 5 V to 30 V LM258 TA = –25°C to 85°C (V–) (V+) – 2 VS = 30 V LM258A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM258 –20 –150 nA TA = –25°C to 85°C –300 LM258A –15 –80 TA = –25°C to 85°C –100 IOS Input offset current VO = 1.4 V LM258 2 30 nA TA = –25°C to 85°C 100 LM258A 2 15 TA = –25°C to 85°C 30 dIOS/dT Input offset current drift pA/°C LM258A TA = –25°C to 85°C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/√Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 50 100 V/mV TA = –25°C to 85°C 25 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = –25°C to 85°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –25°C to 85°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM258A –60 TA = –25°C to 85°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –25°C to 85°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –25°C to 85°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000

7.11 Typical Characteristics

TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Figure 1. Offset Voltage Production Distribution Figure 2. Offset Voltage Drift Distribution Figure 3. Offset Voltage vs Temperature Figure 4. Offset Voltage vs Common-Mode Voltage Figure 5. Open-Loop Gain and Phase vs Frequency Figure 6. Closed-Loop Gain vs Frequency

TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Figure 37. Channel Separation vs Frequency Figure 38. EMIRR (Electromagnetic Interference Rejection

7.12 Typical Characteristics

Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V. Figure 39. Input Current vs Temperature Figure 40. Supply Current vs Supply Voltage Figure 41. Voltage Gain vs Supply Voltage Figure 42. Common-Mode Rejection Ratio vs Frequency Figure 43. Voltage Follower Large Signal Response (50 pF) Figure 44. Voltage Follower Small Signal Response (50 pF)

8 Parameter Measurement Information

Figure 49. Unity-Gain Amplifier Figure 50. Noise-Test Circuit Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response

~100 µA Current Regulator ~6 µA Current Regulator IN- IN+ OUT ~6 µA Current Regulator ~120 µA Current Regulator LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated

9 Detailed Description

9.1 Overview

These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is within the supply voltage range specified in the Recommended Operating Conditions section, and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply- current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies.

9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V www.ti.com SLOS068X –JUNE 1976–REVISED JUNE 2020 Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated

9.3 Feature Description

9.3.1 Unity-Gain Bandwidth

The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).

9.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the input. These devices have a 0.5-V/µs slew rate (B Version).

9.3.3 Input Common Mode Range

The valid common mode range is from device ground to VS – 1.5 V (VS – 2 V across temperature). Inputs may exceed VS up to the maximum VS without device damage. At least one input must be in the valid input common- mode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA and the output phase is undefined.

9.4 Device Functional Modes

These devices are powered on when the supply is connected. This device can be operated as a single-supply operational amplifier or dual-supply amplifier, depending on the application.

validate and test their design implementation to confirm system functionality.

10.1 Application Information

The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications. Inputs can be powered before VS for flexibility in multiple supply circuits.

10.2 Typical Application

Figure 52. Application Schematic

10.2.1 Design Requirements

accommodate this application.

10.2.2 Detailed Design Procedure

amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current. This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3.

10.2.3 Application Curve

Figure 53. Input and Output Voltages of the Inverting Amplifier

11 Power Supply Recommendations

permanently damage the device (see the Absolute Maximum Ratings).

12 Layout

12.1 Layout Guidelines

• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition]
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.

12.2 Layout Examples

Figure 54. Operational Amplifier Board Layout for Noninverting Configuration Figure 55. Operational Amplifier Schematic for Noninverting Configuration

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

• Texas Instruments, Circuit Board Layout Techniques.

13.2 Related Links

resources, tools and software, and quick access to order now. Table 1. Related Links

13.3 Receiving Notification of Documentation Updates

changed. For change details, review the revision history included in any revised document.

13.4 Support Resources

from the experts. Search existing answers or ask your own question to get the quick design help you need. not necessarily reflect TI's views; see TI's Terms of Use.

13.5 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.7 Glossary

This glossary lists and explains terms, acronyms and definitions.

LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V SLOS068X –JUNE 1976–REVISED JUNE 2020 www.ti.com Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B LM2904BA LM2904V Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most- current data available for the designated devices. This data is subject to change without notice and without revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.

www.ti.com 14-Oct-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87710012A LM158FKB 5962-8771001PA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 8771001PA LM158 5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87710022A LM158AFKB 5962-8771002PA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 8771002PA LM158A LM158 MW8 ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87710022A LM158AFKB LM158AJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 LM158AJG LM158AJGB ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 8771002PA LM158A LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 87710012A LM158FKB LM158JG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 LM158JG LM158JGB ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 8771001PA LM158 LM258AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3 LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A

www.ti.com 14-Oct-2020 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258AP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU | SN N / A for Pkg Type -25 to 85 LM258AP LM258APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -25 to 85 LM258AP LM258D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 LM258DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU | SN N / A for Pkg Type -25 to 85 LM258P LM258PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -25 to 85 LM258P LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904BAIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 2904BA LM2904BIDGKR PREVIEW VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125

