PL560-37 MICREL | Alldatasheet
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Analog Frequency Multiplier PL560 -XX VCXO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 1 PRODUCT DESCRIPTION The Analog Frequency Multiplier (AFM ) is the industry’s first ‘Balanced Oscillator’ utilizing analog multiplication of the fundamental frequency (at double or quadruple frequency), combined with an attenuation of the fundamental of the reference crys tal, without the use of a phase -locked loop (PLL) , in CMOS technology. Micrel ’s world’s best performing AFM products can achieve up to 800 MHz output frequency with little jitter or phase noise deterioration. In addition, the low frequency input crystal requirement ma kes the AFMs the most affordable high -performance timing - source in the market. PL560 /5-xx family of products utilize low -power CMOS technology and are housed in Green / RoHS compliant 16-pin TSSOP , and 16 -pin 3x3 QFN package s.
FEATURES
Non-PLL frequency multiplication Input frequency from 30-200 MHz Output frequency from 60 -800 MHz Low phase noise and jitter (equivalent to fundamental crystal at the output frequency) Ultra -low jitter o RMS phase jitter < 0.25 ps (12kHz -20MH z) o RMS period jitter < 2.5 ps Low phase noise o -142 dBc/Hz @100kHz offset from 155.52 MHz o -150 dBc/Hz @ 10MHz offset from 155.52 MHz High linearity pull range (typ. 5%) +/- 120 PPM pullability VCXO Low input frequency eliminates the need for expensive crysta ls Differential output levels (PECL, LVDS), or single - ended CMOS Single 3.3V , ±10% power supply Optional industrial temperature range ( -40C to +85 C) Available in 16 -pin Green /RoHS compliant TSSOP, and 3x3 QFN packages Figure 1: 2x AFM Phase Noise at 311.04MHz
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 2 Oscillator Amplifier OE Q QBARFrequency XIN XOUT L2X VCON Frequency L4X Only required in x4 designs Figure 2: Block Diagram of VCXO AFM Figure 3 shows the period jitter histogram of the 2x An alog Frequency Multiplier at 311.04 MHz, while F igure 4 shows the very low rejection levels of su b-harmonics that correspond to the exceptionally low jitter performance. Figure 3: Period Jitter Histogram at 311.04 MHz Figure 4: Spectrum Analysis at 311.04 MHz Analog Frequency Multiplier (2x) Anal og Frequency Multiplier (2x) with 155.52MHz crystal with sub -harmonic s below –72 dBc OE LOGIC SELECTION OUTPUT OESEL OE Output State LVPECL 0 (Default) 0 (Default) Enabled
1 Tri-state
1 (Default) Enabled LVDS or LVCMOS 0 (Default)
0 Tri-state
1 (Default) Enabled 0 (Default) Enabled OESEL and OE: Connect to VDD or leave floating to set to “1”, connect to GND to set to “0”. Internally set to default through pull -down / -up.
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 3 PRODUCT SELECTION GUIDE FREQUENCY VERSUS PHASE NOISE PERFORMANCE Part Number Input Frequency Range (MHz) Analog Frequency Multiplication Factor Output Frequency Range (MHz) Output Type Phase Noise at Frequency Offset From Carrier (dBc/Hz) Carrier Freq. (MHz) 10Hz 100Hz 1kHz 10kHz 100kHz 1MHz 10MHz PL560-37 30 - 80 4 120 - 320 LVCMOS 155.52 -50 -82 -110 -128 -142 -148 -150 PL560-38 30 - 80 4 120 - 320 LVPECL 155.52 -50 -82 -110 -128 -142 -148 -150 PL560-39 30 - 80 4 120 - 320 LVDS 155.52 -50 -82 -110 -128 -142 -148 -150 PL560-47 30 - 80 2 60 - 160 LVCMOS 155.52 -65 -95 -122 -138 -142 -148 -149 PL560-48 30 - 80 2 60 - 160 LVPECL 155.52 -65 -95 -122 -138 -142 -148 -149 PL560-49 30 - 80 2 60 - 160 LVDS 155.52 -65 -95 -122 -138 -142 -148 -149 PL560-68 75 - 200 2 150 - 400 LVPECL 311.04 -60 -85 -112 -135 -142 -150 -151 PL560-69 75 - 200 2 150 - 400 LVDS 311.04 -60 -85 -112 -135 -142 -150 -151 Phase n oise was measured using Agilent E5500. FREQUENCY VERSUS JITTER, AND SUB -HARMONIC PERFORMANCE