PID-251M TDK | Alldatasheet
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TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. SMT power inductors PID differential mode inductors Series/Type: PID*-251M Date: September 2022
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Rated inductance 2 x 250 µH Construction Ferrite core Magnetically shielded Winding enamel copper wire Winding welded to terminals
Features
Temperature range up to +150 °C High rated current Low DC resistance Functional isolation up to 500 V Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020E RoHS-compatible
Applications
Industrial electronics Power over Data Line (PoDL) for 10BASE-T1L (IEEE 802.3 cg) Differential mode choke Terminals Base material CuSn6P Lead-finish Sn (lead-free) Electro-plated Marking Marking on component: PID75-251M and PID100-251M: Code letter “D”, L value (in µH), date of manufacture (YWWD), dot for Pin 1 identification PID120L-251M and PID120H-251M: Product series, code letter “D”, L value (in µH), date of manufacture (YWWD), two last digits of production order, dot for Pin 1 identification PID150H-251M: Code letter “D”, L value (in µH), date of manufacture (YWWD), dot for Pin 1 identification Delivery mode and packing units Blister tape, wound on 330-mm Ø reel – 16-mm blister tape for PID75-251M – 24-mm blister tape for PID100-251M, PID120L-251M, PID120H-251M – 32-mm blister tape for PID150H-251M Packing unit: – 1000 pcs./reel for PID75-251M – 600 pcs./reel for PID100-251M – 350 pcs./reel for PID120L-251M – 250 pcs./reel for PID120H-251M – 175 pcs./reel for PID150H-251M
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Dimensional drawing Layout recommendation Circuit diagram Dimensions in mm Ordering code A B C Ordering code E F H Dimensions in mm Ordering code I J K L PID75-251M 2.1 2.8 3.3 1.1 PID100-251M 2.4 4.5 5.7 1.7 PID120L-251M 3.1 5.8 6.8 2.3 PID120H-251M 3.1 5.8 6.8 2.3 PID150H-251M 4.15 6.6 7.4 2.55
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Taping and packing PID75-251M PID100-251M PID120L-251M Blister tape Reel Blister tape Reel Blister tape Reel
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors PID120H-251M PID150H-251M Blister tape Reel Blister tape Reel
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Technical data and measuring conditions Rated inductance L1, L2 Measured with LCR meter Agilent 4284A (or equivalent) at frequency fL, 0.1 V, 23 °C, 250 µH per winding Tolerance 20% Inductance LPoDL Typ. 1000 µH, equivalent inductance when both windings are connected in series (measured in 1-4 with 2-3 shorted) Operating temperature range –40 °C to +150 °C (self-rise temperature included) Rated current IR Max. typ. permissible DC with temperature increase of ≤40 K Method as per IEC62024-2, when both windings are connected in series (measured in 1-4 with 2-3 shorted) Saturation current ISat DC with inductance decrease L/L0 of approx. 30%, when both windings are connected in series (measured in 1-4 with 2-3 shorted), typical values DC resistance R1,R2, (max.) Measured at +23 °C, is specified per winding Isolation (functional) Tested with 500 V, 0.4 s by 100%; 3 s during qualification Solderability (lead-free) Dip and look method, Wetting of soldering area ≥95% as referenced in EIA/IPC/JEDEC J-STD-002E Resistance to soldering heat as referenced in JEDEC J-STD-020E Climatic category 40/150/56 (to IEC 60068-1) Storage conditions Mounted: –40 °C … +150 °C Packaged: –25 °C … +40 °C, ≤75% RH Weight Approx. 0.9 g for PID75-251M Approx. 2.5 g for PID100-251M Approx. 4.2 g for PID120L-251M Approx. 5.0 g for PID120H-251M Approx. 10.5 g for PID150H-251M
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Characteristics and ordering codes Size IEEE 802.3 cg Power class RDC,typ ISat,typ IR,typ (ambient temp.) Internal code Ordering code mm mA mA 7.5 x 7.5 x 4.8 10 2.25 360 270 (+25 °C) 250 (+85 °C) 240 (+105 °C) B82472E6254M000 PID75-251M 10.4 x 10.4 x 6.3 11, 13 1.13 645 460 (+25 °C) 410 (+85 °C) 400 (+105 °C) B82464E6254M000 PID100-251M 12.5 x 12.5 x 8.5 11, 13, 14 0.65 910 650 (+25 °C) 530 (+85 °C) 500 (+105 °C) B82477E4254M000 PID120L-251M 12.5 x 12.5 x 10.5 13, 14 0.41 1160 820 (+25 °C) 675 (+85 °C) 635 (+105 °C) B82477E6254M000 PID120H-251M 15.5 x 15.5 x 14.5 12, 14 0.27 1200 1200 (+25 °C) 1070 (+85 °C) 1040 (+105 °C) B82480E8254M000 PID150H-251M
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Inductance versus IDC (typical values, series L) PID75-251M PID100-251M PID120L-251M PID120H-251M
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors PID150H-251M
Please read Cautions and warnings and Important notes at the end of this document. SMT power inductors PID*-251M PID differential mode inductors Cautions and warnings Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire, wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. – Many coating materials have a negative effect (chemically and mechanically) on the winding wires, insulation materials and connecting points. Customers are always obligated to determine whether and to what extent their coating materials influence the component. Customers are responsible and bear all risk for the use of the coating material. TDK Electronics does not assume any liability for failures of our components that are caused by the coating material. Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Due to product design and applied manufacturing process, appearance, symmetry, and shape of not dimensioned details could vary within same lot, as well discoloration of housing is possible. TDK does not expect detrimental effects on product function or reliability. In case of conflicts, TDK reference standard shall prevail. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical require- ments that are often placed on our products in the areas of application concerned. We never - theless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the cus- tomers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or fail- ure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the mal - function or failure of an electronic component could endanger human life or health (e.g. in acci- dent prevention or life-saving systems), it must therefore be ensured by means of suitable de - sign of the customer application or other action taken by the customer (e.g. installation of pro - tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this pub- lication may contain substances subject to restrictions in certain jurisdictions (e.g. be - cause they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequent- ly, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply.
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