PLD03C FUTUREWAFER | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Applications
- Personnal Digital Assistance
- Wireless System
- Cellular Phones
- High Speed Data Line
- Ethernet
- USB Interface Feature
- Bi-directional configurations
- ESD Protection:Level 4
- Low clamping voltage
- 350 Watts peak pulse power per line(tp=8/20uS)
- Protection one power line or I/O port SOD323 IEC Compatibility
- EN61000-4
- 61000-4-2(ESD):Level 4,Contact:±8kv,Air::±15kv
- 61000-4-5(Surge):12A,8/20us Mechanical Characteristics
- Molded JEDEC SOD-323
- Weight 5 milligrams
- Flammability rating UL 94V-0
- Halgen Free Device Characteristics Maximum Ratings@25 unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) see fig 1. PPP 350 Watts Operating Temperature TJ -55~150 °C Storage Temperature TSTG -55~150 °C E1402D4E-STD-FW-001 PLD03C through PLD02C24C Futurewafer Tech Co., Ltd
Electronical characteristics per line @25 unless otherwise specified Part No. Rated Stand-off Voltage VWM Volts Minimum Breakdown Voltage @1mA V(BR) Volts Maximum Clamping Voltage @IP=1A VC Volts Maximum Clamping Volt- age @8/20us VC@IPP Maxi- mum Leakage Current @VWM IR uA Maximum Capacitance @0V,1MHZ C pF PLD03C PLD05C PLD08C PLD12C PLD15C PLD18C PLD24C 3.3 5.0 8.0 12.0 15.0 18.0 24.0 4.0 6.0 8.5 13.3 16.7 20.0 26.7 7.0 9.8 13.4 19.0 24.0 29.0 43.0 19.0V@20A 18.3V@17A 18.5V@17A 28.6V@11A 31.8V@10A 45.0V@8A 56.0V@6A 100 100 100 100 100 100 100 Rating and characteristic curve PLD03C through PLD02C24C E1402D4E-STD-FW-001 Futurewafer Tech Co., Ltd ESD Protection Device
Electrical Characteristics
Ordering information
A B C D E F H 1.60 1.15 2.39 0.92 0.25 0.10 1.90 1.45 2.70 1.10 0.40 0.20 0.10 0.063 0.045 0.094 0.036 0.010 0.004 0.075 0.057 0.106 0.043 0.016 0.008 0.004 PLD03C through PLD02C24C E1402D4E-STD-FW-001 Futurewafer Technology Co., Ltd 台灣未來芯航電股份有限公司 Tel ：+886-3-3573583/Tel ：+886-3-3574065 Futurewafer.com.tw 桃園市桃園區中正路 987 巷 50 弄 2 號 Futurewafer Tech Co., Ltd ESD Protection Device