PIIPM15P12D007 IRF | Alldatasheet

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Technical content

www.irf.com 1 Bulletin I27179 22 - Sep PIIPM15P12D007 Programmable Isolated IPM PI-IPM Features: /square6 Power Module:

  • NPT IGBTs 15A, 1200V
  • 10us Short Circuit capability /square4 Square RBSOA /square4 Low Vce(on) (2.7Vtyp @ 15A, 25°C) /square4 Positive Vce(on) temperature coefficient
  • Gen III HexFred Technology /square4 Low diode VF (2.32Vtyp @ 15A, 25°C) /square4 Soft reverse recovery
  • 10mΩ sensing resistors on all phase outputs /square4 Thermal coefficient < 50ppm/°C /square6 Embedded driving board
  • Programmable 40 Mips DSP
  • Current sensing feedback from two phases
  • Full protection from ground and line to line faults
  • UVLO, OVLO on DCbus voltage
  • Embedded flyback smps for floating stages (single 15Vdc @ 300mA input required)
  • Asynchronous isolated 2.5Mbps serial port for DSP communication and/or programming
  • Synchronous isolated 10Mbps serial port for DSP communication and/or programming
  • IEEE standard 1149.1 (JTAG port interface) for program downloading and debugging
  • Separated turn on / turn off outputs for IGBTs di/dt control
  • Hall effect sensors, sin/cos and quadrature encoder interfaces
  • On board 64kbits I2C EEprom

Description

The PIIPM15P12D007 is a fully integrated Intelligent Power Module for high performances Servo Motor Driver applications. The device core is a state of the art DSP, the TMS320LF2406A at 40 Mips, interfaced with a full set of peripherals designed to handle all analog feedback and control signals needed to correctly manage the power section of the device. A 64kbits EEPROM is also available to store calibration data. The PIIPM has been designed and tailored to implement internally all functions needed to close the current, speed and position loops of a high performances servo motor driver. The use of the flash memory version of the DSP and the JTAG port connector allows the user to easily develop and download his own proprietary algorithm. Package: PIIPM – BBI (EconoPack 2 outline compatible) Power Module schematic: Out 1 Out 2 Out 3 IN1 IN2 IN3 DC+ OUT DC+ IN BRK DC- DC- (signal) DC+ (signal) Input bridge, brake and three phases inverter (BBI) with current sensing resistors on all output phases and thermistor PIIPM15P12D007 System Block Schematic: The device comes in the EMP TM package, fully compatible in length, width and height with the popular EconoPack 2 outline.

www.irf.com 2 PIIPM15P12D007 I27179 22 - Sep Embedded driving board block schematic Power Supply 3.3V, 5V 15V flyback 15V iso-1 15V iso-2 15V iso-3 5V ref 3.3V 15V 3.3V ref V in COM V in COM TMS320LF2406A 40Mips Boot-en~ TMS TDi TDo Tck TRST- EMU0 EMU1 PD Start / stop CANTX CANRX JTAG/CAN interface connector Th+ Th- ADCin4 ; 70 PWM1 ; 39 PWM2 ; 37 PWM3 ; 36 PWM4 ; 33 PWM5 ; 31 PWM6 ; 28 Lin Reg 400kHz R2 + R2 - Current Sense Level Shifter ADCin1 Li n Reg 400kHz R3 + R3 - Current Sense Level Shifter 11kHz ADCin2 11kHz 15V iso-2 15V iso-3 Gate Drivers IR2214 Based G6 15V iso-1 15V 3.3V Gate Drivers IR2214 Based 15V iso-2 15V 3.3V Gate Drivers IR2214 Based 15V iso-3 15V 3.3V Hin Lin Hin Li n Hin Li n ADCin1 ; 77 ADCin2 ; 74 ADCin3 ; 72 PDPintA~ ; 6 ADCin5 ; 69 DCB mon 22kHz DC - 3.3V Comp 3.3V 3.3V DC + RS485 line driver Tx- Tx + Rx+ Rx- Opto- isolation SpiTXout SpiRXin SpiCKout Opto- isolation Opto- isolation SciTx ; 17 SciRx ; 18 SpiSOMI ; 22 QEP1 ; 57 QEP2 ; 55 Vin iso GND iso 5V iso GND iso SpiCLK ; 24 SinCos1/QE1 Homing/Direction. SinCos2/QE2 SpiSIMO ;21 IOPA2 ; 16 ADCin7 ; 66 ADCin6 ; 67 Hall1 Contactor Hall2 Hall3 - Excitation Cap3/TdirB ; 2 , 52 IOPB6-TdirA ; 11 Cap4 ; 60 Cap5 ;56 Cap6/PWM7 ; 45 , 48 Counter TCLKinB ; 89 ADCin ADCin8 ; 80 DE n.c. Latch Latch-reset~ Fault~Fault~ FaultMem~PDPintB~ ; 95 EEPROM I2C-clockIOPE3 ; 41 FaultCLR FaultCLRFaultCLR FaultCLR Gate Drivers IR2214 Based CB GB EB 15V 3.3V Pin on RS485 connector Pin on JTAG connector Module connectors FaultCLR BrakeFault~ T3PWM ; 7 BrakeFault~ FaultMem~ BrakeFault~ Fault~ Fault~ I2C-Data 3.3VIOPE4 ; 38 IOPE2 ; 43 DIV Li n Latch-reset~IOPD0 ; 15 SCI_Tx_en WatchdogWD RS~