Part Number Output Freq. (MHz) RMS Period Jitter (ps) Peak to Peak Period Jitter (ps) RMS Accumulated (L.T.) Jitter (ps) RMS Phase Jitter 12kHz to 20MHz (ps) Spectral Specifications / Sub-harmonic Content (dBc), Frequency (MHz) Min Typ Max Min Typ Max Min Typ Max Min Typ Max Carrier Freq. (Fc) -75% (Fc) -50% (Fc) -25% (Fc) +25% (Fc) +50% (Fc) +75% (Fc) PL560-37 155 2.5 3 18 20 3 0.25 155.52 -75 -62 -65 -75 PL560-38 155 2.5 3 18 20 3 0.25 155.52 -75 -62 -65 -75 PL560-39 155 2.5 3 18 20 3 0.25 155.52 -75 -62 -65 -75 PL560-47 155 2.5 3 18 20 3 0.25 155.52 -68 -68 PL560-48 155 2.5 3 18 20 3 0.25 155.52 -68 -68 PL560-49 155 2.5 3 18 20 3 0.27 155.52 -68 -68 PL560-68 311 2.5 3 18 20 3 0.18 311.04 -72 -85 PL560-69 311 2.5 3 18 20 3 0.18 311.04 -72 -85 Note: Wavecrest data 10,000 hits. No filtering was used in jitter calculations. Agilent 5500 was used for phase jitter measurements . Spectral specifications were obtained using Agilent E7401A.
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 4 CRYSTAL SPECIFICATIONS AND BOARD LAYOUT CONSIDERATIONS BOARD LAYOUT CONSIDERATIONS To minimize parasitic effects, and improve performanc e: Place the crystal as close as possible to the IC. Make the board traces that are connected to the crystal pins symmetrical. The board trace symmetry is important, as it reduces th e negative parasitic effects to produce a clean frequency multiplicatio n with low jitter. Parasitic effects reduce frequency pulling of the VCXO and increase jitter. CRYSTAL SPECIFICATIONS & TUNING PERFORMANCE CRYSTAL SPECIFICATIONS TUNING PERFORMANCE PART NUMBER CRYSTAL RESONATOR FREQUENCY (FXIN) MODE CL (xtal) ESR (RE) CRYSTAL TUNING (Typical) CONDI- TIONS TYP MAX CRYSTAL FREQ (MHz) C0 C1 C0/C1 VC: 1.65V 0V VC: 1.65V 3.3V PL565-08 PL560-09 PL560-68/69 75 to 200MHz Funda- mental At VCON = 1.65V 5pF 30Ω 155.52 3.0pF 12.2fF 245 -145 ppm +108 ppm 155.52 1.8pF 5.7fF 316 -134 ppm +87 ppm PL560- 37/38/39 PL560- 47/48/49 30 to 80MHz Funda- mental At VCON = 1.65V 5pF 30Ω 30.72 2.8pF 12.4fF 228 -167ppm +176 ppm 30.72 4.5pF 19.1fF 236 -163 ppm +167 ppm 38.88 5.1pF 20.9fF 242 -131 ppm +98 ppm 38.88 5.3pF 25.6fF 207 -157 ppm +141 ppm 77.76 2.0pF 6.7fF 305 -92 ppm +110 ppm Note: Non specified parameters can be chosen as standard values from crystal suppliers. CL ratings larger than 5pF require a crystal frequency adjustment. Request detailed crystal specifications from Micrel . XTAL XTAL Ceramic SMD AFM IC XIN (Pin # 4) XOUT (Pin # 5) AFM IC XIN (Pin # 4) XOUT (Pin # 5)
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 5 VOLTAGE CONTROL SPECIFICATION PARAMETERS SYMBOL CONDITIONS MIN. TYP. MAX. UNITS VCXO Stabilization Time TVCXOSTB From power valid 10 ms VCXO Tuning Range XTAL C 0 /C1 <300 200 ppm CLK Output Pullability VCON= 1.65V , 1.65V XTAL C 0 /C1 <300 100 120 ppm Linearity 5 10 % VCON Input Impedance 130 kΩ VCON M odulation BW 0V < VCON < 3.3V, -3dB 16 kHz EXTE RNAL COMPONENT VALUES INDUCTOR VALUE OPTIMIZATION The required inductor value(s) for the best performance depends on the operating frequency, and the board layout specifications. The listed values in this datasheet are based on the calculated parasitic v alues from Micrel ’s evaluation board design. These inductor values provide the user with a starting point to determine the optimum inductor values. Additional fine -tuning may be required to determine the optimal solution. The inductor is recommended to be a high Q small size 0402 or 0603 SMD component, and must be placed between L2X / L4X and adjacent VDDOSC pin . Place inductor as close to the IC as possible to minimize parasitic effects and to maintain inductor Q. To assist with the inductor value optimization, Micrel has developed the “AFM Tuning Assistant” software. You can download this software