PLCC20 STMICROELECTRONICS | Alldatasheet
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item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( silver filler ) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C PACKAGE MATERIAL LIST Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size February 1998 1/2 20 leads
2/2 100 120 140 160 180 dissipated power ( Watt ) Rth(j-a) (ºC/W) floating in air mounted on SM PCB5A board mounted on SM PCB5 board die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils 0.001 0.01 0.1 1 10 100 1,000 100 Time or pulse width ( s ) Transient Thermal Resistance (ºC/W) die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils on die dissipating area = 2000 sq.mils mounted on SM PCB5 board Pd = 2 Watt SINGLE PULSE 0 50 100 150 200 250 300 350 100 105 on board trace area ( x 1000 sq. mils ) Rth(j-a) (ºC/W) Pd =1 W die size = 80 x 120 sq.mils die pad = 140 x 140 sq.mils