PI3EUSB1100
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 21
Technical content
Features
y Low Skew Outputs: <80ps y Compliant with the Latest USB 2.0 Specification y Compliant with Embedded USB 2.0 (eUSB2) Physical Layer Specification Rev. 1.2 y Dual Role Capable y Integrated and Configurable Pull-Down Resistors on Both eUSB2 and USB 2.0 Ends y Integrated and Configurable Pull-Up Resistors on USB 2.0 Port y Supports All USB 2.0 Speed Modes through Speed Detection and Negotiation à High Speed Operation (480Mb/s) à Full Speed Operation (12Mb/s) à Low Speed Operation (1.5Mb/s) y Auto Resume (remote wake-up) y Asynchronous Wake-Up y Provides Bus-Keeper Function for Device Wake-Up at Host Mode y Supports 1.8V I2C I/O y Supports x4 I2C ID Address y ESD Performance à HBM All Pins +/-8KV à CDM All Pins +/-1KV à Contact Discharge (IEC61000-4-2) for USB 2.0 D+/- +/-8KV y Low Power Consumption à Typical = 87mW Nominal Power during HS USB 2.0/eUSB2 Communication y Analog Trimming à Tx Amplitude Adjusts à Tx EQ Adjusts à Tx Drive Strength Adjusts à Rx Sensitivity Tuning y Charger Compliance à Ability to Keep D+/D- Lines in Hi-Z for APSD y Chirp Levels à Chirp J Differential Voltage (VCHIRPJ) is +700 to +1100 mV à Chirp K Differential Voltage (VCHIRPK) is -900 to -500 mV y Squelch Detectors on Both eUSB2 and USB 2.0 Ports y Configurable HS Disconnect Detector at USB 2.0 Port y De-Glitch of ≥100ns on RST_N y Reserve Current on USB2 DP/DN Pins y Ambient Temperature: -40°C to 85°C y Packaging (Pb-free & Green): à 12-ball, WLCSP (GH) 1.65mm x 1.22mm x 0.35mm pitch y Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) y Halogen and Antimony Free. “Green” Device (Note 3) y For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ MUX MUX VDD_3p0 VDD_1p8 State Machine & HS/FS/LS Detection D+/- eD+/- RST_N/I2C LS/FS/HS Tx/Rx PI3eUSB1100 Block Diagram Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Not Recommended for New Design - Use PI3EUSB1100S
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com DGND VDD_1P8 I2C_ADD 1 2 3 A B C D VDD_3P0 e_D+ D+ e_D- RST_N D- AGND SDA SCL Pin Number Pin Name Signa l Ty pe Description D1 DGND Ground Digital ground D2 VDD_1P8 Power 1.8V supply for analog circuitry D3 VDD_3P0 Power 3.3V supply for analog circuitry C1 e_D+ Analog eUSB2 Positive signals C2 I2C_ADD Digital Input I2C address setup. Refer to Table 2. VDD: 1.8V C3 D+ Analog USB 2.0 Positive signals B1 e_D- Analog eUSB2 Negative signals B2 RST_N Digital Input Active low reset with internal 20k pulled to 1.8V. When tied to low, disable 20k resistor B3 D- Analog USB 2.0 Negative signals A1 AGND Ground Analog ground A2 SDA Digital I/O I2C data pin; TX/RX EQ initial setting A3 SCL Digital Input I2C clock pin; TX/RX EQ initial setting Pin Configuration Pin Description
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com USB 2.0 Hi-Z During Reset The eUSB2 repeater will often be used in a system where the USB 2.0 D+/D- lines will be connected both externally (to a device, or charger, say) and internally to another ASIC in the system. In such cases there is often a period of time where the USB 2.0 device and system ASIC will communicate to each other over the D+/D- lines. Because of this, the D+/D- lines must always be held in a high impedance (Hi-Z) state until RST_N is de-asserted, even while all supplies are actively enabled to the repeater. Figure 1. System Connectivity Example of eUSB2 Repeater sponds, which may mean that the peripheral will not behave as intended once the host enters resume and it will instead go back to L2.
- While in L2, the device wants to wake up the host, so it asserts the K state using D+/D-.
- When the eUSB2 repeater sees the K state, it drives eD-High (bold line depicts eUSB2 repeater driving line state).
- When the host sees eD-go high, it changes to K state and begins Wake.
- When the host leaves the Wake state, it drives eD+High for the start of resume pulse (3a), at which time the eUSB2 repeater will
release control of eD- (3b).