from Micrel ’s web site (www. micrel .com). The software consists of two worksheets. The first worksheet (named L2) is used to fine -tune the ‘L2’ inducto r value, and the second worksheet (named L4) is used for fine tuning of the ‘L4’ (used in 4x AFMs only) inductor value. For those designs using Micrel ’s recommended board layout, you can use the “AFM Tuning Assistant” to determine the optimum values for the required inductors. This software is developed based on the parasitic information from Micrel ’s board layout and can be used to determine the required inductor and parallel capacitor (see LWB1 and Cstray parameters) values. For those employing a dif ferent board layout in their design, we recommend to use the parasitic information of their board layout to calculate the optimized inductor values. Please use the following fine tuning procedure:
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 6 Figure 5: Diagram Representation of the Related Syste m Inductance and Capacitance DIE SIDE PCB side - Cinternal = Based on AFM device - LWB1 = 2 nH, (2 places), Stray inductance - Cpad = 2.0 pF, Bond pad and its ESD circuitry - Cstray = 1.0 pF, Stray capacitance - C11 = 0.4 pF, The following ampli fier stage - L2X (L4X) = 2x or 4x inductor - C2X (C4X) = range (0.1 to 2.7 pF), Fine tune inductor if used There are two default variables that normally will not need to be modified. These are Cpad, and C11 and are found in cells B22 and B27 of ‘A FM Tuning Assistant’, respectively. LWB1 is the combined stray inductance in the layout. The DIE wire bond is ~ 0.6 nH and in the case of a leaded part an additional 1.0 nH is added. Your layout inductance must be added to these. There are 2 of these an d they are assumed to be approximately symmetrical so you only need to enter this inductance once in cell B23. Enter the stray parasitic capacitance into cell B26. An additional 0.5 pF must be added to this value if a leaded part is used. Enter the approp riate value for Cinternal into B21 based on the device used (see column D). Use the ‘AFM Tuning Assistant’ software to calculate L2X (and C2X if used) for your resonance frequency. For 4X AFMs, repeat the same procedure in the L4X worksheet. See the examp les in the following section .
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 7 DETERMINING STRAY L’ s AND C’ s IN A LAYOUT Figure 6: Diagram Representation of the Board Layout Lets take the PL560 -38 (4x VCXO) for example. This takes a crystal input in the range of 30 to 8 0 MHz and multiplies it to an output of 120 to 320 MHz. To determine the stray L’s and C’s of the layout we will assemble two test units. One AFM will be tuned to the lower range of the device (120 MHz), and the other to the upper range of the device (32 0 MHz). 120 MHz AFM Tuning: Using the “AFM Tuning Assistant” find the PL560 -3x in the L2 X worksheet. Enter the Cinternal value found next to it into cell B21. In cell B24 enter the closest standard inductor value (see CoilCraft 0603CS series for examp le) to achieve the closest peak frequency to 60 MHz. Repeat the same procedure for L4X at 120 MHz. Results: L2X = 180 nH, L4X = 82 nH . 320 MHz AFM tuning: Repeat the previous procedure for L2 X at 120 MHz and L4 X at 320 MHz. Results: L2X = 24 nH, L4X = 10 nH . Proceed and assemble the test units. Measuring 120 MHz L2 X: Connect the RF generator and scope probe as shown in Figure 6, above. While power is applied to the PCB, set the generator output to +12 dBm and the frequency to 30 MHz. Since this is the 2x port, the scope will show 60 MHz with ~ 3 V pk-pk amplitude. Vary the generator above and below 30 MHz until the amplitude on the scope is maximum and record the generator frequency. For example , the peak is re corded at 29.8x2 or 59.6 MHz.
