PL331BIDBVR

TL331_V01 TI1 | Alldatasheet

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Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TL331, TL331B, TL391B SLVS238H –AUGUST 1999–REVISED MAY 2020 TL331B,TL391BandTL331SingleComparators

1 Features

1• NEW TL331B and TL391B

• Improved specifications of B-version – Maximum rating: up to 38 V – ESD rating (HBM): 2k V – Improved reverse voltage performance – Low input offset: 0.37 mV – Low input bias current: 3.5 nA – Low supply-current: 430 µA – Faster response time of 1 µsec – TL391B provides an alternate pinout
• TL331B is improved drop-in replacement for TL331
• Common-mode input voltage range includes ground
• Differential input voltage range equal to maximum- rated supply voltage: ±38 V
• Low output saturation voltage
• Output compatible with TTL, MOS, and CMOS

2 Applications

• Vacuum robot
• Single phase UPS
• Server PSU
• Cordless power tool
• Wireless infrastructure
• Appliances
• Building automation
• Factory automation & control
• Motor drives
• Infotainment & cluster

3 Description

The TL331B and TL391B devices are the next generation versions of the industry-standard TL331 comparator. These next generation devices provide outstanding value for cost-sensitive applications, with features including lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, wider temperature range and improved 2kV ESD performance and improved negative input voltage handling with drop-in replacement convenience. The TL331B is a drop-in improved replacement for both the TL331I and TL331K versions, while the TL391B provides an alternate pinout of the TL331B to replace competitive devices. Operation from dual supplies also is possible as long as the difference between the two supplies is within 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TL331, TL331B (Preview), TL391B (Preview) SOT-23 (5) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Family Comparison Table Specification TL331B, TL391B TL331I TL331K Units Supply Votlage 3 to 36 2 to 30 2 to 30 V Total Supply Current (5V to 36V max) 0.43 0.7 0.7 mA Temperature Range −40 to 125 -40 to 85 -40 to 105 °C ESD (HBM) 2000 1000 1000 V Offset Voltage (Max over temp) ± 4 ± 9 ± 9 mV Input Bias Current (typ / max) 3.5 / 25 25 / 250 25 / 250 nA Response Time (typ) 1 1.3 1.3 µsec

TL331, TL331B, TL391B SLVS238H –AUGUST 1999–REVISED MAY 2020 www.ti.com Product Folder Links: TL331 TL331B TL391B Submit Documentation Feedback Copyright © 1999–2020, Texas Instruments Incorporated Table of Contents 6.2 Absolute Maximum Ratings, TL331B and TL391B... 4

6.5 Recommended Operating Conditions, TL331 and

6.6 Recommended Operating Conditions, TL331B and

11.2 Receiving Notification of Documentation Updates 13

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (January 2015) to Revision H Page

• Changed the text 'The output NPN will sink current when the positive input voltage is higher than the negative input voltage and the offset voltage' to 'The output NPN will sink current when the negative input voltage is higher than

TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated

5 Pin Configuration and Functions

Note reversed inputs compared to similar common pinout 5-Pin SOT-23 Top View Note reversed inputs compared to similar common pinout Pin Functions PIN TYPE DESCRIPTIONTL331, TL331B TL391B NAME NO. NO. IN+ 3 4 I Positive Input IN– 1 3 I Negative Input OUT 4 1 O Open Collector/Drain Output VCC 5 5 — Power Supply Input GND 2 2 — Ground

TL331, TL331B, TL391B SLVS238H –AUGUST 1999–REVISED MAY 2020 www.ti.com Product Folder Links: TL331 TL331B TL391B Submit Documentation Feedback Copyright © 1999–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed.

6 Specifications

6.1 Absolute Maximum Ratings, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage(2) 0 36 V VID Differential input voltage(3) –36 36 V VI Input voltage range (either input) –0.3 36 V VO Output voltage 0 36 V IO Output current 0 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed.