www.irf.com 3 PIIPM15P12D007 I27179 22 - Sep Signal pins on RS485 connector Signal pins on IEEE1149.1 JTAG connector CAUTION: DO NOT APPLY DC BUS VOLTAGE WHEN JTAG INTERFACE IS CONNECTED, SEVERE DAMAGE MAY OCCUR ON POWER MODULE AND ON YOUR EQUIPMENT! Symbol Lead Description State Connector pin number PD Presence detect. Indicates that the emulation cable is connected and that the PIIPM logic is powered up. PD is tied to the DSP 3.3V supply through a 1k resistor. Output 3 Homing / Direction Homing signal / Counter direction Input 4 Start/Stop Start/Stop signal Input 5 CAN Tx CAN transmitter signal Output 6 CAN Rx CAN receiver signal Input 7 EMU1/OFF~ Emulation pin 1 I/O 8 Counter Counter signal Output 9 EMU0 Emulation pin 0 I/O 10 TRST~ JTAG test reset Input 13 Symbol Lead Description State Connector pin number Tx+ RS485 Trasmitter Non inverting Driver Output Output 1 Tx- RS485 Trasmitter Inverting Driver Output Output 2 Rx- RS485 Receiver Inverting Driver Input Input 3 Rx+ RS485 Receiver Non inverting Driver Input Input 4 SpiCKout SPI clock output (GND iso referenced) Output 5 Vin iso External 5V supply voltage for opto-couplers and line driver supply Input 6 GND iso Extenal 5V supply ground reference for opto-couplers and line driver supply Input 7 SpiTXout SPI transmitter output (GND iso referenced) Output 8 SpiRXin SPI receiver input (GND iso referenced) Input 10 SinCos1 / QE1 SinCos encoder input 1 / Quadrature encoder input 1 Input 11 SinCos2 / QE2 SinCos encoder input 2 / Quadrature encoder input 2 Input 12 Contactor General purpose I/O I/O 13 Hall1 Hall effect sensor input 1 Input 14 Hall2 Hall effect sensor input 2 Input 15 Hall3 / Excitation Hall effect sensor input 3 / Resolver excitation I/O 16 Vin External 15V supply voltage. Internally referred to DC bus minus pin (DC -) Input 17-18 COM External 15V supply ground reference. This pin is directly connected to DC - Input 19-20

www.irf.com 4 PIIPM15P12D007 I27179 22 - Sep TMS JTAG test mode select Input 14 TDO JTAG test data output Output 15 TDI JTAG test data input Input 16 TCKRET JTAG test clock return. Test clock input to the emulator. Internally short circuited to TCK. Output 17 TCK JTAG test clock. TCK is a 10MHz clock source from the emulation pod. This signal can be used to drive the system test clock. Input 18 Boot-En~ Boot ROM enable. This pin is sampled during DSP reset, pulling it low enables DSP boot ROM through SCI serial line at 40Mhz operation (Flash versions only). 47k internal pull up. Input 19 ADCin General purpose analog input Input 20 COM External 15V supply ground reference. This pin is directly connected to DC - input 1-11 Vin External 15V supply voltage. Internally referred to DC bus minus pin (DC-) Input 2-12 Following pins are intended for signal communication between driving board and power module only, though here described for completeness, they are on purpose not available to the user. Symbol Lead Description Pin number DC + DC Bus plus input signal DC - DC Bus minus input signal (internally connected to COM) Th + Thermal sensor positive input Th - Thermal sensor negative input (internally connected to COM) G1/2/3 Gate connections for high side IGBTs E1/2/3 Emitter connections for high side IGBTs (Kelvin points) R1/2/3 + Output current sensing resistor positive input (IGBTs emitters 1/2/3 side, Kelvin points) R1/2/3 - Output current sensing resistor negative input (Motor side, Kelvin points) G4/5/6 Gate connections for low side IGBTs E4/5/6 Emitter connections for low side IGBTs (Kelvin points) Gb Gate connections for brake IGBT Eb Emitter connection for brake IGBT (Kelvin point) Brk Collector connection for brake IGBT (Kelvin point) Lateral connectors on embedded driving board