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 8 Measuring 320 MHz L2 X: Connect the RF generator and scope probe as shown in Figure 6, above. While power is applied to the PCB, set the generator output to +12 dBm and the frequency to 80 MHz. Since this is the 2x port the scope will show 160 MHz with ~ 3 V pk-pk amplitude. Vary the generator above and below 80 MHz until the amplitude on the scope is maximum and record the generator frequency. For example , the peak is recorded at 78.0 x 2 = 156 MHz In the AFM Tuning Assistant, add the scope’s probe capaci tance to the Cstray cell. For our example 0.5 pF + 1.0 pF = 1.5 pF. With L2X at 24 nH adjust LWB1 (cell B23) until the peak frequency reads 156 MHz. Next replace the L2X value with 180 nH and see if it peaks at 59.6 MHz. I f it does not, adjust Cstray un til 59.4 MHz is achieved. Again enter 24 nH for L2 X and fine tune LWB1 for 156 MHz. Results: LWB1 = 1.6 nH, Cstray = 2.9 pF -0.5 pF = 2.4 pF (subtract scope probe stray capacitance ) Repeat the same steps for the L4X: Set the generator to 80 MHz. The 82 nH peaks at 118 MHz and the 10 nH peaks at 304 MHz. Results: LWB1 = 1.8 nH, Cstray = 2.5 pF -0.5 pF = 2.0 pF (subtract scope probe stray capacitance ) Internal Capacitor Selection by Device Device Number Cinternal (pF) 2X 4X P565 -08 7.625 6.250 P560 -09 7.625 6.250 P560 -3x 34.125 16.500 P560 -4x 34.125 P560 -6x 7.625
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 9 ELECTRICAL SPECIFICA TIONS ABSOLUTE MAXIMUM RATINGS PARAMETERS SYMBOL MIN. MAX. UNITS Supply Voltage VDD 4.6 V Input Voltage, DC VI GND-0.5 VDD +0.5 V Output Voltage, DC VO GND-0.5 VDD +0.5 V Storage Temperature TS -65 150 C Ambient Operating Temperature , Industrial TA_I -40 +85 C Ambient Operating Temperature, Commercial TA_ C 0 +70 C Junction Temperature TJ 125 C Lead Temperature (soldering, 10s) 260 C Input Stat ic Discharge Voltage Protection 2 kV Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permane nt damage to the device and affect product reliability. These conditions represent a stres s rating only, and functional operations of the device at these or any other co nditions above the operational limits noted in this specification is not implied . LVPECL ELECTRICAL CHARACTERISTICS PARAMETERS SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Supply Cur rent, loaded outputs IDD Fout = 622 .08 MHz, 15pF Load 75 80 mA Operating Voltage * VDD 2.97 3.63 V Output Clock Duty Cycle @ VDD – 1.3V 45 50 55 % Short Circuit Current 50 mA Output High Voltage VOH RL = 50 Ω to (VDD – 2V) VDD -1.025 V Output Low Voltage VOL VDD -1.620 V Clock Rise Time tr @ 20/80% 0.25 0.45 ns Clock Fall Time tf @ 80/20% 0.25 0.45 ns *Contact Micrel for lower operating voltages OUT OUT 50? 50? PECL Levels Test Circuit LVPECL Transition Time Waveform OUT OUT 20% 80% tR tF VDD DUTY CYCLE 45 - 55% 55 - 45% 50% OUT OUT tSKEW PECL Output Skew 2.0V OUT OUT 50 50 LVPECL Levels Test Circuit PECL Transistion Time Waveform OUT OUT 50% 20% 80% tR tF VDD DUTY CYCLE 45 - 55% 55 - 45% 50% OUT OUT tSKEW PECL Output Skew 2.0V OUT OUT 50? 50? PECL Levels Test Circuit PECL Transistion Time Waveform OUT OUT 50% 20% 80% tR tF VDD DUTY CYCLE 45 - 55% 55 - 45% 50% OUT OUT tSKEW LVPECL Output Skew 2.0V
