PKFC33C PROTEC | Alldatasheet

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Technical content

PKFC3.3C* thru PKFC36C* 05180.R3 12/05 www.protekdevices.com PACKAGED FLIP CHIP ARRAY Only One Name Means ProTek’Tion™ *PATENT PENDING”

APPLICATIONS

✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV

FEATURES

✔ CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm) ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Encapsulated 0502 Chip ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Pure-Tin - Sn, 100: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel 05180 PIN CONFIGURATION

www.protekdevices.com 05180.R3 12/05 PKFC3.3C* thru PKFC36C* *PATENT PENDING GRAPHS 0 25 50 75 100 125 150 TL - Lead Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C

5 Volts per Division

VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C IPP - Peak Pulse Current - Amps

www.protekdevices.com 05180.R3 12/05 PKFC3.3C* thru PKFC36C* *PATENT PENDING

APPLICATION INFORMATION

t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm

60 Seconds

270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.

www.protekdevices.com 05180.R3 12/05 PKFC3.3C* thru PKFC36C* *PATENT PENDING PACKAGE OUTLINE & DIMENSIONS COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. NOTES 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad : ± 0.003” (± 0.08mm). 4. All dimensions ±0.003” on package outline. PACKAGE OUTLINE MOUNTING PAD DIM MILLIMETERS INCHES PACKAGE DIMENSIONS A B C D E F G H J K 0.73 1.22 0.73 0.54 0.10 0.55 0.27 0.38 0.35 0.35 0.029 0.048 0.029 0.021 0.004 0.022 0.011 0.015 0.014 0.014 DIM MILLIMETERS INCHES PAD DIMENSIONS A B C E F G J 1.00 0.62 1.44 0.18 0.49 0.31 0.31 0.040 0.025 0.058 0.008 0.020 0.013 0.013 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-1. Outline & Dimensions: Rev 1 - 8/03, 06040 TAPE & REEL ORIENTATION NOTE 1. Top view of tape. Solder PADS face down in tape package. ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com A TOP BOTTOM SIDE H C G J D F E B K A F G Solder Print Diameter 0.010” - 0.012” J B C E Package Contact Pads Package Outline 0.76 1.27 0.76 0.57 0.13 0.58 0.30 0.41 0.38 0.38 0.79 1.32 0.79 0.60 0.16 0.61 0.33 0.44 0.41 0.41 0.030 0.050 0.030 0.023 0.005 0.023 0.012 0.016 0.015 0.015 0.031 0.052 0.031 0.024 0.006 0.024 0.013 0.017 0.016 0.016 MIN MIN MAX NOM MAX NOM MIN MIN MAX NOM MAX NOM 1.02 0.64 1.47 0.20 0.51 0.33 0.33 1.04 0.66 1.50 0.22 0.53 0.35 0.35 0.039 0.024 0.056 0.007 0.019 0.012 0.012 0.041 0.026 0.060 0.009 0.021 0.014 0.014 XX Tape & Reel Specifications (Dimensions in millimeters) D E t F W P Reel Dia. Tape Width 178mm (7”) 8mm