PLA110 LITTELFUSE | Alldatasheet
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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, PocketSize) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Security Industrial Controls 3750Vrms Input to Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation FCC Compatible VDE Compatible Small 6-Pin Package Switching Characteristics of Normally Open Devices Form-A IF ILOAD 10% 90% ton toff + Control - Control NC Load Do Not Use Load AC/DC Configuration + Control - Control NC + Load - Load DC Only Configuration PLA110 is a normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The PLA110 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package. UL Recognized Component: File E76270 CSA Certified Component: Certificate # 1175739 TUV EN 62368-1: Certificate # B 082667 0008
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R10 PLA110 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Min Max Units Blocking Voltage - 400 V P Reverse Input Voltage - 5 V Input Control Current - 50 mA Peak (10ms) - 1 A Input Power Dissipation 1 - 150 mW T otal Package Dissipation 2 - 800 mW Isolation Voltage, Input to Output 3750 - V rms Operational T emperature, Ambient -40 +85 ºC Storage T emperature -40 +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage I L=1AV DRM 400 - - V P Load Current Continuous, AC/DC Configuration - IL - - 150 mA rms / mADC Continuous, DC Configuration - - 250 mA DC Peak t =10ms I LPK - - ±400 mA P On-Resistance 1 AC/DC Configuration I L=150mA RON --2 2 DC Configuration I L=250mA - - 7 Off-State Leakage Current V L=400VP ILEAK -- 1 A Switching Speeds T urn-On I F=5mA, VL=10V ton -- 1 ms T urn-Off t off - - 0.5 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L=150mA I F -- 5 m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.36 1.5 V Reverse Input Current V R=5V I R --1 0 A Common Characteristics Input to Output Capacitance V IO=0V , f=1MHz C IO -3 - p F 1 Measurement taken within one second of on-time.
INTEGRATED CIRCUITS DIVISION PLA110 www.ixysic.com 3R10 LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) Turn-On Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) Turn-Off Time (ms) Device Count (N) Typical IF for Switch Operation (N=50, IL=150mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50) LED Current (mA) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 16 18 2015 17 19 On-Resistance (:) Device Count (N) Typical Blocking Voltage Distribution (N=50) Blocking Voltage (V Device Count (N) Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.12 0.10 0.08 0.06 0.04 0.02 Temperature (ºC) -50 -25 0 25 50 75 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Typical LED Forward Voltage Drop vs. Temperature IF=10mA IF=5mA IF=2mA Typical Turn-On Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R10 PLA110 Typical On-Resistance vs. Temperature AC/DC Configuration (IL=150mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 IF=5mA IF=10mA Typical Turn-On Time vs. Temperature (IL=100mADC) Temperature (ºC) Turn-On Time (ms) -40 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 120 100 IF=5mA IF=10mA Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mADC) Temperature (ºC) Turn-Off Time (ms) -40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature - DC Configuration (IL=150mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 IF=5mA IF=10mA Typical IF for Switch Operation vs. Temperature (IL=100mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=100mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical On Resistance vs. Temperature (IF=5mA; IL=100mA Instantaneous) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 120 100 Typical Load Current vs. Load Voltage (IF=5mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Maximum Load Current vs. Temperature (N=50) Temperature (ºC) Load Current (mA) 300 250 200 150 100 -40 -20 0 20 40 60 80 120 100 IF=10mA IF=5mA DC Configuration AC/DC Configuration IF=10mA IF=5mA Typical Blocking Voltage vs. Temperature Temperature (ºC) Blocking Voltage (VP) -40 480 475 470 465 460 455 450 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured across Pins 4&6 Temperature (ºC) Leakage (PA) -40 0.035 0.030 0.025 0.020 0.015 0.010 0.005 -20 0 20 40 60 80 100 Energy Rating Curve Time Load Current (A) 10Ps 1.2 1.0 0.8 0.6 0.4 0.2 1ms100Ps 100ms 1s10ms 10s 100s PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION PLA110 www.ixysic.com 5R10 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation PLA110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classifi cation Temperature (Tc) Dwell Time (t P) Max Refl ow Cycles PLA110S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles PLA110 260ºC 250ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R10 PLA110 Dimensions mm (inches) PCB Hole Pattern 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 5.080±0.127 (0.200±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254±0.0127 (0.010±0.0005) 9.144±0.508 (0.360±0.020)
7.239 TYP
(0.285 TYP) 7.620±0.254 (0.300±0.010) 3.302±0.051 (0.130±0.002)
4.064 TYP
(0.160 TYP) 0.457±0.076 (0.018±0.003) 8.382±0.381 (0.100±0.005) 6.350±0.127 (0.250±0.005) 1.651±0.254 (0.065±0.010) Pin 1
1.524 TYP
(0.060 TYP) Controlling dimension: inches Dimensions mm (inches) PCB Land Pattern 0.254±0.0127 (0.010±0.0005) 7.620±0.254 (0.300±0.010) 0.635±0.127 (0.025±0.005) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382±0.381 (0.100±0.005) 9.524±0.508 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 1.651±0.254 (0.065±0.010) Pin 1 (0.060 TYP) Controlling dimension: inches PLA110 PLA110S Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION Specification: DS-PLA110-R10 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/2025 PLA110 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P1 = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed PLA110STR Tape & Reel