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 10 LVDS ELECTRICAL CHARACTERISTICS PARAMETERS SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Supply Current, loaded outputs IDD Fout = 622 .08 MHz, 15pF Load 55 60 mA Operating Voltage * VDD 2.97 3.63 V Output Clock Duty Cycle @ 1.25V (LVDS) 45 50 55 % Short Circuit Current 50 mA Output Differential Voltage VOD RL = 100 Ω (see figure) 247 355 454 mV VDD Magnitude Change VOD -50 50 mV Output High Voltage VOH 1.4 1.6 V Output Low Voltage VOL 0.9 1.1 V Offset Voltage VOS 1.125 1.2 1.375 V Offset Magnitude Change VOS 0 3 25 mV Power -off Lea kage IOXD Vou t = V DD or GND VDD = 0V 1 10 µA Output Short Circuit Current IOSD -5.7 -8 mA Differential Clock Rise Time tr RL = 100 Ω CL = 10 pF (see figure) 0.2 0.5 0.7 ns Differential Clock Fall Time tf 0.2 0.5 0.7 ns *Contact Micrel for lower operating voltages OUT OUT VOD VOS 50 50 OUT VDIFF RL = 100 CL = 10pF CL = 10pF LVDS Switching Test CircuitLVDS Levels Test Circuit LVDS Transistion Time Waveform OUT OUT OUT 0V (Differential) 20% 80% 20% 80% tR tF VDIFF OUT OUT VOD VOS 50? 50? OUT VDIFF RL = 100? CL = 10pF CL = 10pF LVDS Switching Test CircuitLVDS Levels Test Circuit LVDS Transition Time Waveform OUT OUT OUT 0V (Differential) 20% 80% 20% 80% tR tF VDIFF OUT OUT VOD VOS 50 50 OUT VDIFF RL = 100 CL = 10pF CL = 10pF LVDS Switching Test CircuitLVDS Levels Test Circuit LVDS Transistion Time Waveform OUT OUT OUT 0V (Differential) 20% 80% 20% 80% tR tF VDIFF
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 11 LVCMOS ELECTRICAL CHARACTERISTICS PARAMETERS SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Supply Current, loaded outputs IDD At 100MHz, 15pF load 16 20 mA Operating Voltage * VDD 2.97 3.63 V Output High Voltage (LVTTL) VOH 3 .3 IOH = -8.5 mA, 3.3V 2.4 V Output Low Voltage (LVTTL) VOL 3 .3 IOL = 8.5mA , 3.3V 0.4 V Output High Voltage (LVCMOS) VOHC3 .3 IOH = -4mA, 3.3V VDD – 0.4 V Output Drive Current IOSD 3 .3 VOL = 0.4V, V OH = 2.4V (per o utput) , 3.3V 8.5 mA Output Clock Rise/Fall Time Tr,Tf 10% / 90% V DD , 10 pF load 1.2 1.6 ns Output Clock Duty Cycle Measured @ 50% V DD 45 50 55 % *Contact Micrel for lower operating voltages
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 12 BOARD DESIGN AND LAYOUT CONSIDERATIONS L2X and L4X: Try to reduce the PCB trace inductance to a minimum by placing L2 X and L4 X as physically close to their respective pins as possible. Also be sure to bypass each Vdd connection especially taking care to place a 0.01 uF bypass at the Vdd side of L2 X and L4X (see recommended layout). Crystal connections: Be sure to keep the ground plane under the crystal connections continuous so that the stray capacitance is consistent on both crystal connections. Also be sure to keep the crystal connections symmet rical with respect to one another and the crystal connection pins of the IC. If you chose to use a series capacitance and or inductor to fine tune the crystal frequency be sure to put symmetrical pads for this cap on both crystal pins (see Cadj in recomme nded layout), even if one of the capacitors will be a 0.01 uF and the other is used to tune the frequency. T o further maintain a symmetrical balance on a crystal that may have more internal Cs tray on one pin or the other, p lace capacitor pads (Cbal) on eac h crystal lead to ground (see recommended layout). R3rd is only required if a 3 rd overtone crystal is used. VDD and GND : Bypass VDDANA and VDDBUF with separate bypass capacitors and if a V DD plane is used, feed each bypass cap with its own via. Be sure to connect any ground pin including the bypass caps with short via connection s to the ground plane. OESEL: J1 is recommended so the same PCB layout can be used for both OESEL settings . 2X Layout (TSSOP) 4X Layout (TSSOP)
