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STAR STAR Surface Mount Tape-and-Reel Specification Literature Number: SNOSBW3A
STAR Surface Mount Tape-and-Reel Specification December 1992 STARTM Surface Mount Tape-and-Reel Specification General Description Tape-and-Reel is a new method for shipment of surface mount devices. This approach simplifies the handling of semiconductors for automated circuit board assembly sys- tems. A Tape-and-Reel holds hundreds-to-thousands of surface mount devices (as compared with less than 100 devices in a rail), so that pick-and-place machines have to be reloaded less frequently. This savings in labor will further reduce manufacturing costs for automated circuit board as- sembly.
Features
Y Conductive PVC material redeuces static charge build- up Y Fully meets proposed EIA standard RS-481A (taping of surface-mounted components for automatic placing) Y Fully compatible with National’s surface mount package types Y Variable code density code 39 bar code label for Auto- mated Inventory Management availability Y Mechanical samples of surface mount packages avail- able in Tape-and-Reel for automated assembly process development Y Single Tape-and-Reel holds hundreds-to-thousands of surface mount semiconductors for additional labor sav- ings Y Conductive cover Tape-and-Reel availability Y Reels individually packed Tape-and-Reel Diagram TL/HH/8352–1 STARTM is a trademark of National Semiconductor Corporation. PRELIMINARY C1995 National Semiconductor Corporation RRD-B30M115/Printed in U. S. A.
TAPE FORMAT AND DEVICE ORIENTATION TL/HH/8352–2 Page Page Small Outline Transistor SOT-23 (High Profile) 3 Plastic Chip Carrier IC (PLCC-IC) PLCC-20 11 SOT-23 (Low Profile) 3 PLCC-28 12 Small Outline IC (SO-IC) SO-8 (Narrow) 4 PLCC-44 13 SO-14 (Narrow) 5 PLCC-68 14 SO-14 (Wide) 6 PLCC-84 15 SO-16 (Narrow) 7 SO-16 (Wide) 8 SO-20 (Wide) 9 SO-24 (Wide) 10 MATERIALS # Cavity Tape: Conductive PVC (less than 10 5 X/Sq) # Cover Tape: Polyester 1. Conductive Cover available # Reel: 1. Solid 80 pt. Fibreboard (standard) 2. Conductive Fibreboard available 3. Conductive Plastic (PVC) available LABEL C.P.I.). Field Lot Number Date Code Revision Level National Part No. I.D. Quantity Fields are separated by at least one blank space. Future Tape-and-Reel packs will also include a smaller-size bar code label (high-density code 39) at the beginning of the tape. (This tape label is not available on current production.) National Semiconductor will also offer additional labels containing information per your specific specification. Example: TL/HH/8352–3
SOT-23 (High Profile), SOT-23 (Low Profile) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed (Start End) 5 (min) Empty Sealed Direction Carrier ²*2500 (High) Filled Sealed of u ²*3000 (Low) Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed *These quantities represent 7 × Reel Quantity availability. ²10,000 For 13 × Reel. TAPE DIMENSIONS TL/HH/8352–4 REEL DIMENSIONS TL/HH/8352–5
SO-8 (Narrow) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 2500 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–6 REEL DIMENSIONS TL/HH/8352–7
SO-14 (Narrow) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 2500 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–8 REEL DIMENSIONS TL/HH/8352–9
SO-14 (Wide) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 1000 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–10 REEL DIMENSIONS TL/HH/8352–11
SO-16 (Narrow) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 2500 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–12 REEL DIMENSIONS TL/HH/8352–13
SO-16 (Wide) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 1000 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–14 REEL DIMENSIONS TL/HH/8352–15
SO-20 (Wide) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 1000 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–16 REEL DIMENSIONS TL/HH/8352–17
SO-24 (Wide) TAPE FORMAT Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 1000 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–18 REEL DIMENSIONS TL/HH/8352–19
Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 1000 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–20 REEL DIMENSIONS TL/HH/8352–21
Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 750 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–22 REEL DIMENSIONS TL/HH/8352–23
Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 500 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–24 REEL DIMENSIONS TL/HH/8352–25
Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 250 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–26 REEL DIMENSIONS TL/HH/8352–27
Tape Section Ý Cavities Cavity Status Cover Tape Status Leader 5 (min) Empty Unsealed Direction (Start End) 5 (min) Empty Sealed of u Carrier 250 Filled SealedFeed Trailer 2 (min) Empty Sealed (Hub End) 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352–28 REEL DIMENSIONS TL/HH/8352–29
ApplicationÐTotal System Saving TL/HH/8352–32 Cost pressures today are forcing many electronics manu- facturers to automate their production lines. Surface mount technology plays a key role in this cost-savings trend be- cause: 1. The mounting of devices on the PC board surface elimi- nates the expense of drilling holes; 2. The use of pick-and-place machines to assemble the PC boards greatly reduces labor costs; 3. The lighter and more compact assembled products re- sulting from the smaller dimensions of surface mount packages mean lower material costs. Production processes now permit both surface mount and insertion mount components to be assembled on the same PC board. Automated manufacturers can improve their cost savings by using Tape-and-Reel for surface mount devices. Simplified handling results because hundreds-to-thousands of semi- conductors are carried on a single Tape-and-Reel pack (see the ‘‘Ordering Information’’ section for the exact quantities). With this higher device count per reel (when compared with less than 100 devices per rail), pick-and-place machines have to be re-loaded less frequently and lower labor costs result. With Tape-and-Reel, manufacturers save twiceÐonce from using surface mount technology for automated PC board assembly and again from less device handling during ship- ment and machine set-up.
Ordering Information
When you order a surface mount semiconductor, it will be in one of the 15 available surface mount package types (see Appendix II for the physical dimensions of the surface mount packages). Specifying the Tape-and-Reel method of shipment (Note 1) means that you will receive your devices in the following quantities per Tape-and-Reel pack: Device Quantity Small Outline Transistor SOT-23 (High Profile) (Note 2) 10000 2500 * SOT-23 (Low Profile) (Note 2) 10000 3000 * Small Outline IC SO-8 (Narrow) 2500 SO-14 (Narrow) 2500 SO-14 (Wide) 1000 SO-16 (Narrow) 2500 SO-16 (Wide) 1000 SO-20 (Wide) 1000 SO-24 (Wide) 1000 Plastic Chip Carrier IC PLCC-20 1000 PLCC-28 750 PLCC-44 500 PLCC-68 250 PLCC-84 250 *This denotes 7 × reel quantity availability. Note 1: For small outline transistors, your order will automatically be shipped in Tape-and-Reel unless you indicate otherwise. For surface mount integrated circuits, your order will automatically be shipped in conductive rails unless you indicate ‘‘Tape-and-Reel’’ after the device description on your purchase order. Note 2: Your SOT-23 devices will automatically have Option 1 orientation unless you indicate ‘‘Option 2 Orientation’’ after the device description on your purchase order (see ‘‘Tape-and-Reel Overview’’ for definition of SOT-23 orientations). In addition, your SOT-23 devices will automatically have the high-profile outline unless you indicate ‘‘Low-Profile Outline’’ after the device description on your purchase order (see ‘‘Appendix IIÐPhysical Dimensions of Surface Mount Package’’ for definition of SOT-23 outlines). Example: You order 5,000 LM324M ICs shipped in Tape- and-Reel. # All 5,000 devices have the same date code # You receive 2 SO-14 (Narrow) Tape-and-Reel packs, each having 2500 LM324M ICs
Appendix IÐShort-Form Procurement Specification TAPE FORMAT x Direction of Feed Trailer (Hub End) Carrier Leader (Start End) Empty Cavities, Empty Cavities, Filled Cavities Empty Cavities, Empty Cavities, min min (Sealed min min (Unsealed (Sealed Cover Tape) Sealed (Unsealed Cover Tape) Cover Tape) Cover Tape) Cover Tape) SMALL OUTLINE TRANSISTOR SOT-23 2 2 10000 2500 * 55(High Profile) SOT-23 2 2 10000 3000 * 55(Low Profile) SMALL OUTLINE IC SO-8 (Narrow) 2 2 2500 5 5 SO-14 (Narrow) 2 2 2500 5 5 SO-14 (Wide) 2 2 1000 5 5 SO-16 (Narrow) 2 2 2500 5 5 SO-16 (Wide) 2 2 1000 5 5 SO-20 (Wide) 2 2 1000 5 5 SO-24 (Wide) 2 2 1000 5 5 PLASTIC CHIP CARRIER IC PLCC-20 2 2 1000 5 5 PLCC-28 2 2 750 5 5 PLCC-44 2 2 500 5 5 PLCC-68 2 2 250 5 5 PLCC-84 2 2 250 5 5 *This denotes 7 × reel quantity availability.