- When the host TxData has changed and is valid in the SE0 state, it drives eD-/eD+ appropriately, which causes the eUSB2 repeater
to drive a SE0 on the D+/D- lines and put the USB device back into L0. driven in the K state until the host drives eD+High (happens after TxValid goes back Low at the End of Resume (EOR)).
Application Information
© 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 2. Auto Resume Signaling (Peripheral Initiated) in Host Repeater Mode Another auto resume case is where the SoC is the peripheral and has the eUSB2 repeater attached, and the host initiates the resume. This is depicted in below in Figure 3. In this case, the host internal line state will transition from J to K and the host will drive D+/D- to the K state (arrow 1 in Figure 3).
© 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 3. Auto Resume Signaling (Host Initiated) in Peripheral Repeater Mode must have a mechanism for the repeater to respond to the Resume K signal asynchronously, or without the clock active. This is shown in Figure 4. The USB 2.0 device will attempt to come out of L2 suspend by toggling the D+/D- lines from ‘J’ to ‘K’ state. mal resume protocol (as described in more detail above) by driving eD-High so that the eUSB2 PHY in the SoC can respond.
© 2026 Copyright Diodes Incorporated. All Rights Reserved. the eUSB2 bus (eD+ and eD- pins) and protects the SoC from potential damage and ensure system reliability. cal). During this state, the circuit limits current flow and protects the internal transceiver and associated components from damage. may result in a temporary loss of communication between the SoC host and the USB device.
- Issue a USB Bus Reset (CM Reset): Initiates a re-enumeration sequence on the USB bus.
- Perform a Port Reset: Resets the local ReDriver and toggles VBUS to re-initialize the connection and resume normal data transmis- sion.
Figure 4. Asynchronous Wake-up Waveforms
© 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 3. TX/RX EQ Initial Setting Note: When SCL and SDA are connected to I2C interface, please pull-up. Table 2. I2C Address Selection Table test modes. The precise detail for each of these register settings will be provided in future releases of this document. I2C_ADD pin is for I2C ID address setting, please direct connect to VDD (1.8V) or GND. Table 1. Number of Hubs Supported with Host and/or Peripheral Repeater Deep standby mode, RST_N could be used as a power down pin when asserted low, that will put device in lowest power mode. Figure 5. EQ0 and EQ1 Strapping Pin Latched In Waveform
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com I2C Data Transfer SDA and SCL I/O for I2C-Bus VCC = 1.71 to 1.89V Symbol Parameter Test Conditions Min. Max. Units VIH DC input logic high 1.3 3.6 V VIL DC input logic low –0.3 0.6 V VOL DC output logic low IOL = 3mA 0.4 V Vhys Hysteresis of Schmitt trigger input 0.05*VCC V tof Output fall time from V IHmin to VILmax with bus cap. 10-400pF 250 ns fsCLK SCLK clock frequency 1000 kHz
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 0: Mode Force Control 0 Bit Name Type Control Function Default
7 D+ line state R
D+ line indicate 3V CMOS level 0b: normal operation 1b: pull high >3V. Real time during LS/FS toggling
6 RESET RW 0b: normal operation
1b: same behavior as RST_N pin 0 5 D+ bit 1.5K enable RW 0b: D+ 1.5k disable 1b: D+ 1.5k pull high 0 4 Force D+ 1.5K engage RW 0b: normal operation 1b: determines bit5 D+ bit 1.5k engage 0
3 SLEEP_FUN_BIT RW
0b: normal operation 1b: lowest power possible and cannot be waked by USB2/ eUSB2 ports
2 USB_HI_Z RW 0b: normal operation
1b: D+/D- HIZ 0
1 Reserved RW For internal usage 0
0 I2C_DISC_DET RW 0b: normal operation