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 13 PACKAGE PIN DESCRIPTION AND ASSIGNMENT PIN ASSIGNMENTS Name Pin# Type Product Description OSCOFFSEL 1 I 2X & 4X Set to “0” (GND) to choose to turn off the oscillator when outputs are disabled (OE). Default (no connect) is OSC always on. GNDOSC 2 P 2X & 4X GND connection for oscillator circuitry. VCON 3 I 2X & 4X Control Voltage input. Use this pin to change the output frequency by varying t he applied Control Voltage. XIN 4 I 2X & 4X Input from crystal oscillator circuitry. XOUT 5 O 2X & 4X Output from crystal oscillator circuitry. OE 6 I 2X & 4X Output Enable input (see "OE LOGIC SELECTION TABLE"). DNC 7 I 2X Do Not Connect. L4X 4X External inductor connection. See INDUCTOR VALUE OPTIMIZATION on page 5. This inductor is used with 4X AFMs. GNDANA 8 P 2X GND connection. VDDOSC * 4X VDD connection for oscillator circuitry. GNDBUF 9 P 2X & 4X GND connection for output buffer circui try. Q 10 O 2X & 4X PECL/LVDS or CMOS output. QBAR 11 O 2X & 4X Complementary PECL/LVDS output or in phase CMOS. VDDBUF * 12 P 2X & 4X VDD connection for output buffer circuitry. VDDANA * 13 P 2X & 4X VDD connection for analog circuitry. OESEL 14 I 2X & 4X Selector input to choose the OE control logic (see “OE SELECTION TABLE” ). Internal pull -down. VDDOSC * 15 P 2X & 4X VDD connection for oscillator circuitry. L2X 16 I 2X & 4X External inductor connection. See INDUCTOR VALUE OPTIMIZATION on page 5. * All V DD pins should be separately decoupled whenever possible. PLL560/5-0X OSCOFFSEL GNDOSC VCON XIN XOUT OE L4X VDDOSC L2X VDDOSC OESEL VDDANA VDDBUF QBAR Q GNDBUF P560/5-0X VDDOSC OE XOUT L4X 1 2 3 4 12 11 10 9 VDDBUF Q GNDBUF QBAR OESEL VDDANA VDDOSC L2X GNDOSC OSCOFF SEL VCON XIN PLL560-4X OSCOFFSEL GNDOSC VCON XIN XOUT OE DNC GNDANA L2X VDDOSC OESEL VDDANA VDDBUF QBAR Q GNDBUF P560-4X GNDANA OE XOUT DNC 1 2 3 4 12 11 10 9 VDDBUF Q GNDBUF QBAR OESEL VDDANA VDDOSC L2X GNDOSC OSCOFF SEL VCON XIN
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 14
PACKAGE INFORMATION
C L A E H D e B
16 PIN TSSOP ( mm )
Symbol Min. Max. A - 1.20 A1 0.05 0.15 B 0.19 0.30 C 0.09 0.20 D 4.90 5.10 E 4.30 4.50 H 6.40 BSC L 0.45 0.75 e 0.65 BSC QFN-16L Pin1 Dot DDD DED A b e L SEATING PLANE A1 Min Nom Max A 0.70 0.75 0.80 A1 0.00 - 0.05 b 0.20 0.25 0.30 D 2.95 3.00 3.05 E 2.95 3.00 3.05 D1 1.65 1.70 1.75 E1 1.65 1.70 1.75 L 0.250 0.300 0.350 e 0.50BSC Symbol Dimension (mm) 0.20
Analog Frequency Multiplier PL56X -XX VC XO Family Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474 -1000 • www.micrel.com Rev 11 /04 /1 1 Page 15 ORDERING INFORMATIO N Micrel Inc., reserves the right to make changes in its products or specifications, or both at any time without notice. The information furnished by Micrel is believed to be accurate and reliable. However, Micrel makes no guarantee or warranty concerning the accuracy of said info rmation and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon this product. LIFE SUPPORT POLICY : Micrel’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of Micrel Inc. For part ordering, please contact our Sales Department:
2180 Fortune Drive , San Jose, CA 95131 , USA
Tel: (408) 944 -0800 Fax: (408) 474 -1000 PART NUMBER The order number for this device is a combination of the following: Part number, Package type and Operating temperature range PL56X-XX X X X Order Number Marking Package Option * PL56 0-XXD C - Die Only PL560/5 -XXOC P560 /5-XX OC LLLLL TSSOP – Tub e PL560/5 -XXOC -R TSSOP – Tape and Reel PL560/5 -XXQC P560 /5 XX(I) LLL QFN – Tube PL560/5 -XXQC -R QFN – Tape and Reel Marking Notes : “LLL ”, “LL LLL” repre sents the production lot number PART NUMBER TEMPERATURE C=COMMERCI AL I=INDUSTRIAL PACKAGE TYPE O=TSSOP-16L Q= QFN -16L D= Die NONE= TUBE R= TAPE AND REEL