Appendix IÐShort-Form Procurement Specification (Continued) TAPE DIMENSIONS (24 Millimeter Tape or Less) TL/HH/8352–33 WP F EP 2 P0 DT A 0 B0 K0 D1 R SMALL OUTLINE TRANSISTOR SMALL OUTLINE IC PLASTIC CHIP CARRIER IC Note 1: A0,B 0 and K 0 dimensions are measured 0.3 mm above the inside wall of the cavity bottom. Note 2: Tape with components shall pass around a mandril radius R without damage. Note 3: Cavity tape material shall be PVC conductive (less than 10 5 X/Sq). Note 4: Cover tape material shall be polyester (30–65 grams peel-back force). Note 5: D1 Dimension is centered within cavity. Note 6: All dimensions are in millimeters.
Appendix IÐShort-Form Procurement Specification (Continued) TAPE DIMENSIONS (32 Millimeter Tape or Greater) TL/HH/8352–34 WP F 2 EP 2 P0 DT A 0 B0 K0 D1 R PLASTIC CHIP CARRIER IC Note 1: A0,B 0 and K 0 dimensions are measured 0.3 mm above the inside wall of the cavity bottom. Note 2: Tape with components shall pass around a mandril radius R without damage. Note 3: Cavity tape material shall be PVC conductive (less than 10 5 X/Sq). Note 4: Cover tape material shall be polyester (30–65 grams peel-back force). Note 5: D1 Dimension is centered within cavity. Note 6: All dimensions are in millimeters.
Appendix IÐShort-Form Procurement Specification (Continued) REEL DIMENSIONS TL/HH/8352–35 A (Max) B (Min) C D (Min) N (Min) G T (Max) 8 mm Tape SOT-23 (High Profile) (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 0.331 8.4 a0.059 b0.000 a1.5 0.567 14.4SOT-23 (Low Profile) 12 mm Tape SO-8 (Narrow) (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 0.488 12.4 a0.078 b0.000 0.724 18.4 16 mm Tape SO-14 (Narrow) SO-14 (Wide) SO-16 (Narrow) (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 0.646 16.4 a0.078 b0.000 0.882 22.4SO-16 (Wide) PLCC-20 24 mm Tape SO-20 (Wide) SO-24 (Wide) (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 0.960 24.4 a0.078 b0.000 1.197 30.4PLCC-28 32 mm Tape PLCC-44 (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 1.276 32.4 a0.078 b0.000 1.512 38.4 44 mm Tape PLCC-68 (13.00) (330) 0.059 1.5 0.512g0.002 13g0.05 0.795 20.2 1.969 1.748 44.4 a0.078 b0.000 1.984 50.4PLCC-84 Units: Inches Millimeters Material: Paperboard (Non-Flaking)
Appendix IIÐPhysical Dimensions of Surface Mount Packages SOT-23 (High Profile) (Generally used for Top-of-Board Mounting) SOT-23 (Low Profile) (Generally used for Underside-of-Board Mounting)
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-8 (Narrow) SO-14 (Narrow)
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-14 (Wide) SO-16 (Narrow)
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-16 (Wide) SO-20 (Wide)
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-24 (Wide) PLCC-20
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) PLCC-28 PLCC-44
STAR Surface Mount Tape-and-Reel Specification Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) PLCC-68 PLCC-84 Lit. Ý 113635 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
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