1b: enable TX EQ after 30 HS bit of uSOF's EOP 0 I2C Table
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 1: USB2 TX EQ Control 1 Bit Name Type Control Function Default USB2_bias [1:0] RW Inside current bias for RX/TX-prebuffer LSFS buffer and HS detect buffer 00b: 50uA 01b: 45uA 10b: 55uA 11b: 60uA 00b
5 Reserved RW For internal usage 0
4 Reserved RW For internal usage 0
3 Reserved RW For internal usage 0
USB2_TX_EQ [2:0] RW D+/D- TX HS EQ 000b: 0.0dB (no EQ) 001b: 0.5dB 010b: 1.0dB 011b: 1.5dB 100b: 2.0dB 101b: 3.0dB 110b: 4.5dB 111b: 6.0dB The settings of USB2_TX_EQ [2:0] (Byte 1), USB2_TX_ SWING [7:0] (Byte 6) and USB2_discon [2:0] registers may affect each other. Please see details and follow the guidelines in the application note. 000b1
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 2: eUSB2 TX EQ Output Current Control 2 Bit Name Type Control Function Default eUSB2_TX_SWING [2:0] RW eUSB2 TX output amplitude 000b: 200mv 001b: -10mv (190mv) 010b: +10mv (210mv) 011b: +20mv (220mv) 100b: +30mv (230mv) 101b: +40mv (240mv) 110b: +60mv (260mv) 111b: +80mv (280mv) 000b6
4 RST_N PULL_HIGH RW 0b: enable 20K/2M pull up
1b: disalbe 20K/2M pull high 0
3 RST_N PULL_DOWN RW 0b: disable 100K pull down
1b: enalbe 100K pull down 0
2 BUS_KEPPER [0] RW
Bus keeper [0] Bus_keeper[1:0] 00b: Hold bus at both of eUSB and USB 01b: Hold bus only at eUSB 10b: No bus keeper function 11b: reserved and should not be used eUSB2_TX_EQ [1:0] RW eD+/eD- TX HS EQ 00b: 0.0dB (no EQ) 01b: 0.5dB 10b: 1.0dB 11b: 1.5dB 00b
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 3: USB2 RX EQ Control 3 Bit Name Type Control Function Default USB2_Rup [1:0] RW USB2 LS/FS output pull high resistor 00b: 0% (36Ω) 01b: -20% (29Ω) 10b: -20% (29Ω) 11b: 0% (36Ω) 00b USB2_RX_RQ RW USB2 RX EQ 0x0: 0.0dB (no EQ) 0x1: 0.5dB 0x2: 1.0dB 0x4: 2.0dB 0x8: 3.0dB others: reserved and should not be used. 0x0 Byte 4: eUSB2 RX EQ + Squelch Swing Selection Control 4 Bit Name Type Control Function Default eUSB2_squelch [2:0] RW eUSB2 squelch detection threshold 000b: 70mv 001b: -10mv (60mv) 010b: -20mv (50mv) 011b: -30mv (40mv) 100b: +10mv (80mv) 101b: +20mv (90mv) 110b: +30mv (100mv) 111b: +30mv (100mv)
4 BUS_KEPPER [1] RW
Bus keeper [1] Bus_Keeper[1:0] 00b: Hold bus at both of eUSB and USB 01b: Hold bus only at eUSB 10b: No bus keeper function 11b: reserved and should not be used eUSB2_RX_EQ [3:0] RW eUSB2 RX EQ 0x0: 0.0dB (no EQ) 0x1: 0.5dB 0x2: 1.0dB 0x4: 2.0dB 0x8: 3.0dB others: reserved and should not be used. 0x0
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 5: USB2 Squelch Detection Offset Control 5 Bit Name Type Control Function Default
7 REPEATER_REG [ 16] RW
For digital EOP filter control 0b: disable filter 1b: enable filter
6 CHIRP_KJ_TEST RW 1b: force into CHIRP test for High speed 0
USB2_squelch [5:0] RW USB2 RX squelch detection threshold 0x00: 110mv 0x01: -50mv (60mv) 0x02: -40mv (70mv) 0x04: -30mv (80mv) 0x08: -20mv (90mv) 0x10: -10mv (100mv) 0x20: +10mv (120mv) others: reserved and should not be used. 0x00 Byte 6: USB2 TX Output Swing Control 6 Bit Name Type Control Function Default USB2_TX_SWING [7:0] RW USB2 TX output swing 0x00: 400mv 0x01: -50mv (350mv) 0x02: -25mv (375mv) 0x04: +25mv (425mv) 0x08: +50mv (450mv) 0x10: +75mv (475mv) 0x20: +100mv (500mv) 0x40: +125mv (525mv) 0x80: +175mv (575mv) others: reserved and should not be used. The settings of USB2_TX_EQ [2:0] (Byte 1), USB2_TX_ SWING [7:0] (Byte 6) and USB2_discon [2:0] registers may affect each other. Please see details and follow the guidelines in the application note. 0x00
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Byte 7: USB2 FS Output Res + Disconnection Detection Swing Setting Control 7 Bit Name Type Control Function Default