www.irf.com 5 PIIPM15P12D007 I27179 22 - Sep Power Module Frame Pins Mapping IN1 IN2 IN3 OUT1 OUT2 OUT3 JTAG conn. Pin1 RS485 conn.

www.irf.com 6 PIIPM15P12D007 I27179 22 - Sep Absolute Maximum Ratings (TC=25ºC) Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to VDC-, all currents are defined positive into any lead. Thermal Resistance and Power Dissipation ratings are measured at still air conditions. Symbol Parameter Definition Min. Max. Units VDC DC Bus Voltage 0 1000 VCES Collector Emitter Voltage 0 1200 V IC @ 100C IGBTs continuous collector current (TC = 100 ºC, fig. 1) 15 IC @ 25C IGBTs continuous collector current (TC = 25 ºC,fig 1) 30 ICM Pulsed Collector Current (Fig. 3, Fig. CT.5) 60 IF @ 100C Diode Continuous Forward Current (TC = 100 ºC) 15 IF @ 25C Diode Continuous Forward Current (TC = 25 ºC) 30 IFM Diode Maximum Forward Current 60 A VGE Gate to Emitter Voltage -20 +20 V PD @ 25°C Power Dissipation (One transistor) 140 Inverter and Brake PD @ 100°C Power Dissipation (One transistor, TC = 100 ºC) 55 W VRRM repetitive peak reverse voltage (Tj = 150 ºC) 1400 VRSM non repetitive peak reverse voltage Tj = 150 ºC Irrm(max)=5mA 1500 V Io Diode Continuous Forward Current (TC = 100 ºC, 120º Rect conduction angle) 45 100% VRRM reapplied 225 IFSM One-cycle forward. Non-repetitive on state surge current (t=10ms, Initial Tj = 150ºC) No voltage reapplied 270 A 100% VRRM reapplied 253 I2t Current I2t for fusing (t=10ms, Initial Tj = 150ºC) No voltage reapplied 365 A2s Bridge I2√t Current I2√t for fusing (t=0.1 to 10ms, no voltage reapplied, Initial Tj = 150ºC) 3650 A2√s Vin Non isolated supply voltage (DC- referenced) -20 20 Vin-iso Isolated supply voltage (GND iso referenced) -5 5.5 Rx RS485 Receiver input voltage (GND iso referenced) -7 12 V TA--EDB Operating Ambient Temperature Range -25 +70 TSTG-EDB Board Storage Temperature Range -40 +125 ºC VISO-CONT R485 Input-Output Continuous Withstand Voltage (RH ≤ 50%, -40°C ≤ TA ≤ 85°C ) AC DC 800 1000 Embedded Driving Board V ISO-TEMP RS485 Input-Output Momentary Withstand Voltage (RH ≤ 50%, t = 1 min, TA = 25°C) RMS 2500 V MT Mounting Torque 3.5 Nm T J Operating Junction Temperature -40 +150 TSTG Storage Temperature Range -40 +125 ºC Power Module Vc-iso Isolation Voltage to Base Copper Plate -2500 +2500 V

www.irf.com 7 PIIPM15P12D007 I27179 22 - Sep Electrical Characteristics: Inverter and Brake For proper operation the device should be used within the recommended conditions. TJ = 25°C (unless otherwise specified) Symbol Parameter Definition Min. Typ. Max. Units Test Conditions Fig. V(BR)CES Collector To Emitter Breakdown Voltage 1200 V VGE = 0V, IC = 250µA ∆V(BR)CES / ∆T Temperature Coeff. of Breakdown Voltage +1.2 V/ºC V GE = 0V, IC = 1mA (25 - 125 ºC) 2.70 3.00 I C = 15A, VGE = 15V 5, 6 3.74 4.24 I C = 30A, VGE = 15V 7, 9 VCE(on) Collector To Emitter Saturation Voltage 3.14 3.61 V IC = 15A, VGE = 15V, TJ = 125 ºC 10, 11 VGE(th) Gate Threshold Voltage 4.68 4.89 5.30 V VCE = VGE, IC = 250µA ∆VGE(th) / ∆Tj Temp. Coeff. of Threshold Voltage -9.80 mV/ºC V CE = VGE, IC = 1mA (25 - 125 ºC) gfe Forward Trasconductance 8 9 10 S VCE = 50V, IC = 15A, PW = 80µs