www.ti.com 14-Oct-2020 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM2904BIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 L2904B LM2904BIPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU | SN N / A for Pkg Type -40 to 125 LM2904P LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -40 to 125 LM2904P LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 L2904

www.ti.com 14-Oct-2020 Addendum-Page 4 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM2904PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM358AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358AP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU | SN N / A for Pkg Type 0 to 70 LM358AP

www.ti.com 14-Oct-2020 Addendum-Page 5 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM358APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) NIPDAU N / A for Pkg Type 0 to 70 LM358AP LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358BAIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 85 L358BA LM358BIDGKR PREVIEW VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 85 LM358BIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 85 LM358B LM358BIPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 LM358DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU | SN N / A for Pkg Type 0 to 70 LM358P LM358PE3 ACTIVE PDIP P 8 50 Pb-Free (RoHS) SN N / A for Pkg Type 0 to 70 LM358P

www.ti.com 14-Oct-2020 Addendum-Page 6 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM358PE4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type 0 to 70 LM358P LM358PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 L358 PLM2904BIDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 PLM358BIDGKR ACTIVE VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

www.ti.com 14-Oct-2020 Addendum-Page 7 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :

• Automotive: LM2904-Q1 , LM2904B-Q1
• Enhanced Product: LM258A-EP , LM2904-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 1

(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 2

(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258ADR SOIC D 8 2500 340.5 338.1 20.6 LM258ADR SOIC D 8 2500 853.0 449.0 35.0 LM258ADR SOIC D 8 2500 333.2 345.9 28.6 LM258ADR SOIC D 8 2500 364.0 364.0 27.0 LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258ADRG4 SOIC D 8 2500 853.0 449.0 35.0 LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 3

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258DR SOIC D 8 2500 340.5 338.1 20.6 LM258DR SOIC D 8 2500 333.2 345.9 28.6 LM258DR SOIC D 8 2500 364.0 364.0 27.0 LM258DR SOIC D 8 2500 853.0 449.0 35.0 LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904AVQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM2904BAIDR SOIC D 8 2500 340.5 338.1 20.6 LM2904BIDR SOIC D 8 2500 340.5 338.1 20.6 LM2904BIPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2904DR SOIC D 8 2500 333.2 345.9 28.6 LM2904DR SOIC D 8 2500 364.0 364.0 27.0 LM2904DR SOIC D 8 2500 853.0 449.0 35.0 LM2904DR SOIC D 8 2500 340.5 338.1 20.6 LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM2904DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904PWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2904PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM2904PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0 LM2904QDR SOIC D 8 2500 350.0 350.0 43.0 LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6 LM2904VQPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM2904VQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358ADR SOIC D 8 2500 333.2 345.9 28.6 LM358ADR SOIC D 8 2500 367.0 367.0 35.0 LM358ADR SOIC D 8 2500 340.5 338.1 20.6 LM358ADR SOIC D 8 2500 364.0 364.0 27.0 LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358APWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358APWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 4

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM358BAIDR SOIC D 8 2500 340.5 338.1 20.6 LM358BIDR SOIC D 8 2500 340.5 338.1 20.6 LM358BIPWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LM358DR SOIC D 8 2500 340.5 338.1 20.6 LM358DR SOIC D 8 2500 333.2 345.9 28.6 LM358DR SOIC D 8 2500 364.0 364.0 27.0 LM358DR SOIC D 8 2500 853.0 449.0 35.0 LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6 LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358DRG4 SOIC D 8 2500 853.0 449.0 35.0 LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWR TSSOP PW 8 2000 853.0 449.0 35.0 LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0 LM358PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2020 Pack Materials-Page 5

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

MCER001A – JANUARY 1995 – REVISED JANUARY 1997 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.310 (7,87) 0.290 (7,37) 0.014 (0,36) 0.008 (0,20) Seating Plane 4040107/C 08/96 0.065 (1,65) 0.045 (1,14) 0.020 (0,51) MIN 0.400 (10,16) 0.355 (9,00) 0.015 (0,38) 0.023 (0,58) 0.063 (1,60) 0.015 (0,38) 0.200 (5,08) MAX 0.130 (3,30) MIN 0.245 (6,22) 0.280 (7,11) 0.100 (2,54) 0°–15° NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification. E. Falls within MIL STD 1835 GDIP1-T8

www.ti.com PACKAGE OUTLINE C TYP6.6 6.2

1.2 MAX

6X 0.65 8X 0.30 0.19 1.95 0.15 0.05 (0.15) TYP 0 - 8 0.25 GAGE PLANE 0.75 0.50 A NOTE 3 3.1 2.9 B NOTE 4 4.5 4.3 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. 1 8

0.1 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT (5.8)

0.05 MAX

0.05 MIN

8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 4 5 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.8) 6X (0.65) 8X (0.45) 8X (1.5) (R ) TYP0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X

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