7 Reserved RW For internal usage 0
USB2_discon [2:0] RW USB2 disconnect threshold voltage 000b: 575mv 001b: -50mv (525mv) 010b: -25mv (550mv) 011b: +25mv (600mv) 100b: +50mv (625mv) 101b: +100mv (675mv) 110b: +175mv (750mv) 111b: +250mv (825mv) The settings of USB2_TX_EQ [2:0] (Byte 1), USB2_TX_ SWING [7:0] (Byte 6) and USB2_discon [2:0] registers may affect each other. Please see details and follow the guidelines in the application note. 000b5 USB2_Rdn [3:0] RW USB2 LS/FS/HS output pull low resistor 0x0: 45Ω 0x1: -10% 0x2: -5% 0x4: +5% 0x8: +10% others: reserved and should not be used. 0x0 Byte 8 – Byte 19: Reserved for Factory Control Byte 20: Revision ID, RO Bits Bit Name Type Control Function Default 7:0 Revision ID RO revision id 0x03 Byte 21: Device ID, Low Byte, RO Bits Bit Name Type Control Function Default 7:0 Device ID [7:0] RO device id low word 0x00 Byte 22: Device ID, High Byte, RO Bits Bit Name Type Control Function Default 7:0 Device ID [15:8] RO device id high word 0x11
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. (Above which useful life may be impaired. For user guidelines, not tested.) Parameter Description Test Conditions Min. Ty p. Max. Units VDD_3P0 USB 2.0 analog voltage 3.0 3.3 3.6 V VDD_1P8 Analog supply voltage 1.71 1.8 1.89 V VIL Input voltage Low VDD18 = 1.8V, RST_N 0.54 V VIH Input voltage High VDD18 = 1.8V, RST_N 1.26 V IIL Low level input current VDD33 = 3.3V or 0, VDD18 = 1.8V or 0, VIL = 0 for SDA/SCL 2 uA IIH High level input current VDD33 = 3.3V or 0, VDD18 = 1.8V or 0, VIH = 3.3V for SDA/ SCL 2 uA IIL Low level input current VDD33 = 3.3V, VDD18 = 1.8V, VIL = 0 for RST_N 2 uA IIH High level input current VDD33 = 3.3V, VDD18 = 1.8V, VIH = 1.8V for RST_N 2 uA Pstby Deep standby mode Repeater powered, in reset. I2C_ADD = GND or 1.8V 80 uW PDET Detach power Repeater powered, connected to eUSB PHY and waiting to attach 131 uW PL2S L2 sleep power Link in L2, waiting for wake event 131 uW PL1S L1 sleep power USB link in L1, waiting for L1 exit event 131 uW PLSA LS active power Repeater in LS mode 6.6 mW PFSA FS active power Repeater in FS mode 13.2 mW PHSA HS active power Repeater in HS mode, maxi - mum data rate, EQ 0dB, 450mV swing 87 mW USB 2.0 (D+/D-) Input Levels for LS/FS VIH Input High voltage (driven) 2.0 V Maximum Ratings
Electrical Characteristics
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Parameter Description Test Conditions Min. Ty p. Max. Units VIHZ Input High voltage (floating) 2.7 3.6 V VIL Input Low voltage (driven) 0.8 V VDI Differential input sensitivity |(D+)-(D-)| 0.2 V VCM Differential common mode range Includes VDI range 0.8 2.5 V Input Levels for HS VHSSQ HS squelch detection threshold (differential signal amplitude) 100 150 mV VHSDSC HS disconnect detection threshold (differential signal amplitude) 575 mV VHSDIFF HS differential input signal levels Specified by eye pattern templates VHSCM HS data signaling common mode voltage range (guideline for receiver) –50 500 mV Tj_add Differential additive jitter Signal generator source 50 ps Output Levels for LS/FS VOL Output low voltage 0 0.3 V VOH Output high voltage (driven) 2.8 3.6 V VOSE1 SE1 voltage 0.8 V VCRS Output signal crossover voltage 1.3 2.0 V Output Levels for HS VHSOI HS idle level –10 10 mV VHSOH HS data signal high 360 400 440 mV VHSOL HS data signal low –10 10 mV VCHIRPJ Chirp J level (differential) 700 1100 mV VCHIRPK Chirp K level (differential) –900 –500 mV LS/FS Parameters RPU Bus pull-up resistor on up- stream facing port 1.425 1.5 1.575 kΩ RPD Bus pull-down resistor on downstream facing port 14.25 15 15.75 kΩ ZINP Input impedance exclusive of pull-up/pull-down 300 kΩ VTERM Termination voltage for up- stream facing port R PU 3.0 3.6 V HS Parameters VHSTERM Termination voltage in HS –10 10 mV