125 V GE = 0V, VCE = 1200V

376 1110 VGE = 0V, VCE = 1200V, TJ = 125 ºC ICES Zero Gate Voltage Collector Current 2000 µA VGE = 0V, VCE = 1200V, TJ = 150 ºC 2.32 2.52 I C = 15A VFM Diode Forward Voltage Drop 2.47 2.64 V IC = 15A, TJ = 125 ºC IGES Gate To Emitter Leakage Current ±100 nA VGE =± 20V R1/2/3 Sensing Resistors 9.9 10 10.1 mΩ Electrical Characteristics: Bridge For proper operation the device should be used within the recommended conditions. TJ = 25°C (unless otherwise specified) Symbol Parameter Definition Min. Typ. Max. Units Test Conditions Fig. 1.24 1.76 tp = 400µs, Ipk = 30A VFM Forward Voltage Drop 1.08 1.27 V tp = 400µs, Ipk = 15A VF(TO) Threshold voltage 0.78 V TJ = 125 ºC Irm Reverse Leakage Current 5 mA TJ = 125 ºC VR = 1200V

www.irf.com 8 PIIPM15P12D007 I27179 22 - Sep Switching Characteristics: Inverter and Brake For proper operation the device should be used within the recommended conditions. TJ = 25°C (unless otherwise specified) Symbol Parameter Definition Min Typ Max Units Test Conditions Fig. Qg Total Gate Charge (turn on) 84 127 Qge Gate – Emitter Charge (turn on) 10 15 Qgc Gate – Collector Charge (turn on) 43 64 nC IC = 15A V CC = 600V V GE = 15V CT1 Eon Turn on Switching Loss 838 1207 IC = 15A, VCC = 600V, TJ = 25 ºC CT4 Eoff Turn off Switching Loss 632 900 VGE = 15V, RG =10Ω, L = 500µH WF1 Etot Total Switching Loss 1470 2107 µJ Tail and Diode Rev. Recovery included WF2 Eon Turn on Switching Loss 1154 1512 Eoff Turn off Switching Loss 933 1030 Etot Total Switching Loss 2087 2542 µJ IC = 15A, VCC = 600V, TJ = 125 ºC VGE = 15V, RG =10Ω, L = 500µH Tail and Diode Rev. Recovery included 13, CT4 WF1 WF2 td (on) Turn on delay time 98 104 14,16 Tr Rise time 14 25 IC = 15A, VCC = 600V, TJ = 125 ºC CT4 td (off) Turn off delay time 132 142 WF1 Tf Fall time 226 247 ns VGE = 15V, RG =10Ω, L = 500µH WF2 Cies Input Capacitance 1323 V CC = 30V Coes Output Capacitance 255 V GE = 0V Cres Reverse Transfer Capacitance 37 pF f = 1MHz TJ = 150 ºC, I C =60A, VGE = 15V to 0V RBSOA Reverse Bias Safe Operating Area FULL SQUARE VCC = 1000V, Vp = 1200V, RG = 5Ω CT2 TJ = 150 ºC, VGE = 15V to 0V CT3 SCSOA Short Circuit Safe Operating Area 10 µs VCC = 1000V, Vp= 1200V, RG = 5Ω WF4 EREC Diode reverse recovery energy 711 1263 µJ TJ = 125 ºC Trr Diode reverse recovery time 113 300 ns I F= 15A, VCC = 600V, Irr Peak reverse recovery current 36 41 A VGE = 15V, RG =10Ω, L = 500µH 17,18 19,20 CT4 WF3 RthJ-C_T Each IGBT to copper plate thermal resistance 0.9 ºC/W RthJ-C_D Each Diode to copper plate thermal resistance 1.54 ºC/W 25,26 RthC-H Module copper plate to heat sink thermal resistance. Silicon grease applied = 0.1mm 0.03 ºC/W See also fig. 25, 26

