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ALPHA PIP 3.175 T THE PIP3.175 SERIES MOUNTS THE HEATSINK TO THE PCB USING A SPRING. OBTAINING ADEQUATE PRESSURE REQUIRED FOR THERMAL INTERFACE MATERIAL PERFORMANCE IS EASILY ATTAINED BY CHOOSING AN APPROPRIATE SPRING (NOT INCLUDED.). DIM ww 96.35 [9.25] A P/N PART NAME A 8 SOO1YZ3M —PIP3.175x7.0[TH]) 4 gq 7.00 [.276] } [.035] B [.050] : 1.50 [.060] SOO1YZON | PIP3.175x11.5 11.50 [.453] PIP3.175x13.2 13.20 [.520] 93.61 [9.142 ] SOO1YZOM | PIP3.175x14.3 1.55 44.30 [563] [.061] SOO1YZOY | PIP3.175x18.8 18.80 [.740] S001YZOX | PIP3.175x20.3 20.30 [.799] @ MATERIAL; BRASS (ROHS COMPLIANT) C6801 SAN-ETU METALS BZ5 OR EQUIVALENT @ DIMENSIONS = mm [inch] LEE Gy ZZ ty = SII REFERENCES: DISS. ZZ ZZ ZZ KEEEEX [> @ HEATSINK: Lf (2 LP REQUIRES HEATSINK HOLE DIAMETER OF 3.45. Sl (A ie [.136] IF "PIP3.175 + SPRING” NEEDS TO BE SF J CAPTIVE. (WHEN BASE THICKNESS IS LESS THAN 2 Sd mm OR SPRING IS PRE—COMPRESSED, HEATSINK HOLE DIAMETER 3.30 IS RECOMMENDED. ) HEATSINK: \\ | as, PUSH-ROD © BOARD: Hl 3 REQUIRES 93.175 +0.05 [9.125 +.002] THRU fe | — HOLES IN BOARD. i ] © INSTALLATION: | ——— a THE SPRING SHOULD NOT BE COMPRESSED TO amet All MU j SOLID LENGTH DURING INSTALLATION AND SHOULD / / yi BE SUPPORTED BY THE LOWER—BASE. / / - a PUSH-ROD AND LOWER-BASE NEEDS TO BE / / / HES 8S OBTAINED /PRODUCED LOCALLY. / CLnTerFACE MATERIAL / & cHIP PCB THRU HOLE NS Alpha Company Ltd. Alpha Novatech, Inc. - subsidiary of Alpha Company. 256-1 UEDA,NUMAZU-CITY SHIZUOKA-PREF..JAPAN 473 Sapena Ct. #12 Santa Clara, CA 95054 USA PHONE peri 0789 PHONE —+1(408)567-8082 FAX +81(55)966 9192 FAX +1(408)567-8053 E mail : alpha@micforg.co.jp E mail : sales@alphanovatech.com