6.2 Absolute Maximum Ratings, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage(2) -0.3 38 V VID Differential input voltage(3) –38 38 V VI Input voltage range (either input) –0.3 38 V VO Output voltage -0.3 38 V IO Output current 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings, TL331 and TL331K

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750

TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.4 ESD Ratings, TL331B and TL391B

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750

6.5 Recommended Operating Conditions, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 36 V TJ Junction temperature, TL331 –40 85 °C TJ Junction temperature, TL331K –40 105 °C

6.6 Recommended Operating Conditions, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 3 36 V TJ Junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.7 Thermal Information

THERMAL METRIC(1) TL331, TL331K TL331B, TL391B UNITDBV (SOT-23) DBV (SOT-23)

5 PINS 5 PINS

RθJA Junction-to-ambient thermal resistance 218.3 211.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 87.3 133.6 °C/W RθJB Junction-to-board thermal resistance 44.9 79.9 °C/W ψJT Junction-to-top characterization parameter 4.3 56.4 °C/W ψJB Junction-to-board characterization parameter 44.1 79.6 °C/W

TL331, TL331B, TL391B SLVS238H –AUGUST 1999–REVISED MAY 2020 www.ti.com Product Folder Links: TL331 TL331B TL391B Submit Documentation Feedback Copyright © 1999–2020, Texas Instruments Incorporated

6.8 Electrical Characteristics, TL331B and TL391B

VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV VS = 5 to 36V, TA = –40°C to +125°C –4 4 IB Input bias current –3.5 –25 nA TA = –40°C to +125°C –50 nA IOS Input offset current –10 ±0.5 10 nA TA = –40°C to +125°C –25 25 nA VCM Input voltage range AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +125°C 550 mV IOH-LKG High-level output leakage current High-level output leakage current (V+) = VO = 5 V; VID = 1V 0.1 20 nA IOH-LKG High-level output leakage current High-level output leakage current (V+) = VO = 36V; VID = 1V; TA = –40°C to +125°C 1000 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 18 mA IQ Quiescent current VS = 5 V, no load 210 330 µA VS = 36 V, no load, TA = –40°C to +125°C 275 430 µA (1) High-to-low and low-to-high refers to the transition at the input.

6.9 Switching Characteristics, TL331B and TL391B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tresponse Propagation delay time, high-to-low; Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns tresponse Propagation delay time, high-to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns

TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated (1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) Full range TA is –40°C to +85°C for I-suffix devices and –40°C to +105°C for K-suffix devices. (3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common- mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.

6.10 Electrical Characteristics, TL331 and TL331K

at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS(1) TA (2) MIN TYP MAX UNIT VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) 25°C 2 5 mV Full range 9 IIO Input offset current VO = 1.4 V 25°C 5 50 nA Full range 250 IIB Input bias current VO = 1.4 V 25°C –25 –250 nA Full range –400 VICR Common-mode input voltage range(3) Full range 0 to VCC – 1.5 V AVD Large-signal differential voltage amplification VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC 25°C 50 200 V/mV IOH High-level output current VOH = 5 V, VID = 1 V 25°C 0.1 50 nA VOH = 30 V, VID = 1 V Full range 1 μA VOL Low-level output voltage IOL = 4 mA, VID = –1 V 25°C 150 400 mV Full range 700 IOL Low-level output current VOL = 1.5 V, VID = –1 V 25°C 6 mA ICC Supply current RL = ∞, VCC = 5 V 25°C 0.4 0.7 mA (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.

6.11 Switching Characteristics, TL331 and TL331K

VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Response time RL connected to 5 V through 5.1 kΩ, CL = 15 pF(1) (2) 100-mV input step with 5-mV overdrive 1.3 μs TTL-level input step 0.3

6.12 Typical Characteristics, TL331 and TL331K

Figure 1. Supply Current vs Supply Voltage Figure 2. Input Bias Current vs Supply Voltage Figure 3. Output Low Voltage vs Output Current (IOL)

80 /c109A60 /c109A 10 /c109A VCC 10 /c109A OUT GND IN+ IN− Epi-FET Diodes Resistors Transistors COMPONENT COUNT TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated

7 Detailed Description

7.1 Overview

The TL331 family is a single comparator with the ability to operate up to 36 V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to its very wide supply voltages range (2 V to 36 V), low Iq, and fast response. The open-collector output allows the user to configure the output's logic low voltage (VOL) and can be utilized to enable the comparator to be used in AND functionality. The TL331B and TL391B are performance upgrades to standard TL331 using the latest process technologies allowing for lower offset voltages, lower input bias and supply currents and faster response time over an extended temperature range. The TL331B can drop-in replace the "I" or "K" versions of TL331. The TL391B is an alternate pinout for replacing competitive devices.