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Parameter Description Test Conditions Min. Ty p. Max. Units THSR Rise time for HS (10%-90%) 100 ps THSF Fall time for HS (10%-90%) 100 ps ZHSDRV Driver output resistance (also serves as FS termination which with HS capable) 40.5 45 49.5 Ω eUSB2 (eD+/eD-) LS/FS Parameters (VCC = 1.1-1.2V) VIL Input low voltage –0.1 0.35*VCC V VIH Input high voltage 0.65*VCC 1.05*VCC V VHYS Receive single-end hysteresis voltage 0.04*VCC V VOL Output low voltage 0.15*VCC V VOH Output high voltage 0.85*VCC VCC V RSRC_LSFS Transmit output impedance 28 60 Ω HS Parameters VTX_DIF_ TERM Transmit differential voltage (terminated) 165 200 245 mV VTX_CM Transmit common mode 170 200 230 mV RSRC_HS Transmit source termination impedance 32 40 48 Ω ΔRSRC_HS Source impedance mismatch 4 Ω VTX_CM_AC Transmit CM AC (50MHz- 480MHz) 30 +/-mVPK TRISE_FALL _ TRM Transit rise and fall time (20%- 80%) 100 PS ΔTRISE_ FALL_TRM Transit rise/fall mismatch 25 % VRX_CM Receive common mode range 120 200 280 mV CRX_CM Receive center-tapped capaci- tance 15 50 pF VRX_DIF_ SENS Receive sensitivity (peak dif - ferential) 60 +/-mV RRCV_DIF Differential receiver termina - tion (repeater) 72 80 88 Ω VSQUELCH_ DIF Squelch detect threshold volt- age (peak differential) 60 110 mV VCM_RX_AC Receiver AC common mode (50MHz-480MHz) 60 +/-mVPK Tj_add Differential additive jitter Signal generator source 50 ps
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Parameter Description Test Conditions Min. Ty p. Max. Units D+/D- FS Driver Switching Characteristics TFR Rise Time (10%-90%) USB 2.0 specification 4 20 ns TFF Fall Time (10%-90%) USB 2.0 specification 4 20 ns D+/D- LS Driver Switching Characteristics TLR Rise Time (10%-90%) USB 2.0 specification 75 300 ns TLF Fall Time (10%-90%) USB 2.0 specification 75 300 ns eD+/eD- LS/FS Driver Switching Characteristics TFR/TFF Rise/Fall time (10%-90%) eUSB2 specification 2 6 ns TRF_MM Transmit rise/fall mismatch eUSB2 specification 25 % Switching Characteristics Parameter Description Min. Ty p. Max. Units RESET Timing T_VDD18_ RAMP Ramp time for VDD18 to reach min. 1.62V 2 ms T_VDD33_ RAMP Ramp time for VDD33 to reach min. 2.7V 2 ms T_aRTN_B Duration for RST_N to be asserted low to complete reset while powered 10 us T_READY Time for eUSB2 interface to be ready after RST_N is de-asserted or both power suppliers reach minimum recommended voltages, whichever is later 3 ms Timing Requirements
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com Part Marking xO *YW xO: PI3EUSB1100GHE *: Die Rev YW: Date Code (Year&Workweek) Pin 1 location Note: If Die Rev is “0”, then there is no Die Rev character.
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com DATE: 08/31/20 DESCRIPTION: 12-Ball, WLCSP,1.22 x 1.65(X1-WLB1712-12) PACKAGE CODE: GH (GH12) DOCUMENT CONTROL #: PD-2261 REVISION:-- Note: D C B A Ball A1 Index Area TOP VIEW BOTTOM VIEW SIDE VIEW BOTTOMRECOMMEND LAND PATTERN VIEW 2 31 20-0494 12-WLCSP (GH) Packaging Mechanical For latest package info. Please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/ Orderable Part Number Package Code Package Description PI3EUSB1100GHEX GH 12-ball, 1.22 x 1.65mm (WLCSP) X1-WLB1712-12
Ordering Information
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. E = Pb-free and Green 5. X suffix = Tape/Reel
© 2026 Copyright Diodes Incorporated. All Rights Reserved. PI3EUSB1100 Document Number DS45383 Rev 5-3 www.diodes.com IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH RE - GARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MER - CHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. 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