29 IC = 2A, VDC = 530V, fsw = 8kHz, TC = 55 ºC

42 IC = 3A, VDC = 530V, fsw = 8kHz, TC = 55 ºC

81 IC = 3A, VDC = 530V, fsw = 16kHz TC = 55 ºC,

Pdiss Total Dissipated Power W IC = 7A, VDC = 530V, fsw = 4kHz, TC = 55ºC PD1 PD2 PD3

www.irf.com 9 PIIPM15P12D007 I27179 22 - Sep Electrical Characteristics: Embedded Driving Board (EDB) communication ports For proper operation the device should be used within the recommended conditions. Vin = 15V, Vin-iso = 5V, TA = 0 to 55°C, TC = 75°C (unless otherwise specified) Symbol Parameter Definition Min. Typ. Max. Units Test Conditions Type Conn. Vin EDB Input supply Voltage 12 15 18 V Isupp EDB Input Supply Current 150 250 mA V DC = 600V, fPWM = 16kHz Non isolated Suppy Vin iso EDB isolated supply voltage 4.5 5 5.5 V Iq. iso EDB isolated quiescent supply current 9 15 mA Rx+ = +5V, Rx- = 0V SPIRxIn open 10 15 22 mA SPIRxIn low Rx+ = 0V, Rx- = +5V Tx+ and Tx- open Isupp. iso EDB isolated supply current 50 55 62 mA SPIRxIn low Rx+ = 0V, Rx- = +5V Tx+ and Tx- on 120Ω Isolated supply VDO-TX Differential Driver Output Voltage 2 V VCO-TX Driver Common mode output voltage 3 V Rload = 120 Ω VDI-RX Receiver Input Differential Threshold Voltage - 0.2 0.2 V RIN-RX Receiver Input Resistance 120 Ω - 7V ≤ VCM ≤ +12V fMAX RS485 maximum data rate 2.5 Mbps RS485 port Logic High Input Voltage 3.8 V Logic Low Input Voltage 1.0 V SpiRxIn Logic Low Input Current -5 mA 0,8 V Iout = -510µA Logic Low Output Voltage 1,2 V Iout = -1,2mA SpiTxOut SpiCkOut Logic High Output Voltage 2.4 V Iout = 3mA SPI port RS485 TMS,TDI,TDO TCK,TRST- EMU0 EMU1/OFF~ PD JTAG interface pins (CAUTION: DO NOT APPLY DC BUS VOLTAGE WHEN JTAG INTERFACE IS CONNECTED, SEVER DAMAGE MAY OCCUR ON POWER MODULE AND ON YOUR EQUIPMENT!) Please see TMS320LF2406A datasheet from Texas Instruments and V PD specifications Directly connected from DSP to connector pins. EMU0 and EMU1 with 4.7k internal pull up. JTAG VPD Presence detect voltage 3.2 3.3 3.4 V IPD = -100µA JTAG VBoot En~ Boot ROM enable input voltage 0.5 V IBoot-En~ Boot ROM enable input current - 100 µA Active low JTAG Logic Low Output Voltage 0.8 V Iout = - 780µA CAN Tx Logic High Output Voltage 2.4 V Iout = 860µA Logic Low Input Voltage 0.8 V CAN Rx Logic High Input Voltage 2.4 V CAN port JTAG ~ indicates active low signals