7.2 Functional Block Diagram

Current values shown are nominal.

7.3 Feature Description

TL331 family consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing TL331 to accurately function from ground to VCC – 1.5 V differential input. The output consists of an open collector NPN (pull-down or low side) transistor. The output NPN will sink current when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is resistive and will scale with the output current. Please see Figure 3 for VOL values with respect to the output current.

7.4 Device Functional Modes

7.4.1 Voltage Comparison

The TL331 operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input differential polarity.

5 VVref

8 Application and Implementation

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.2 Typical Application

Figure 4. Typical Application Schematic

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters

8.2.2 Detailed Design Procedure

• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time

TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated

8.2.2.1 Input Voltage Range

When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC – 1.5 V. This limits the input voltage range to as high as VCC – 1.5 V and as low as 0 V. Operation outside of this range can yield incorrect comparisons. Below is a list of input voltage situation and their outcomes: 1. When both IN- and IN+ are both within the common mode range: a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting 2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current 3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and the output transistor is not conducting 4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking current

8.2.2.2 Minimum Overdrive Voltage

Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD) should be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 5 and Figure 6 show positive and negative response times with respect to overdrive voltage.

8.2.2.3 Output and Drive Current

Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use Figure 3 to determine VOL based on the output current. The output current can also effect the transient response. More is explained in the next section.

8.2.2.4 TL331B & TL391B ESD Protection

The "B" versions add dedicated ESD protections on all the pins for improved ESD performance as well as improved negative input voltage handling. Please see Application Note SNOAA35 for more information.

8.2.2.5 Response Time

Response time is a function of input over drive. See Application Curves for typical response times. The rise and fall times can be determined by the load capacitance (CL), load/pullup resistance (RPULLUP), and equivalent collector-emitter resistance (RCE).

• The rise time (τR) is approximately τR ~ RPULLUP × CL
• The fall time (τF) is approximatelyτF ~ RCE × CL – RCE can be determined by taking the slope of Figure 3 in its linear region at the desired temperature, or by dividing the VOL by Iout

8.2.3 Application Curves

The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe. Figure 5. Response Time for Various Overdrives Figure 6. Response Time for Various Overdrives

9 Power Supply Recommendations

comparator's input common mode range and create an inaccurate comparison.

10 Layout

10.1 Layout Guidelines

used, do not put a capacitor between the IC's GND pin and system ground.

10.2 Layout Example

Figure 7. TL331 Layout Example

TL331, TL331B, TL391B www.ti.com SLVS238H –AUGUST 1999–REVISED MAY 2020 Product Folder Links: TL331 TL331B TL391B Submit Documentation FeedbackCopyright © 1999–2020, Texas Instruments Incorporated

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

Analog Engineers Circuit Cookbook: Amplifiers (See Comparators section) - SLYY137 Precision Design, Comparator with Hysteresis Reference Design- TIDU020 Window comparator circuit - SBOA221 Reference Design, Window Comparator Reference Design- TIPD178 Comparator with and without hysteresis circuit - SBOA219 Inverting comparator with hysteresis circuit - SNOA997 Non-Inverting Comparator With Hysteresis Circuit - SBOA313 Zero crossing detection using comparator circuit - SNOA999 PWM generator circuit - SBOA212 How to Implement Comparators for Improving Performance of Rotary Encoder in Industrial Drive Applications - SNOAA41 A Quad of Independently Func Comparators - SNOA654

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 26-Jun-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PL331BIDBVR ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 105 PL391BIDBVR ACTIVE SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 105 TL331BIDBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 105 TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IS) TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IU) TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) NIPDAU | SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL) TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL) TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL) TL391BIDBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 105 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.

www.ti.com 26-Jun-2020 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL331 :

• Automotive: TL331-Q1
• Enhanced Product: TL331-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2020 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 TL331IDBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TL331IDBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0 TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331KDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TL331KDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2020 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15

0.00 TYP

5X 0.5 0.3 0.6

0.3 TYP

0 TYP

1.9 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/E 09/2019 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4

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