PIO AITSEMI | Alldatasheet

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Technical content

AiT Semiconductor Inc. www.ait-ic.com POWER INDUCTOR PIO

  • FEATURE 1. High current capacity and Low DCR(used ceramic base) 2. High heat resistance, ideal for reflow soldering 3. Open magnetic circuit construction
  • APPLICATION 1. DC-DC converter, PDA and Cellular Phone 2. Set top box, Notebook and Server
  • ORDERING INFORMATION PIO1608 -1R0 T PN Inductance M:±20%
  • SHAPE AND DIMENSION ●SCHEMATICS AND LAND PATTERNS(mm)
  • SPECIFICATION Dimension in mm TYPE A (MAX) B(MAX) C(MAX) D(REF) E(REF) F(REF) G(REF)

AiT Semiconductor Inc. www.ait-ic.com POWER INDUCTOR PIO

  • ELECTRICAL CHARACTERISTICS PART NUMBER L (µH) SRF (MHz) typ RDC (Ω)Max Isat (A) Irms (A) PIO1608-1R0M 1.0±20% 130 0.05 2.9 2.9 PIO1608-1R5M 1.5±20% 115 0.06 2.6 2.8 PIO1608-2R2M 2.2±20% 100 0.07 2.3 2.4 PIO1608-2R7M 2.7±20% 75 0.08 2.1 2.1 PIO1608-3R3M 3.3±20% 70 0.08 2.0 2.0 PIO1608-4R7M 4.7±20% 50 0.09 1.5 1.5 PIO1608-6R8M 6.8±20% 45 0.13 1.2 1.4 PIO1608-8R2M 8.2±20% 40 0.16 1.15 1.3 PIO1608-100M 10±20% 35 0.16 1.1 1.2 PIO1608-150M 15±20% 30 0.23 0.9 1.1 PIO1608-220M 22±20% 20 0.37 0.70 0.80 PIO1608-330M 33±20% 15 0.51 0.58 0.60 PIO1608-470M 47±20% 14 0.64 0.50 0.50 PIO1608-680M 68±20% 11 0.86 0.40 0.40 PIO1608-101M 100±20% 9 1.27 0.31 0.30 PIO1608-151M 150±20% 6 2.00 0.27 0.25 PIO1608-221M 220±20% 5.5 3.11 0.22 0.20 PIO1608-331M 330±20% 5 3.80 0.18 0.16 PIO1608-471M 470±20% 4 5.06 0.16 0.15 PIO1608-681M 680±20% 3 9.20 0.14 0.12 PIO1608-102M 1000±20% 2 13.8 0.10 0.07 Note1. Measurement frequency of Inductance value : at 100kHz, 0.1V Note2. Measurement ambient temperature of L, DCR and IDC: at 25°C Note3. Isat: DC current at which the inductance drops 10%(typ) from its value without current Note4. Irms: Average current for 40°C temperature rise from 25°C ambient Note5. Inductance tolerance: M: ±20%

AiT Semiconductor Inc. www.ait-ic.com POWER INDUCTOR PIO

  • GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 85°C (Includes temperature when the coil is heated) 2. External appearance: On visual inspection, the coil has external defects. 3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 0.5kg 4. Insulating resistance: Over 100MΩ at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6/°C (-25~+80°C). 7. Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2°C and 1 hour drying under normal condition. 8. Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260°C, 10 seconds. 11. Storage environment Storage condition: Temperature Range: 10°C ~ 35°C (Generally: 21°C ~ 31°C) Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) Transportation condition: Temperature Range: -35°C ~ 85°C, Humidity Range: 50% ~ 95% RH 12. Use components within 6 months. If 6 months or more have elapsed, check soldarability before use. 13. Reflow profile recommend: Lead - free heat endurance test Lead-free the recommended reflow condition