www.irf.com 10 PIIPM15P12D007 I27179 22 - Sep DSP pins mapping For proper operation the device should be used within the recommended conditions. Vin = 15V, Vin-iso = 5V, TA = 0 to 55°C, TC = 75°C (unless otherwise specified) Symbol Parameter Definition Min. Typ. Max. Units Test Conditions DSP name; pin N VDCgain DC bus voltage feedback partition coefficient 2.39 2.44 2.49 mV/V VDCpole DC bus voltage feedback second order filter - 22 - kHz ADCIN03 ; 72 VDC-OVth DC bus voltage over-voltage threshold 870 920 970 V PDPINTA~ ; 6 VTH25C Thermal sensor voltage feedback at 25 ºC (Fig. TF1) 2.65 2.75 2.85 V VTH100C Thermal sensor voltage feedback at 100 ºC (Fig. TF1) 1.04 1.09 1.14 V ADCIN04 ; 70 Vin-gain Input voltage feedback partition coefficient 125 128 131 mV/V Vin-pole Input voltage feedback filter pole 1600 1700 1800 Hz ADCIN05 ; 69 Iph-GAIN Current feedback gain 78 80 82 mV/A Iph-pole Current feedback filter pole 9.8 10.9 12 kHz Iph-LAT Current feedback signal delay 5 µs Iph-Zero Zero current input voltage level 1.62 1.65 1.68 V all two phases ADCIN01: 77 ADCIN02: 74 Vce_sc Vce Short Circuit Threshold detection 7.4 V ISC-DEL Short Circuit detection delay time 3 6 µs all phases PDPINTA~ ; 6 WD External watchdog timeout (see also RS~ signal), please see WD internal signal for more details 0.9 Sec IOPC1 ; 85 Generic purpose analog Input 0 3.3 V ADCin Generic purpose analog input filter pole 4.13 kHz ADCIN08 ; 80 Analog input 1 for sincos resolver 0 3.3 V Analog input for sincos resolver filter pole 4.13 kHz ADCIN06 ; 67 High level threshold 2,4 V SinCos1/QE1 QEP1: internal digital signal of QE1 Low level threshold 1 V See also QEP1 internal signal QEP1 ; 57 Analog input 2 for sincos resolver 0 3.3 V Analog input for sincos resolver filter pole 4.13 kHz ADCIN07;66 High level threshold 2,4 V SinCos2/QE2 QEP2: internal digital signal of QE2 Low level threshold 1 V See also QEP2 internal signal QEP2 ; 55 COM DSP Ground 3, 5, 13, 14, 19, 26, 27, 29, 32, 34, 46, 53,55, 58, 63, 65, 68, 71, 73, 75, 76, 78,79, 81, 84, 90, 97 3.3V DSP 3.3V supply 4, 10, 20, 30, 35, 47, 54, 59, 64, 91, 98 Floating Not connected to anything 12, 23, 88, 25, 42, 44, 51 ~ indicates active low signals

www.irf.com 11 PIIPM15P12D007 I27179 22 - Sep Other DSP pins mapping to the connector Symbol Signal Definition DSP name ; pin N Comments Connector Hall1 Hall effect sensor input 1 CAP4/QEP3/IOPE7 ; 60 Digital Input. See elec. characteristic of I/O pins Hall2 Hall effect sensor input 2 CAP5/QEP4/IOPF0 ; 56 Digital Input. See elec. characteristic of I/O pins Hall3 / Excitation Hall effect sensor input 3 / Resolver excitation PWM7/IOPE1, CAP6/IOPF1 ; 45, 48 Digital I/O, Output is type G3. See electrical characteristics of I/O pins Contactor General purpose I/O IOPB6 ; 11 Digital I/O, Output is type G3. See electrical characteristics of I/O pins RS485 CAN Tx CAN transmit data CANTX ; 50 Not isolated CAN Rx CAN receive data CANRX ; 49 Not isolated Homing/Direction Homing signal/ Counter direction TDIRB/IOPF4, CAP3/IOPA5 ;2, 52 Avoid electrical conflicts beetwen these two pins Start/Stop Start/Stop signal IOPF6 ; 92 Digital Input. See elec. Characteristic of I/O pins Boot En~ Boot ROM enable signal BOOT_EN~ ; 86 See also EDB electrical characteristics Counter Counter signal TCLKINB ; 89 Digital Input. See elec. Characteristics of I/O pins JTAG These signals are internal only Symbol Signal Definition DSP name ; pin N Comments PWM1 Out 1 high side IGBT gate drive signal PWM1; 39 DSP Event Manager A output PWM2 Out 1 low side IGBT gate drive signal PWM2 ; 37 DSP Event Manager A output PWM3 Out 2 high side IGBT gate drive signal PWM3 ; 36 DSP Event Manager A output PWM4 Out 2 low side IGBT gate drive signal PWM4 ; 33 DSP Event Manager A output PWM5 Out 3 high side IGBT gate drive signal PWM5 ; 31 DSP Event Manager A output PWM6 Out 3 low side IGBT gate drive signal PWM6 ; 28 DSP Event Manager A output Brake Brake IGBT gate drive signal T3PWM ; 7 DSP Event Manager B output SpiTXout SpiTx output SPISIMO ; 21 SpiRXout SpiRx input SPISOMI ; 22 SpiCKout SpiClk output SPICLK ; 24 These signal are optically isolated. See also EDB electrical characteristics Ref3.3V 3.3V reference voltage VREFHI, VCCA ; 82, 83 3.3V reference and supply voltage for ADC converter 5V supp. Flash programming voltage pin VCCP ; 40 Supplied by the embedded flyback regulator Tx SCI transmit data SCITXD ; 17 Drives Tx+ and Tx- through the opto-isolator and the line driver Rx SCI receive data SCIRXD ; 18 Driven by Rx+ and Rx- through the opto-isolator and the line driver SCI_Tx_en SCI transmitter enable IOPA2 ; 16 Enable the SCI line driver through an opto-isolator Latch-reset~ System general fault output reset signal IOPD0 ; 15 LFAULT Reset signal, to be activated via software after a fault or system boot, active low FaultCLR Gate driver fault output reset signal IOPE3 ; 41 Gate driver reset, to be activated via software after a short-circuit or system boot

www.irf.com 12 PIIPM15P12D007 I27179 22 - Sep RS~ DSP reset input signal (see also WD signal) RS~ ; 93 Forces a DSP reset if WD signal holds too long (see also EDB electrical char.) Xtal1 PLL oscillator input pin XTAL1 ; 87 A 10Mhz oscillator at 100ppm frequency stability feeds this pin. PLLF1 PLL filter input 1 PFFL ; 9 PLL filter for 40Mhz DSP clock frequency PLLF2 PLL filter input 2 PLLF2 ; 8 PLL filter for 40Mhz DSP clock frequency FaultMem~ System general fault input PDPINTA~ ; 6 Activated by short circuits on output phases or brake IGBTand by DC bus over-voltage comparator. Latched signal, see also Latch-reset BrakeFault~ Brake Protection Interrupt signal PDPINTB~ ; 95 Activated by short circuits on brake QEP1 Square wave of SinCos1/QE1 QEP1 ; 57 Internal Schmitt trigger, see also AC electrical characteristic QEP2 Square wave of SinCos2/QE2 QEP2 ; 55 Internal Schmitt trigger, see also AC electrical characteristic WD = high impedance, external watchdog is disabled WD Output signal for external watchdog IOPC1 ; 85 WD = high or WD = low, external watchdog is enabled and WD has to be periodically triggered by positive or negative transition. When the supervising system fails to retrigger the ext. watchdog within the time shown on AC electrical Characteristics, RS~ signal becomes active. ~ indicates active low signals 64kbits I2C EEprom (please see Microchip 24LC4 for more specifications) Symbol Signal Definition DSP name ; pin N Comments I2C - Clock I 2C - Clock IOPE2 ; 43 Connected to the I 2C EEPROM I2C - Data I 2C - Clock IOPE4 ; 38 Connected to the I 2C EEPROM Electrical characteristic of digital inputs and outputs. Symbol Parameter Definition Min. Typ. Max. Units Test Conditions Input: VIH Logic high,generic input voltage 2.4 V Input: VIL Logic low, generic input voltage 0.8 V Output Type G1(*) VOH 2.4 V Iout = 700µA VOL 0.8 V Iout = - 700µΑ Output Type G2(*) VOH 2.4 V Iout = 850 µΑ VOL 0.8 V Iout = - 850 µΑ Output Type G3(*) VOH 2.4 V Iout = 950 µA VOL 0.8 V Iout = -950 µΑ (*) Please refer to TMS320LF2406A datasheet from Texas Instruments for more specifications.

www.irf.com 13 PIIPM15P12D007 I27179 22 - Sep Fig. 1 – Maximum DC collector Current vs. case temperature Fig. 2 – Power Dissipation vs. Case Temperature TC = (ºC) T C = (ºC) Fig. 3 – Forward SOA TC = 25ºC; Tj ≤ 150ºC Fig. 4 – Reverse Bias SOA Tj = 150ºC, VGE = 15V VCE = (V) V CE = (V)

www.irf.com 14 PIIPM15P12D007 I27179 22 - Sep Fig. 5 – Typical IGBT Output Characteristics Tj = - 40ºC; tp = 300µs Fig. 6 – Typical IGBT Output Characteristics Tj = 25ºC; tp = 300µs VCE = (V) V CE = (V) Fig. 7 – Typical IGBT Output Characteristics Tj = 125ºC; tp = 300µs Fig. 8 – Typical Diode Forward Characteristics tp = 300µs VCE = (V) V F = (V)

www.irf.com 15 PIIPM15P12D007 I27179 22 - Sep Fig. 9 – Typical VCE vs. VGE Tj = - 40ºC Fig. 10 – Typical V CE vs. VGE Tj = 25ºC VGE = (V) V GE = (V) Fig. 11 – Typical VCE vs. VGE Tj = 125ºC Fig. 12 – Typical Transfer Characteristics VCE = 20V; tp = 20µs VGE = (V) V GE = (V)

www.irf.com 16 PIIPM15P12D007 I27179 22 - Sep Fig. 13 – Typical Energy Loss vs. IC Tj = 125ºC; L = 500µH; VCE = 600V; Rg = 10Ω; VGE = 15V Fig. 14 – Typical Switching Time vs. IC Tj = 125ºC; L = 500µH; VCE = 600V; Rg = 10Ω; VGE = 15V IC = (A) I C = (A) Fig. 15 – Typical Energy Loss vs. Rg Tj = 125ºC; L = 500µH; VCE = 600V; ICE = 15A; VGE = 15V Fig. 16 – Typical Switching Time vs. Rg Tj = 125ºC; L = 500µH; VCE = 600V; ICE = 15A; VGE = 15V Rg = (Ω) Rg = (Ω)

www.irf.com 17 PIIPM15P12D007 I27179 22 - Sep Fig. 17 – Typical Diode IRR vs. IF Tj = 125ºC Fig. 18 – Typical Diode IRR vs. Rg IF = 15A; Tj = 125ºC IF = (A) Rg = (Ω) Fig. 19 – Typical Diode IRR vs. dIF/dt VDC = 600V; VGE = 15V; IF = 15A; Tj = 125ºC Fig. 20 – Typical Diode Q RR VDC = 600V; VGE = 15V; Tj = 125ºC dIF/dt (A/µs) dIF/dt (A/µs)

www.irf.com 18 PIIPM15P12D007 I27179 22 - Sep Fig. 21 – Typical Diode EREC vs. IF Tj = 125ºC Fig. 22 – Typical Capacitance vs. VCE VGE = 0V; f = 1MHz IF = (A) V CE = (V) Fig. 23 – Typical Gate Charge vs. VGE IC = 15A; L = 600µH; VCC = 600V Fig. 24 – On state Voltage Drop characteristic VFM vs IF tp = 400µs QG = (nC) V FM = (V)

www.irf.com 19 PIIPM15P12D007 I27179 22 - Sep Fig. 25 – Normalized Transient Thermal Impedance, Junction-to-copper plate (IGBTs) t1, Rectangular Pulse Duration (sec) Fig. 26 – Normalized Transient Impedance, Junction-to-copper plate (FRED diodes) t1, Rectangular Pulse Duration (sec)

www.irf.com 20 PIIPM15P12D007 I27179 22 - Sep

www.irf.com 21 PIIPM15P12D007 I27179 22 - Sep

www.irf.com 22 PIIPM15P12D007 I27179 22 - Sep Fig. PD1 – Total Dissipated Power vs. fSW IoutRMS = 2A, VDC = 530V, TC = 55ºC Fig. PD2 – Total Dissipated Power vs. fSW IoutRMS = 3A, VDC = 530V, TC = 55ºC 120 0 4 8 12 16 20 120 048 1 2 1 6 2 0 fSW = (kHz) fSW = (kHz) Fig. PD3 – Total Dissipated Power vs. fSW IoutRMS = 7A, VDC = 530V, TC = 55ºC Fig. TF1 – Thermal Sensor Voltage Feedback vs. Base-plate Temperature fSW = (kHz) TC (ºC)

www.irf.com 23 PIIPM15P12D007 I27179 22 - Sep PIIPM family part number identification

www.irf.com 24 PIIPM15P12D007 I27179 22 - Sep Top board suggested footprint (top view) RS485 and JTAG Connectors Top view These connectors do not have any orientation tag; please check their Pin 1 position on Power Module Frame Pins Mapping before inserting mate part. Molex 53916-0204 mates with 54167-0208 or 52991-0208

www.irf.com 25 PIIPM15P12D007 I27179 22 - Sep PIIPM15P12D007 case outline and dimensions Data and specifications subject to change without notice This product has been designed and qualified for Industrial Level. Qualification Standards can be found on IR’s Web Site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 3252 7105 TAC Fax: (310) 252 7309 Visit us at www.irf.com for sales contact information 22 - Sep Data and specifications subject to change without notice. Sales Offices, Agents and Distributors in Major Cities Throughout the World. © 2003 International Rectifier - Printed in Italy 09 - 22 - Rev. 3.1